Interface - Drivers, Receivers, Transceivers

Image Part Number Description / PDF Quantity Rfq
BCM6318SD02

BCM6318SD02

Broadcom

6318+6301+43217T

0

BCM84884B0IFSBG

BCM84884B0IFSBG

Broadcom

IC TRANSCEIVER FULL 4/4 484PBGA

0

BCM89501BQLEG

BCM89501BQLEG

Broadcom

7-PORT AUTO SWITCH W/ 5 INTERGRA

0

BCM5695B0KPB

BCM5695B0KPB

Broadcom

12 PORT SCALABLE LAYER 3 GIGAB

0

BCM5464RA1KFBG

BCM5464RA1KFBG

Broadcom

QUAD 1000/100/10BASET GIGABIT

0

BCM8726BIFBG

BCM8726BIFBG

Broadcom

DUAL-CHANNEL 10 GBE SERIAL-TO-XA

0

BCM56311A0IFEB

BCM56311A0IFEB

Broadcom

4 PORT 10 GIGABIT ETHERNET MULTI

0

BCM6332SB01

BCM6332SB01

Broadcom

6332 WITH T&R LINE DRIVER

0

BCM63268SE01

BCM63268SE01

Broadcom

63268D + 4GE PHY

0

BCM6332SA01

BCM6332SA01

Broadcom

6332 WITH 5V LINE DRIVER

0

BCM63281SI01

BCM63281SI01

Broadcom

ENTRY LVL ADSL GW (63281+4313)

0

BCM63281SAR01

BCM63281SAR01

Broadcom

63281T AND 43217 BASED DSL GW

0

BCM5395SIPB

BCM5395SIPB

Broadcom

PORT OF GPHY INTEGRATED

0

BCM6511IPB

BCM6511IPB

Broadcom

MULTI-MODE ADSL2+/VDSL2

0

BCM5358SSC01

BCM5358SSC01

Broadcom

2X2 10/100 SIMULTANEOUS DUAL B

0

BCM6318SB02

BCM6318SB02

Broadcom

6318+6301+43217T

0

BCM63283SJ01

BCM63283SJ01

Broadcom

63283 BASED IAD CHIPSET WITH 4

0

BCM84722AIFSBG

BCM84722AIFSBG

Broadcom

DUAL-CHANNEL 10GBE SFI-TO-XAUI P

0

BCM54880B0IFBG

BCM54880B0IFBG

Broadcom

IC TRANSCEIVER FULL/HALF 1/1

0

BCM63283SE01

BCM63283SE01

Broadcom

63281 BASED IAD WITH 1X1 11N

0

Interface - Drivers, Receivers, Transceivers

1. Overview

Interface drivers, receivers, and transceivers are critical IC components that enable signal transmission between devices in electronic systems. These circuits convert logic signals to appropriate voltage/current levels for reliable communication across different media. They play a vital role in modern electronics by ensuring signal integrity, protocol compatibility, and noise immunity in applications ranging from consumer devices to industrial automation systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Line DriversSignal level translation, impedance matching, differential signalingRS-485/RS-422 communication systems
Logic BuffersSignal amplification, fan-out control, voltage translationDigital circuit interfacing
Differential TransceiversHigh noise immunity, differential signal conversionEthernet (10BASE-T1L), CAN FD
IO-Link TransceiversBi-directional communication, parameter configurationIndustrial sensor networks

3. Structure and Composition

Typical physical structures include TSSOP, SOIC, and QFN packages with 8-64 pins. Key technical components:

  • Input protection circuits (ESD/clamp diodes)
  • Signal conditioning amplifiers
  • Voltage reference generators
  • Differential line drivers with current limiting
  • Receiver hysteresis control circuits
  • Protocol-specific encoding/decoding logic

4. Key Technical Specifications

ParameterImportance
Transmission Rate (Mbps)Determines maximum data throughput capability
Supply Voltage Range (V)Defines compatibility with system power architecture
Propagation Delay (ns)Affects system timing accuracy
Common-Mode Voltage RangeSpecifies noise immunity in industrial environments
ESD Rating (kV)Reliability indicator for harsh operating conditions
Power Consumption (mW)Key factor for battery-powered devices

5. Application Fields

Major application sectors:

  • Industrial Automation: PLCs, motor drives, fieldbuses
  • Automotive: CAN/LIN networks, ADAS sensors
  • Telecommunications: Optical modules, base stations
  • Consumer Electronics: Display interfaces, wearables
  • Aerospace & Defense: Avionics data buses

6. Leading Manufacturers and Products

ManufacturerProduct ExampleKey Features
Texas InstrumentsSN65HVD2303.3V CAN transceiver with 16Mbps rate
NXP SemiconductorsTJA1051High-speed CAN transceiver with partial networking
STMicroelectronicsL9963Battery cell interface IC with SPI communication
Analog DevicesADM2483Isolated RS-485 transceiver with integrated power

7. Selection Guidelines

Key factors for component selection:

  • Protocol compatibility (CAN, RS-485, LVDS, etc.)
  • Environmental requirements (temperature range, ESD protection)
  • Power budget constraints
  • PCB space limitations
  • Signal integrity requirements (jitter, skew)
  • EMI/EMC compliance needs

8. Industry Trends

Current development directions:

  • Increased integration with protocol accelerators
  • Higher data rates (>1Gbps) for 5G and automotive applications
  • Advanced packaging for reduced parasitics
  • Energy-efficient designs for IoT devices
  • Enhanced diagnostics and fault reporting capabilities
  • Optical interface integration for isolation applications
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