Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
TS5USBA224RSWR

TS5USBA224RSWR

Texas Instruments

IC SW USB/AUDIO DPDT 10UQFN

8376

TS3A26746EYZPR

TS3A26746EYZPR

Texas Instruments

TS3A26746E 2 X 2 CROSSPOINT SWIT

3464145

TS3USBCA420IRSVR

TS3USBCA420IRSVR

Texas Instruments

DATA ACQ PLEXERS/SWITCHES

0

TS3L4892RHHR

TS3L4892RHHR

Texas Instruments

IC ETHERNET SWITCH 16X8 36VQFN

336

TS3USB31ERSER

TS3USB31ERSER

Texas Instruments

TS3USB31E HIGH-SPEED USB 2.0 (48

5813

TS3L500AERHUR

TS3L500AERHUR

Texas Instruments

IC ETHERNET SWITCH 16X8 56WQFN

1464

TS3USBCA420IRSVT

TS3USBCA420IRSVT

Texas Instruments

SBU MUX 4TO1 W/ MIC AND GNDIND T

684

TS3L110PWRG4

TS3L110PWRG4

Texas Instruments

IC ETHERNET SWITCH QUAD 16TSSOP

0

TL52055DR

TL52055DR

Texas Instruments

AUDIO/VIDEO SWITCH

27500

TS3USBCA410RSVR

TS3USBCA410RSVR

Texas Instruments

DATA ACQ PLEXERS/SWITCHES

0

HD3SS0001RLLR

HD3SS0001RLLR

Texas Instruments

IC DISPLYPRT DIFF SW 24VQFN

2980

OPA875IDGKTG4

OPA875IDGKTG4

Texas Instruments

IC VIDEO MUX 2:1 8VSSOP

0

TS3L301DGGRG4

TS3L301DGGRG4

Texas Instruments

IC ETHERNET SWITCH 16X8 48TSSOP

0

HD3SS2521RHUR

HD3SS2521RHUR

Texas Instruments

HD3SS2521 DOCKPORT CONTROLLER &

110000

TS3L100PWRG4

TS3L100PWRG4

Texas Instruments

IC ETHERNET SWITCH QUAD 16TSSOP

0

TPS66020YBGR

TPS66020YBGR

Texas Instruments

SOURCE AND SINK POWER MULTIPEXER

2973

SN79519N

SN79519N

Texas Instruments

ANALOG INTERFACE

0

TS3V340DR

TS3V340DR

Texas Instruments

TS3V340 QUAD SPDT HIGH-BANDWIDTH

29987

HD3SS3212RKST

HD3SS3212RKST

Texas Instruments

IC MUX 2:1 8 OHM 20VQFN

11

TS3USB221RSER

TS3USB221RSER

Texas Instruments

IC USB SWITCH DUAL 1X2 10UQFN

0

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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