Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
DS100MB203SQ/NOPB

DS100MB203SQ/NOPB

Texas Instruments

IC MUX 2:1 54WQFN

1780

TS3L301DGGRE4

TS3L301DGGRE4

Texas Instruments

IC ETHERNET SWITCH 16X8 48TSSOP

0

TS5V330DR

TS5V330DR

Texas Instruments

TS5V330 QUAD-SPDT WIDE-BANDWIDTH

64747

HD3SS214IZQER

HD3SS214IZQER

Texas Instruments

IC SWITCH DIFF 2:1 50VFBGA

148

HD3SS3212IRKSR

HD3SS3212IRKSR

Texas Instruments

IC MUX 2:1 8 OHM 20VQFN

32

TS5L100DG4

TS5L100DG4

Texas Instruments

IC ETHERNET SWITCH QUAD 16SOIC

0

TS3L110RGYR

TS3L110RGYR

Texas Instruments

IC ETHERNET SWITCH QUAD 16VQFN

5031

TS5USBC412IYFFT

TS5USBC412IYFFT

Texas Instruments

DATA ACQ PLEXERS/SWITCHES

740

SN080104RSER

SN080104RSER

Texas Instruments

USB SWITCH ICS ORDER

0

DS100MB203SQE/NOPB

DS100MB203SQE/NOPB

Texas Instruments

IC MUX/BUFFER DUAL PORT 54WQFN

1062

TS3L110PWG4

TS3L110PWG4

Texas Instruments

IC ETHERNET SWITCH QUAD 16TSSOP

0

TS3DS10224RUKR

TS3DS10224RUKR

Texas Instruments

TS3DS10224 HIGH-SPEED 2:4 DIFFER

995

LMH6572MQX/NOPB

LMH6572MQX/NOPB

Texas Instruments

IC VIDEO MULTIPLEXER 2X1 16SSOP

0

TS3L100D

TS3L100D

Texas Instruments

SPDT, 4 FUNC, 1 CHANNEL, PDSO16

15440

TS3L110DBQRG4

TS3L110DBQRG4

Texas Instruments

IC ETHERNET SWITCH QUAD 16SSOP

0

TS5V330RGYR

TS5V330RGYR

Texas Instruments

TS5V330 QUAD-SPDT WIDE-BANDWIDTH

15975

TS5L100DBQR

TS5L100DBQR

Texas Instruments

TS5L100 QUAD-SPDT WIDE-BANDWIDTH

10000

TS2PCIE2212ZAHR

TS2PCIE2212ZAHR

Texas Instruments

TS2PCIE2212 4-CHANNEL PCIE 2:1 M

105000

HD3SS214ZQER

HD3SS214ZQER

Texas Instruments

IC SWITCH DIFF 2:1 50VFBGA

6865

TS5USBA43402YZPR

TS5USBA43402YZPR

Texas Instruments

ANALOG CIRCUIT, 1 FUNC, 2 CHANNE

36000

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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