Embedded - Microprocessors

Part Number	Description / PDF	Quantity
Z8018006FSC00TR Zilog / Littelfuse	IC MPU Z180 6MHZ 80QFP	0
Z8L18220AEG Zilog / Littelfuse	IC MPU ZIP 20MHZ 100VQFP	0
Z8018216ASG Zilog / Littelfuse	IC MPU ZIP 16MHZ 100VQFP	0
Z8S18020FSG Zilog / Littelfuse	IC MPU Z180 20MHZ 80QFP	936
Z8018233FSC00TR Zilog / Littelfuse	IC MPU ZIP 33MHZ 100QFP	0
Z8018008FSC00TR Zilog / Littelfuse	IC MPU Z180 8MHZ 80QFP	0
Z84C0008PEG Zilog / Littelfuse	IC MPU Z80 8MHZ 40DIP	672
Z8018216FSC00TR Zilog / Littelfuse	IC MPU ZIP 16MHZ 100QFP	0
Z8019520FSC00TR Zilog / Littelfuse	IC MPU Z180 20MHZ 100QFP	0
Z84C1506FEC00TR Zilog / Littelfuse	IC MPU Z80 6MHZ 100QFP	0
Z8018006VSG Zilog / Littelfuse	IC MPU Z180 6MHZ 68PLCC	53
Z84C0010VEG Zilog / Littelfuse	IC MPU Z80 10MHZ 44PLCC	162
Z0843004VSC Zilog / Littelfuse	PROGRAMMABLE TIMER	0
Z8L18020FSG Zilog / Littelfuse	IC MPU Z180 20MHZ 80QFP	0
Z8018216ASC1838 Zilog / Littelfuse	IC MPU ZIP 16MHZ 100VQFP	0
Z8S18010VSG Zilog / Littelfuse	IC MPU Z180 10MHZ 68PLCC	154
Z84C0020PEG Zilog / Littelfuse	IC MPU Z80 20MHZ 40DIP	0
Z8S18033VSC00TR Zilog / Littelfuse	IC MPU Z180 33MHZ 68PLCC	0
Z8L18020PSG Zilog / Littelfuse	IC MPU Z180 20MHZ 64DIP	0
Z0842006VSC Zilog / Littelfuse	PARALLEL I/O PORT, 16 I/O, NMOS	474

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
ARM Cortex-M Series	Low-power 32-bit cores with real-time capabilities, optional DSP extensions	Smart sensors, wearables, motor control
PowerPC	High reliability, floating-point units, automotive/Aerospace focused	Vehicle ECUs, avionics systems
MIPS	Efficient pipelining, 32/64-bit variants for multimedia processing	Networking equipment, set-top boxes
RISC-V	Open instruction set, modular architecture for customization	AI accelerators, edge computing devices
x86 (Embedded)	PC compatibility, high processing power with integrated GPUs	Industrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

Parameter	Description	Importance
Clock Frequency	Operating speed (10MHz-6GHz)	Determines processing throughput
Instruction Set	RISC vs CISC architecture	Affects code density and power consumption
TDP (Thermal Design Power)	Power consumption under load (100mW-50W)	Dictates thermal management requirements
Process Node	Manufacturing technology (28nm-5nm)	Impacts performance and energy efficiency
Memory Bandwidth	Data transfer rate between core and memory	Limits performance in data-intensive tasks

5. Application Domains

Consumer Electronics: Smartphones (application processors), home appliances
Automotive: ADAS controllers, engine management systems
Industrial: PLCs (Programmable Logic Controllers), robotics
Healthcare: MRI scanners, portable diagnostic devices
Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
ARM Holdings	Cortex-A78	128-bit NEON engine, 4nm process, 3.0GHz
Intel	Atom x6425E	Quad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductors	i.MX 8M Plus	1.8GHz Cortex-A53, NPU for ML acceleration
Microchip	SAM9X60	32-bit ARM926EJ-S, 120MHz, ECC memory support
Qualcomm	QCS610	Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
Real-time constraints (deterministic latency for motor control applications)
Peripheral integration (CAN FD for automotive networks)
Software ecosystem (RTOS support, middleware availability)
Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

AI integration: On-chip neural processing units (NPUs) for edge ML inference
Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
Functional safety: ISO 26262 compliance for autonomous vehicle systems
Open ecosystems: Growth of RISC-V adoption in custom ASIC designs