Embedded - PLDs (Programmable Logic Device)

Part Number	Description / PDF	Quantity
TIBPAL16R4-15MJB Texas Instruments	OT PLD, 15NS, PAL-TYPE, TTL, CDI	503
TIBPAL16R6-10CFN Texas Instruments	ELECTRICALLY ERASABLE PAL DEVICE	751
TIBPAL16R8-30MWB Texas Instruments	TIBPAL16R8-30M LOW-POWER HIGH-PE	77
5962-8515508RA Texas Instruments	TIBPAL16R4-30M LOW-POWER HIGH-PE	43
TIBPAL20R6-15CNT Texas Instruments	OT PLD, 18NS, PAL-TYPE, TTL	1152
TIBPAL22V10-10CFN Texas Instruments	OT PLD, 11NS, PAL-TYPE, TTL	4475
TIBPAL16L8-12MJB Texas Instruments	ELECTRICALLY ERASABLE PAL DEVICE	16
TIBPALT19R4CNT Texas Instruments	OT PLD, 25NS, PAL-TYPE	171
TIBPAL16R8-20MJ Texas Instruments	ELECTRICALLY ERASABLE PAL DEVICE	816
TIBPAL20L8-15CNL Texas Instruments	OT PLD, 18NS, PAL-TYPE, TTL	4218
JM38510/50401BRA Texas Instruments	OT PLD, 30NS, TTL, CDIP20	733
TIBPAL16R4-10MJB Texas Instruments	ELECTRICALLY ERASABLE PAL DEVICE	138
TIBPAL20R4-10CFN Texas Instruments	OT PLD, 10NS, PAL-TYPE, TTL,	407
5962-8515509SA Texas Instruments	OT PLD, 15NS, PAL-TYPE, TTL	2
TIBPAL20R8-15CFN Texas Instruments	OT PLD, 15NS, PAL-TYPE, TTL	5095
TICPAL22V10Z-25CNT Texas Instruments	OT PLD, 25NS, PAL-TYPE, CMOS	0
JM38510/50502BLA Texas Instruments	TIBPAL20R8-20M HIGH-PERFORMANCE	5
TIBPAL16R4-15CFN Texas Instruments	ELECTRICALLY ERASABLE PAL DEVICE	777
8103607RA Texas Instruments	PAL16L8AM STANDARD HIGH-SPEED PA	0
TIBPAL20L8-5CFN Texas Instruments	OT PLD, 7NS, PAL-TYPE, TTL	2693

Embedded - PLDs (Programmable Logic Device)

1. Overview

Programmable Logic Devices (PLDs) are semiconductor devices that can be configured by users to perform specific logic functions. Unlike fixed-function logic devices, PLDs offer reprogrammable capabilities, enabling dynamic adaptation to changing design requirements. In embedded systems, PLDs serve as critical components for implementing custom logic, interface bridging, and real-time processing. Their flexibility supports rapid prototyping and reduces time-to-market in applications ranging from consumer electronics to aerospace systems.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
FPGA (Field-Programmable Gate Array)	High logic density, reconfigurable architecture, supports complex parallel processing	5G base stations, AI accelerators, medical imaging systems
CPLD (Complex PLD)	Non-volatile memory, deterministic timing, lower logic density than FPGAs	Automotive ECUs, industrial motor controllers
PAL/GAL (Programmable Array Logic/General Array Logic)	One-time programmable (OTP) or reprogrammable, simple logic implementation	Legacy system upgrades, low-cost IoT sensors
SoC PLD	Integrated processor cores with programmable logic	Smart cameras, edge computing devices

3. Structure and Composition

PLDs typically consist of three core elements: (1) Configurable Logic Blocks (CLBs) containing lookup tables (LUTs) and flip-flops for implementing Boolean functions; (2) Programmable interconnect resources enabling flexible signal routing; (3) Input/Output Blocks (IOBs) providing interface compatibility with external circuits. Advanced devices may integrate DSP slices, memory blocks, or hard processor cores. Physical packaging ranges from QFP (Quad Flat Package) for low-pin-count devices to high-density BGA (Ball Grid Array) packages for FPGAs.

4. Key Technical Specifications

Parameter	Description	Importance
Logic Cell Count	Total number of programmable logic units	Determines implementation complexity
Maximum Operating Frequency	Up to 1 GHz in advanced FPGAs	Defines processing speed capability
Power Consumption	Measured in mW/MHz	Critical for battery-powered devices
Voltage Requirements	Typically 1.0V-3.3V	Impacts system power design
Package Type	BGA, QFN, TQFP	Affects PCB layout and thermal management
Temperature Range	-40 C to +125 C (industrial grade)	Determines operational environment suitability

5. Application Areas

Telecommunications: 5G NR signal processing, network packet switching
Automotive: ADAS sensor fusion, vehicle network gateways
Industrial: CNC machine control, industrial Ethernet protocols
Consumer: Display timing controllers, wearable device interfaces
Aerospace: Flight control systems, radiation-hardened avionics

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Xilinx (AMD)	XCVU9P FPGA	2.5M logic cells, 58Gbps transceivers
Intel	Stratix 10 MX	1.9M logic elements, 4GB HBM2 memory
Microchip	SmartFusion2	150K logic cells, ARM Cortex-M3 processor
Lattice Semiconductor	LatticeECP5	103K LUTs, 1.5W power consumption

7. Selection Guidelines

Evaluate required logic density and I/O count
Compare power efficiency metrics (mW/GHz)
Assess toolchain capabilities (HDL support, simulation tools)
Consider temperature and reliability requirements
Verify long-term supply stability for mass production

Industry Trend Analysis

The PLD market is evolving toward heterogeneous integration, combining FPGA fabric with AI acceleration engines and high-bandwidth memory. Emerging trends include: (1) 3D IC stacking for improved performance/watt ratios; (2) RISC-V processor integration in FPGA SoCs; (3) AI-optimized compute-in-memory architectures; (4) Enhanced security features like hardware-based root of trust. The global PLD market is projected to grow at 9.2% CAGR through 2027, driven by demand in automotive ADAS and 5G infrastructure.