Embedded - System On Chip (SoC)

Image	Part Number	Description / PDF	Quantity	Rfq
	M2S025TS-1FG484 Roving Networks / Microchip Technology	IC SOC CORTEX-M3 166MHZ 484FBGA	0
	XCZU6CG-1FFVC900I Xilinx	IC SOC CORTEX-A53 900FCBGA	0
	M2S060T-FGG484I Roving Networks / Microchip Technology	IC SOC CORTEX-M3 166MHZ 484FBGA	0
	M2S060T-1FG484M Roving Networks / Microchip Technology	IC SOC CORTEX-M3 166MHZ 484FBGA	0
	XC7Z020-2CLG484E Xilinx	IC SOC CORTEX-A9 766MHZ 484BGA	0
	XCZU4EV-1SFVC784E Xilinx	IC SOC CORTEX-A53 784FCBGA	0
	M2S090T-1FCS325I Roving Networks / Microchip Technology	IC SOC CORTEX-M3 166MHZ 325BGA	0
	M2S150T-FCVG484I Roving Networks / Microchip Technology	IC SOC CORTEX-M3 166MHZ 484FBGA	0
	XC7Z014S-2CLG400I Xilinx	IC SOC CORTEX-A9 766MHZ 400BGA	0
	M2S025-1VF400 Roving Networks / Microchip Technology	IC SOC CORTEX-M3 166MHZ 400VFBGA	0
	M2S090TS-1FGG484T2 Roving Networks / Microchip Technology	IC SOC CORTEX-M3 166MHZ 484FBGA	0
	XC7Z030-1FB484I Xilinx	IC SOC CORTEX-A9 667MHZ 484FCBGA	0
	10AS066H3F34E2LG Intel	IC SOC CORTEX-A9 1.5GHZ 1152FBGA	0
	XCZU5EG-L2FBVB900E Xilinx	IC SOC CORTEX-A53 900FCBGA	0
	M2S090T-1FGG484M Roving Networks / Microchip Technology	IC SOC CORTEX-M3 166MHZ 484FBGA	0
	M2S150TS-FCS536 Roving Networks / Microchip Technology	IC SOC CORTEX-M3 166MHZ 536BGA	0
	10AS022C3U19I2LG Intel	IC SOC CORTEX-A9 1.5GHZ 484UBGA	0
	XCZU6CG-1FFVB1156I Xilinx	IC SOC CORTEX-A53 1156FCBGA	0
	M2S090TS-1FCS325 Roving Networks / Microchip Technology	IC SOC CORTEX-M3 166MHZ 325BGA	0
	10AS048K4F35E3SG Intel	IC SOC CORTEX-A9 1.5GHZ 1152FBGA	0

Embedded - System On Chip (SoC)

1. Overview

System on Chip (SoC) is a highly integrated semiconductor device that combines multiple electronic system components into a single chip. It typically integrates processors (CPU/GPU/DSP), memory, input/output interfaces, and specialized accelerators. SoCs serve as the core processing units for embedded systems, enabling compact, power-efficient, and cost-effective solutions. Their importance spans modern technology domains including mobile computing, IoT, automotive electronics, and AI edge computing.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Application Processors	High-performance multi-core CPUs, integrated GPUs, multimedia codecs	Smartphones, tablets, smart TVs
Microcontroller SoCs	Single-chip computers with flash memory, ADC/DAC, communication interfaces	Industrial control, sensor nodes, home appliances
FPGA-based SoCs	Programmable logic fabric with hard processor cores	5G base stations, autonomous driving systems
AI Accelerator SoCs	Dedicated NPU units for machine learning inference	Smart cameras, robotics, edge AI devices

3. Structure and Components

Typical SoC architecture includes:

Processing cores (ARM Cortex-A series, RISC-V, etc.)
Memory subsystems (cache, on-chip SRAM, external DRAM controllers)
Communication interfaces (USB, PCIe, Ethernet, wireless modules)
Specialized accelerators (GPU, DSP, VPU, cryptographic engines)
System bus matrix for component interconnection
Power management units for dynamic voltage/frequency scaling

4. Key Technical Specifications

Parameter	Description	Importance
Process Node	Manufacturing process (e.g., 5nm, 7nm)	Impacts power efficiency and performance density
CPU Architecture	Core count and ISA (ARM/x86/RISC-V)	Determines computational capability and software compatibility
Thermal Design Power (TDP)	Maximum heat dissipation rating	Dictates cooling requirements and battery life
Memory Bandwidth	Data transfer rate between cores and memory	Critical for performance-critical applications
Interface Speed	PCIe 5.0, USB4, etc.	Determines peripheral connectivity capability

5. Application Fields

Key application domains include:

Consumer Electronics: Smartphones (Apple A15 Bionic), AR/VR headsets
Automotive: ADAS systems (NVIDIA DRIVE SoC), vehicle infotainment
Industrial: Smart manufacturing sensors, robotic controllers
Healthcare: Wearable ECG monitors, portable ultrasound devices
Networking: 5G base stations (Qualcomm FSM1000), network switches

6. Leading Manufacturers and Products

Manufacturer	Representative Products	Key Features
Qualcomm	8 Gen 2	Adreno 750 GPU, Hexagon AI accelerator
Apple	M2 SoC	12-core CPU, 19-core GPU, unified memory architecture
Xilinx	Zynq UltraScale+ MPSoC	Quad-core ARM Cortex-A53 with FPGA fabric
MediaTek	Dimensity 9200	12nm process, integrated 5G modem
NVIDIA	Jets 32NX	2384-core Volta GPU for edge AI computing

7. Selection Guidelines

Key selection criteria:

Performance requirements vs. power budget
Required peripheral interfaces and I/O capabilities
Software ecosystem maturity (OS support, development tools)
Long-term supply stability for industrial applications
Security features (hardware encryption, trusted execution)
Cost-effectiveness for target application volume

8. Industry Trends Analysis

Key development trends:

Transition to sub-5nm process nodes for improved energy efficiency
Increasing integration of AI/ML accelerators in mainstream SoCs
Adoption of heterogeneous computing architectures (CPU+GPU+DSA)
Advancements in chiplet-based SoC design for modular scalability
Enhanced functional safety features for automotive and industrial applications
Growing emphasis on hardware-based security mechanisms

The global SoC market is projected to reach $150 billion by 2027, driven by demand in IoT edge devices and automotive electrification.