Interface - Analog Switches, Multiplexers, Demultiplexers

Image Part Number Description / PDF Quantity Rfq
74LV4066N,112

74LV4066N,112

NXP Semiconductors

IC SWITCH QUAD 1X2 14DIP

0

74HC4066PW/AUJ

74HC4066PW/AUJ

NXP Semiconductors

IC MUX/DEMUX 16CH ANLG 14TSSOP

0

NX3L1G3157GMZ

NX3L1G3157GMZ

NXP Semiconductors

IC SWITCH SPDT 6XSON

0

NX3L4684GM,132

NX3L4684GM,132

NXP Semiconductors

IC ANALOG SWITCH SPDT 10XQFN

0

74HC4052PW/AUJ

74HC4052PW/AUJ

NXP Semiconductors

IC MUX/DEMUX DUAL 4X1 16TSSOP

0

NX3L4051HRZ

NX3L4051HRZ

NXP Semiconductors

IC ANALOG SWITCH 8CH SGL HXQFN16

0

74HCT4353D,112

74HCT4353D,112

NXP Semiconductors

IC MUX/DEMUX TRIPLE 1X2 20SOIC

0

74HC4851PW118

74HC4851PW118

NXP Semiconductors

NOW NEXPERIA 74HC4851PW SINGLE-E

0

NX3L2467HRZ

NX3L2467HRZ

NXP Semiconductors

IC ANALOG SWITCH DPDT HXQFN16U

0

Interface - Analog Switches, Multiplexers, Demultiplexers

1. Overview

Analog switches, multiplexers, and demultiplexers are semiconductor devices used to route analog signals in electronic circuits. These ICs enable the controlled connection or disconnection of signal paths, allowing dynamic signal management in applications such as data acquisition systems, communication networks, and industrial automation. Their ability to handle analog signals with minimal distortion and high reliability makes them critical components in modern electronics.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Analog SwitchesSingle/multiple pole-switch configurations, low on-resistance, high off-isolationSignal routing in test equipment
Multiplexers (MUX)Selects one of multiple input signals, bandwidth up to GHz rangeSensor signal aggregation in IoT devices
Demultiplexers (DEMUX)Routes single input to multiple outputs, complementary to MUXData distribution in communication systems

3. Structure and Components

These ICs typically employ CMOS technology with MOSFET-based transmission gates. Key components include control logic circuitry, channel selection decoders, and bidirectional signal paths. Common packages include TSSOP, QFN, and SOIC with pin counts ranging from 8 to 100+ for high-channel-density devices. Internal structures incorporate ESD protection diodes and charge pump circuits for rail-to-rail operation.

4. Key Technical Specifications

ParameterDescriptionImportance
On-Resistance (RON)Resistance when switch is closed (typical 0.1-100 )Affects signal integrity and power loss
Off-Leakage CurrentCurrent flow when switch is open (nA/pA range)Determines isolation performance
BandwidthMaximum signal frequency supported (DC to GHz)Limits high-speed application capability
Channel CountNumber of independent switches (1 to 32 channels)System integration level
Supply VoltageOperating voltage range (1.8V to 40V)Compatibility with system power rails

5. Application Areas

Key industries include:

  • Telecommunications: Base station signal routing
  • Industrial Automation: PLC signal switching
  • Consumer Electronics: Audio/video source selection
  • Medical Devices: Multiparameter patient monitoring
  • Test Equipment: Automatic test system signal matrix

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Specifications
TI (Texas Instruments)TMUXHS421210-channel, 0.8 RON, 1GHz bandwidth
Analog DevicesADG4194-channel SPST, 15V operation
NXP Semiconductors74LVC40518-channel MUX/DEMUX, 32MHz bandwidth
ON SemiconductorNCV845616-channel DEMUX, automotive qualified

7. Selection Guidelines

Key selection criteria:

  • Signal bandwidth vs. RON tradeoff
  • Operating voltage compatibility
  • Package size vs. channel density
  • Logic interface voltage levels
  • Thermal management requirements
Case Study: In a precision data acquisition system, a 16-channel MUX with <1 RON and 10nA leakage current was selected to maintain 16-bit measurement accuracy across 0-10V industrial sensor signals.

8. Industry Trends

Current trends include:

  • Development of sub-1 RON switches for power-sensitive applications
  • Integration of fault protection and diagnostics
  • Expansion of radiation-hardened devices for aerospace
  • Adoption of wafer-level chip-scale packaging (WCSP)
  • Emergence of software-configurable analog routing matrices

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