Interface - Analog Switches, Multiplexers, Demultiplexers

Image Part Number Description / PDF Quantity Rfq
74HCT4067BQ,115

74HCT4067BQ,115

Nexperia

IC MUX/DEMUX 1X16 24DHVQFN

0

74HCT4852D,112

74HCT4852D,112

Nexperia

IC MUX/DEMUX 8CH SELECT 16SO

0

74HC1G66GW,165

74HC1G66GW,165

Nexperia

IC SWITCH SPST 5TSSOP

0

74LV4052DB,112

74LV4052DB,112

Nexperia

IC MUX/DEMUX DUAL 4X1 16SSOP

0

HEF4051BTS,112

HEF4051BTS,112

Nexperia

IC MUX/DEMUX 8X1 16SSOP

0

74HC4851PW,112

74HC4851PW,112

Nexperia

IC MUX/DEMUX 8X1 16TSSOP

0

74HCT4316DB,118

74HCT4316DB,118

Nexperia

IC SWITCH QUAD 1X1 16SSOP

0

74HCT4852PW,112

74HCT4852PW,112

Nexperia

IC MUX/DEMUX DUAL 4:1 16TSSOP

0

HEF4052BT,013

HEF4052BT,013

Nexperia

IC MUX/DEMUX DUAL 4CH 16SOIC

0

74HCT4316DB,112

74HCT4316DB,112

Nexperia

IC SWITCH QUAD 1X1 16SSOP

0

74LVC2G53GM,125

74LVC2G53GM,125

Nexperia

IC SWITCH SPDT 10 OHM 8XQFN

0

74HCT1G66GW,165

74HCT1G66GW,165

Nexperia

IC SWITCH SPST 5TSSOP

0

74HCT4051BQ115

74HCT4051BQ115

Nexperia

NOW NEXPERIA 74HCT4051BQ SINGLE-

0

Interface - Analog Switches, Multiplexers, Demultiplexers

1. Overview

Analog switches, multiplexers, and demultiplexers are semiconductor devices used to route analog signals in electronic circuits. These ICs enable the controlled connection or disconnection of signal paths, allowing dynamic signal management in applications such as data acquisition systems, communication networks, and industrial automation. Their ability to handle analog signals with minimal distortion and high reliability makes them critical components in modern electronics.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Analog SwitchesSingle/multiple pole-switch configurations, low on-resistance, high off-isolationSignal routing in test equipment
Multiplexers (MUX)Selects one of multiple input signals, bandwidth up to GHz rangeSensor signal aggregation in IoT devices
Demultiplexers (DEMUX)Routes single input to multiple outputs, complementary to MUXData distribution in communication systems

3. Structure and Components

These ICs typically employ CMOS technology with MOSFET-based transmission gates. Key components include control logic circuitry, channel selection decoders, and bidirectional signal paths. Common packages include TSSOP, QFN, and SOIC with pin counts ranging from 8 to 100+ for high-channel-density devices. Internal structures incorporate ESD protection diodes and charge pump circuits for rail-to-rail operation.

4. Key Technical Specifications

ParameterDescriptionImportance
On-Resistance (RON)Resistance when switch is closed (typical 0.1-100 )Affects signal integrity and power loss
Off-Leakage CurrentCurrent flow when switch is open (nA/pA range)Determines isolation performance
BandwidthMaximum signal frequency supported (DC to GHz)Limits high-speed application capability
Channel CountNumber of independent switches (1 to 32 channels)System integration level
Supply VoltageOperating voltage range (1.8V to 40V)Compatibility with system power rails

5. Application Areas

Key industries include:

  • Telecommunications: Base station signal routing
  • Industrial Automation: PLC signal switching
  • Consumer Electronics: Audio/video source selection
  • Medical Devices: Multiparameter patient monitoring
  • Test Equipment: Automatic test system signal matrix

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Specifications
TI (Texas Instruments)TMUXHS421210-channel, 0.8 RON, 1GHz bandwidth
Analog DevicesADG4194-channel SPST, 15V operation
NXP Semiconductors74LVC40518-channel MUX/DEMUX, 32MHz bandwidth
ON SemiconductorNCV845616-channel DEMUX, automotive qualified

7. Selection Guidelines

Key selection criteria:

  • Signal bandwidth vs. RON tradeoff
  • Operating voltage compatibility
  • Package size vs. channel density
  • Logic interface voltage levels
  • Thermal management requirements
Case Study: In a precision data acquisition system, a 16-channel MUX with <1 RON and 10nA leakage current was selected to maintain 16-bit measurement accuracy across 0-10V industrial sensor signals.

8. Industry Trends

Current trends include:

  • Development of sub-1 RON switches for power-sensitive applications
  • Integration of fault protection and diagnostics
  • Expansion of radiation-hardened devices for aerospace
  • Adoption of wafer-level chip-scale packaging (WCSP)
  • Emergence of software-configurable analog routing matrices

RFQ BOM Call Skype Email
Top