| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
IR (Infineon Technologies) |
FLASH PLD, 15NS, PAL-TYPE, CMOS |
0 |
|
 |
IR (Infineon Technologies) |
VINAX 1-CHANNEL 30MHZ LD |
5850 |
|
Programmable Logic Devices (PLDs) are semiconductor devices that can be configured by users to perform specific logic functions. Unlike fixed-function logic devices, PLDs offer reprogrammable capabilities, enabling dynamic adaptation to changing design requirements. In embedded systems, PLDs serve as critical components for implementing custom logic, interface bridging, and real-time processing. Their flexibility supports rapid prototyping and reduces time-to-market in applications ranging from consumer electronics to aerospace systems.
| Type | Functional Features | Application Examples |
|---|---|---|
| FPGA (Field-Programmable Gate Array) | High logic density, reconfigurable architecture, supports complex parallel processing | 5G base stations, AI accelerators, medical imaging systems |
| CPLD (Complex PLD) | Non-volatile memory, deterministic timing, lower logic density than FPGAs | Automotive ECUs, industrial motor controllers |
| PAL/GAL (Programmable Array Logic/General Array Logic) | One-time programmable (OTP) or reprogrammable, simple logic implementation | Legacy system upgrades, low-cost IoT sensors |
| SoC PLD | Integrated processor cores with programmable logic | Smart cameras, edge computing devices |
PLDs typically consist of three core elements: (1) Configurable Logic Blocks (CLBs) containing lookup tables (LUTs) and flip-flops for implementing Boolean functions; (2) Programmable interconnect resources enabling flexible signal routing; (3) Input/Output Blocks (IOBs) providing interface compatibility with external circuits. Advanced devices may integrate DSP slices, memory blocks, or hard processor cores. Physical packaging ranges from QFP (Quad Flat Package) for low-pin-count devices to high-density BGA (Ball Grid Array) packages for FPGAs.
| Parameter | Description | Importance |
|---|---|---|
| Logic Cell Count | Total number of programmable logic units | Determines implementation complexity |
| Maximum Operating Frequency | Up to 1 GHz in advanced FPGAs | Defines processing speed capability |
| Power Consumption | Measured in mW/MHz | Critical for battery-powered devices |
| Voltage Requirements | Typically 1.0V-3.3V | Impacts system power design |
| Package Type | BGA, QFN, TQFP | Affects PCB layout and thermal management |
| Temperature Range | -40 C to +125 C (industrial grade) | Determines operational environment suitability |
| Manufacturer | Representative Product | Key Specifications |
|---|---|---|
| Xilinx (AMD) | XCVU9P FPGA | 2.5M logic cells, 58Gbps transceivers |
| Intel | Stratix 10 MX | 1.9M logic elements, 4GB HBM2 memory |
| Microchip | SmartFusion2 | 150K logic cells, ARM Cortex-M3 processor |
| Lattice Semiconductor | LatticeECP5 | 103K LUTs, 1.5W power consumption |
The PLD market is evolving toward heterogeneous integration, combining FPGA fabric with AI acceleration engines and high-bandwidth memory. Emerging trends include: (1) 3D IC stacking for improved performance/watt ratios; (2) RISC-V processor integration in FPGA SoCs; (3) AI-optimized compute-in-memory architectures; (4) Enhanced security features like hardware-based root of trust. The global PLD market is projected to grow at 9.2% CAGR through 2027, driven by demand in automotive ADAS and 5G infrastructure.