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Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MIMX8MN5DVTJZAA

MIMX8MN5DVTJZAA

NXP Semiconductors

8M NANO 815S 14X14FCBGA

752
MCIMX6Q6AVT08AC

MCIMX6Q6AVT08AC

NXP Semiconductors

I.MX 6 SERIES 32 BIT MPU, QUAD A

0
MPC8360CVVAGDGA

MPC8360CVVAGDGA

NXP Semiconductors

IC MPU MPC83XX 400MHZ 740TBGA

0
MCIMX6G0DVM05AB

MCIMX6G0DVM05AB

NXP Semiconductors

I.MX 32-BIT MPU, ARM CORTEX-A7 C

414
MCIMX6DP4AVT1AB

MCIMX6DP4AVT1AB

NXP Semiconductors

IC MPU I.MX6DP ENHAN 624FCBGA

0
MPC8358ECVRAGDGA

MPC8358ECVRAGDGA

NXP Semiconductors

POWERQUICC II PRO PROCESSOR WITH

3
P2010NXN2KHC

P2010NXN2KHC

NXP Semiconductors

IC MPU Q OR IQ 1.2GHZ 689TEBGA

0
MCIMX6G3CVM05AB

MCIMX6G3CVM05AB

NXP Semiconductors

IC MPU I.MX6UL 289BGA

170
P1010NSE5DFA

P1010NSE5DFA

NXP Semiconductors

IC MPU Q OR IQ 1.0GHZ 425TEBGA

0
LS1026AXE8P1A

LS1026AXE8P1A

NXP Semiconductors

QORIQ LAYERSCAPE 2XA72 64BIT ARM

0
MCIMX6L2EVN10ACR

MCIMX6L2EVN10ACR

NXP Semiconductors

I.MX 6SL ROM PERF ENHAN

0
LS1043AXE8QQB

LS1043AXE8QQB

NXP Semiconductors

QORIQ 4XCPU 64-BIT ARM ARCH 1.

40
P4080NSN7PNC

P4080NSN7PNC

NXP Semiconductors

IC MPU Q OR IQ 1.5GHZ 1295FCBGA

0
MPC8343ZQADDB

MPC8343ZQADDB

NXP Semiconductors

IC MPU MPC83XX 266MHZ 620BGA

0
MC7447AVU1000NB

MC7447AVU1000NB

NXP Semiconductors

IC MPU MPC74XX 1.0GHZ 360FCCBGA

12
MCIMX286CVM4BR2

MCIMX286CVM4BR2

NXP Semiconductors

IC MPU I.MX28 454MHZ 289MAPBGA

0
MPC8250AZUPIBC557

MPC8250AZUPIBC557

NXP Semiconductors

POWERQUICC II RISC MPU 32-BIT

0
T1040NSN7MQB

T1040NSN7MQB

NXP Semiconductors

IC SOC 4CORE 1200MHZ SW 780FCBGA

0
P1015NSN5DFB

P1015NSN5DFB

NXP Semiconductors

IC MPU Q OR IQ 667MHZ 561TEBGA1

38
MPC860DTCVR66D4

MPC860DTCVR66D4

NXP Semiconductors

IC MPU MPC8XX 66MHZ 357BGA

0

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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