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Embedded - PLDs (Programmable Logic Device)

Image Part Number Description / PDF Quantity Rfq
EPF10K100BFC256-1

EPF10K100BFC256-1

Altera (Intel)

LOADABLE PLD, 11NS PBGA256

878
EPX780QC132-15Z

EPX780QC132-15Z

Altera (Intel)

OT PLD, 18NS, CMOS, PQFP132

104
EPF6024AFC256-2AA

EPF6024AFC256-2AA

Altera (Intel)

FPGA FLEX 6000 FAMILY 24K GATES

81
EPF10K250ABC600-2

EPF10K250ABC600-2

Altera (Intel)

LOADABLE PLD, 0.6NS PBGA600

48
EP900PC-2

EP900PC-2

Altera (Intel)

OT PLD, 45NS, PAL-TYPE PDIP40

1846
EP22V10PC-10

EP22V10PC-10

Altera (Intel)

OT PLD, 10NS, PAL-TYPE

21593
EP20K30EFC324-1

EP20K30EFC324-1

Altera (Intel)

LOADABLE PLD, 1.91NS PBGA324

72
EPS464QC-20

EPS464QC-20

Altera (Intel)

OT PLD, 20NS, CMOS, PQFP44

1140
EP20K600CF33C7

EP20K600CF33C7

Altera (Intel)

LOADABLE PLD, 1.48NS, PBGA1020

46
EP20K200CQ208C9

EP20K200CQ208C9

Altera (Intel)

LOADABLE PLD, 2NS, CMOS, PQFP208

3
EP20K100BC356-1V

EP20K100BC356-1V

Altera (Intel)

LOADABLE PLD, 2.5NS PBGA356

4
EP22V10LC-15

EP22V10LC-15

Altera (Intel)

OT PLD, 15NS, PAL-TYPE PQCC28

6672
EP224PC-12

EP224PC-12

Altera (Intel)

OT PLD, 12NS, PAL-TYPE

14406
EP20K100FC324-2V

EP20K100FC324-2V

Altera (Intel)

LOADABLE PLD, 3NS, CMOS, PBGA324

0
EPF10K250AGC599-1

EPF10K250AGC599-1

Altera (Intel)

LOADABLE PLD, 0.5NS CPGA599

11
EPF10K130VGC599-3

EPF10K130VGC599-3

Altera (Intel)

LOADABLE PLD, 0.7NS CPGA599

1647
EPF10K200EGC599-1

EPF10K200EGC599-1

Altera (Intel)

LOADABLE PLD, 0.4NS CPGA599

123
EPF20K400GC655-1

EPF20K400GC655-1

Altera (Intel)

LOADABLE PLD, 2.5NS CPGA655

158
EPM570ZF256C7N

EPM570ZF256C7N

Altera (Intel)

MAX II FLASH PLD, 15.1NS, 440-CE

1145
EPS464LI-25

EPS464LI-25

Altera (Intel)

OT PLD, 20NS PQCC28

17

Embedded - PLDs (Programmable Logic Device)

1. Overview

Programmable Logic Devices (PLDs) are semiconductor devices that can be configured by users to perform specific logic functions. Unlike fixed-function logic devices, PLDs offer reprogrammable capabilities, enabling dynamic adaptation to changing design requirements. In embedded systems, PLDs serve as critical components for implementing custom logic, interface bridging, and real-time processing. Their flexibility supports rapid prototyping and reduces time-to-market in applications ranging from consumer electronics to aerospace systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
FPGA (Field-Programmable Gate Array)High logic density, reconfigurable architecture, supports complex parallel processing5G base stations, AI accelerators, medical imaging systems
CPLD (Complex PLD)Non-volatile memory, deterministic timing, lower logic density than FPGAsAutomotive ECUs, industrial motor controllers
PAL/GAL (Programmable Array Logic/General Array Logic)One-time programmable (OTP) or reprogrammable, simple logic implementationLegacy system upgrades, low-cost IoT sensors
SoC PLDIntegrated processor cores with programmable logicSmart cameras, edge computing devices

3. Structure and Composition

PLDs typically consist of three core elements: (1) Configurable Logic Blocks (CLBs) containing lookup tables (LUTs) and flip-flops for implementing Boolean functions; (2) Programmable interconnect resources enabling flexible signal routing; (3) Input/Output Blocks (IOBs) providing interface compatibility with external circuits. Advanced devices may integrate DSP slices, memory blocks, or hard processor cores. Physical packaging ranges from QFP (Quad Flat Package) for low-pin-count devices to high-density BGA (Ball Grid Array) packages for FPGAs.

4. Key Technical Specifications

ParameterDescriptionImportance
Logic Cell CountTotal number of programmable logic unitsDetermines implementation complexity
Maximum Operating FrequencyUp to 1 GHz in advanced FPGAsDefines processing speed capability
Power ConsumptionMeasured in mW/MHzCritical for battery-powered devices
Voltage RequirementsTypically 1.0V-3.3VImpacts system power design
Package TypeBGA, QFN, TQFPAffects PCB layout and thermal management
Temperature Range-40 C to +125 C (industrial grade)Determines operational environment suitability

5. Application Areas

  • Telecommunications: 5G NR signal processing, network packet switching
  • Automotive: ADAS sensor fusion, vehicle network gateways
  • Industrial: CNC machine control, industrial Ethernet protocols
  • Consumer: Display timing controllers, wearable device interfaces
  • Aerospace: Flight control systems, radiation-hardened avionics

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Specifications
Xilinx (AMD)XCVU9P FPGA2.5M logic cells, 58Gbps transceivers
IntelStratix 10 MX1.9M logic elements, 4GB HBM2 memory
MicrochipSmartFusion2150K logic cells, ARM Cortex-M3 processor
Lattice SemiconductorLatticeECP5103K LUTs, 1.5W power consumption

7. Selection Guidelines

  1. Evaluate required logic density and I/O count
  2. Compare power efficiency metrics (mW/GHz)
  3. Assess toolchain capabilities (HDL support, simulation tools)
  4. Consider temperature and reliability requirements
  5. Verify long-term supply stability for mass production

Industry Trend Analysis

The PLD market is evolving toward heterogeneous integration, combining FPGA fabric with AI acceleration engines and high-bandwidth memory. Emerging trends include: (1) 3D IC stacking for improved performance/watt ratios; (2) RISC-V processor integration in FPGA SoCs; (3) AI-optimized compute-in-memory architectures; (4) Enhanced security features like hardware-based root of trust. The global PLD market is projected to grow at 9.2% CAGR through 2027, driven by demand in automotive ADAS and 5G infrastructure.

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