Embedded - FPGAs (Field Programmable Gate Array) with Microcontrollers

Image Part Number Description / PDF Quantity Rfq
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EPXA1F672C2ES

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Intel

IC EXCALIBUR ARM 672FBGA

0

EPXA4F1020C1ES

EPXA4F1020C1ES

Intel

IC EXCALIBUR ARM 1020FBGA

0

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Intel

IC EXCALIBUR ARM 672FBGA

0

EPXA10F1020C2ES

EPXA10F1020C2ES

Intel

IC EXCALIBUR ARM 1020FBGA

0

EPXA1F484C3

EPXA1F484C3

Intel

IC EXCALIBUR ARM 484FBGA

0

EPXA4F672C1ES

EPXA4F672C1ES

Intel

IC EXCALIBUR ARM 672FBGA

0

EPXA4F672C2ES

EPXA4F672C2ES

Intel

IC EXCALIBUR ARM 672FBGA

0

EPXA1F484C1

EPXA1F484C1

Intel

IC EXCALIBUR ARM 484FBGA

0

Embedded - FPGAs (Field Programmable Gate Array) with Microcontrollers

1. Overview

Embedded Field Programmable Gate Arrays (FPGAs) with microcontrollers represent a hybrid architecture combining programmable logic fabric with hard processor cores. This integration enables parallel processing capabilities of FPGAs with the sequential processing efficiency of microcontrollers. Modern devices often implement ARM Cortex-A/R series cores alongside programmable logic, creating System-on-Chip (SoC) solutions. These ICs are critical in applications requiring real-time processing, hardware acceleration, and flexible I/O interfacing, such as industrial automation, automotive systems, and communication infrastructure.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
SoC FPGAIntegrated ARM Cortex-A/R cores with programmable logic, advanced memory controllersIndustrial IoT gateways, medical imaging systems
Microcontroller-Embedded FPGALow-power microcontroller with small FPGA fabric for custom peripheralsSmart sensors, edge AI devices
AI-Optimized FPGA+MCUDSP blocks with ML accelerator cores, PCIe/NVMe interfacesAutonomous vehicle perception systems

3. Structure & Composition

Typical architecture includes:

  • Programmable Logic Blocks: Logic cells (LUTs, FFs), DSP slices, block RAM
  • Processing System: Hard ARM cores (Cortex-A53/A72/R5), cache hierarchy, MMU
  • Interconnect: High-bandwidth AXI buses, NoC (Network-on-Chip) fabric
  • Memory Interfaces: DDR4/DDR5 SDRAM, HBM2e controllers
  • Peripherals: Gigabit Ethernet, USB 3.0, CAN FD, PCIe Gen4
  • Security: Hardware encryption engines (AES-256, SHA-256), secure boot

4. Key Technical Specifications

ParameterImportance
Logic Density (LUTs): 100K-4MDetermines complexity of implementable functions
Max Clock Frequency: 100MHz-1.5GHzImpacts processing speed and latency
Power Consumption: 0.5-25WCrucial for battery-powered/thermal-constrained devices
Memory Bandwidth: 12.8-102GB/sLimits data-intensive application performance
Interface Speed: 1-64Gbps transceiversEnables high-speed communication protocols

5. Application Fields

Major industries:

  • Industrial Automation: Machine vision systems, CNC controllers
  • Automotive: ADAS sensor fusion units, V2X communication modules
  • Medical: MRI image processing systems, portable diagnostics
  • Telecom: 5G massive MIMO beamforming units
  • Aerospace: Avionics control systems with redundancy

6. Leading Vendors & Products

VendorProduct SeriesKey Features
Xilinx (AMD)Zynq UltraScale+ MPSoCQuad Cortex-A53 + GPU + H.264/265 codec
IntelStratix 10 SX4x ARM Cortex-A53 + 28Gbps transceivers
MicrochipPolarFire SoCRISC-V based Mi-V ecosystem + deterministic latency
LatticeAvant FPGAEmbedded L2 cache RAM + ML-Accel IP core

7. Selection Recommendations

Key factors to consider:

  • Processing Requirements: Match core performance with algorithm complexity
  • Power Budget: Evaluate thermal dissipation requirements
  • I/O Needs: Verify interface compatibility with peripheral devices
  • Development Tools: Assess ecosystem maturity (Vivado, Quartus, etc.)
  • Longevity: Check product lifecycle status for industrial applications

Industry Trend Analysis

Future development directions include:

  • AI/ML Integration: On-chip neural network accelerators with INT8/BF16 support
  • Heterogeneous Computing: Combining RISC-V/GPU/FPGA in single die
  • Quantum-Resistant Security: Post-quantum cryptography implementation
  • SiP Integration: System-in-Package solutions with 3D-stacked memory
  • Open-Source Ecosystems: Growth of RISC-V based FPGA platforms

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