Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
PEX8608-BA50BC G

PEX8608-BA50BC G

Broadcom

PEX8608-BA50BC G

0

SS15-0B00-00

SS15-0B00-00

Broadcom

EXPRESS FABRIC 81-LANE 21-PORT

0

SS17-0B00-00

SS17-0B00-00

Broadcom

EXPRESS FABRIC 49-LANE 13-PORT

0

PEX8747-CA80FBC G

PEX8747-CA80FBC G

Broadcom

PEX8747-CA80FBC G

0

PEX8750-AB80BI G

PEX8750-AB80BI G

Broadcom

PEX8750-AB80BI G

0

SS04-0B00-02

SS04-0B00-02

Broadcom

PEX88064B0-2-DB

0

SS05-0B00-02

SS05-0B00-02

Broadcom

PEX88048B0-2-DB

0

SS07-0B00-00

SS07-0B00-00

Broadcom

PEX88024B0-DB

0

SS02-0B00-02

SS02-0B00-02

Broadcom

PEX88096B0-2-DB

0

SX03-0B00-00

SX03-0B00-00

Broadcom

12GB/S EXPANDERS

0

SS07-0B00-02

SS07-0B00-02

Broadcom

PEX88024B0-2-DB

0

PEX8612-BB50RBC G

PEX8612-BB50RBC G

Broadcom

IC PCI EXPRESS SWITCH 324-FCBGA

559

SS04-0B00-00

SS04-0B00-00

Broadcom

PEX88064B0-DB

0

SX04-0B00-00

SX04-0B00-00

Broadcom

12GB/S EXPANDERS

0

SS20-0B00-00

SS20-0B00-00

Broadcom

EXPRESS FABRIC 12-LANE 5-PORT

0

SS03-0B00-02

SS03-0B00-02

Broadcom

PEX88080B0-2-DB

0

PEX8664-AA50RBC F

PEX8664-AA50RBC F

Broadcom

IC PCI EXPRESS SWITCH 1156FCBGA

0

PEX8648-BB50RBC F

PEX8648-BB50RBC F

Broadcom

IC PCI EXPRESS SWITCH 676FCBGA

0

PEX8603-AB-T RDK

PEX8603-AB-T RDK

Broadcom

IC PCI EXPRESS SWITCH

0

PEX8632-BB50RBC F

PEX8632-BB50RBC F

Broadcom

IC PCI EXPRESS SWITCH 676FCBGA

0

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

RFQ BOM Call Skype Email
Top