Embedded - FPGAs (Field Programmable Gate Array) with Microcontrollers

Image Part Number Description / PDF Quantity Rfq
EPXA4F672C2

EPXA4F672C2

Intel

IC EXCALIBUR ARM 672FBGA

0

AT94K05AL-25AQU

AT94K05AL-25AQU

Roving Networks / Microchip Technology

IC FPSLIC 5K GATE 25MHZ 100-TQFP

0

EPXA4F1020C2

EPXA4F1020C2

Altera (Intel)

LOADABLE PLD, PBGA1020

64

AT94K40AL-25DQU

AT94K40AL-25DQU

Atmel (Microchip Technology)

FPGA, 2304 CLBS, 40000 GATES, 18

8

AT94S05AL-25BQU

AT94S05AL-25BQU

Roving Networks / Microchip Technology

IC FPSLIC 5K GATE 25MHZ 144LQFP

0

AT94S10AL-25BQU

AT94S10AL-25BQU

Roving Networks / Microchip Technology

IC FPSLIC 10K GATE 25MHZ 144LQFP

0

AT94S40AL-25DGJ

AT94S40AL-25DGJ

Roving Networks / Microchip Technology

IC FPSLIC 40KGATE 25MHZ 256CABGA

90

EPXA10F1020C1

EPXA10F1020C1

Altera (Intel)

LOADABLE PLD, PBGA1020

23

EPXA10F1020C3

EPXA10F1020C3

Altera (Intel)

LOADABLE PLD, PBGA1020

47

AT94K10AL-25DQU

AT94K10AL-25DQU

Atmel (Microchip Technology)

FPGA, 576 CLBS, 10000 GATES, 25M

270

EPXA4F672C1

EPXA4F672C1

Intel

IC EXCALIBUR ARM 672FBGA

0

EPXA4F672I2

EPXA4F672I2

Intel

IC EXCALIBUR ARM 672FBGA

0

EPXA1F672C3

EPXA1F672C3

Altera (Intel)

LOADABLE PLD, PBGA672

90

AT94K05AL-25BQU

AT94K05AL-25BQU

Roving Networks / Microchip Technology

IC FPSLIC 5K GATE 25MHZ 144LQFP

0

EPXA1F672C2

EPXA1F672C2

Altera (Intel)

LOADABLE PLD, PBGA672

10

EPXA4F672C3

EPXA4F672C3

Intel

IC EXCALIBUR ARM 672FBGA

0

AT94K10AL-25BQU

AT94K10AL-25BQU

Roving Networks / Microchip Technology

IC FPSLIC 10K GATE 25MHZ 144LQFP

0

EPXA4F1020C1

EPXA4F1020C1

Altera (Intel)

LOADABLE PLD, PBGA1020

14

EPXA1F672C1

EPXA1F672C1

Altera (Intel)

LOADABLE PLD, PBGA672

178

EPXA1F484C2

EPXA1F484C2

Altera (Intel)

LOADABLE PLD, PBGA484

15

Embedded - FPGAs (Field Programmable Gate Array) with Microcontrollers

1. Overview

Embedded Field Programmable Gate Arrays (FPGAs) with microcontrollers represent a hybrid architecture combining programmable logic fabric with hard processor cores. This integration enables parallel processing capabilities of FPGAs with the sequential processing efficiency of microcontrollers. Modern devices often implement ARM Cortex-A/R series cores alongside programmable logic, creating System-on-Chip (SoC) solutions. These ICs are critical in applications requiring real-time processing, hardware acceleration, and flexible I/O interfacing, such as industrial automation, automotive systems, and communication infrastructure.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
SoC FPGAIntegrated ARM Cortex-A/R cores with programmable logic, advanced memory controllersIndustrial IoT gateways, medical imaging systems
Microcontroller-Embedded FPGALow-power microcontroller with small FPGA fabric for custom peripheralsSmart sensors, edge AI devices
AI-Optimized FPGA+MCUDSP blocks with ML accelerator cores, PCIe/NVMe interfacesAutonomous vehicle perception systems

3. Structure & Composition

Typical architecture includes:

  • Programmable Logic Blocks: Logic cells (LUTs, FFs), DSP slices, block RAM
  • Processing System: Hard ARM cores (Cortex-A53/A72/R5), cache hierarchy, MMU
  • Interconnect: High-bandwidth AXI buses, NoC (Network-on-Chip) fabric
  • Memory Interfaces: DDR4/DDR5 SDRAM, HBM2e controllers
  • Peripherals: Gigabit Ethernet, USB 3.0, CAN FD, PCIe Gen4
  • Security: Hardware encryption engines (AES-256, SHA-256), secure boot

4. Key Technical Specifications

ParameterImportance
Logic Density (LUTs): 100K-4MDetermines complexity of implementable functions
Max Clock Frequency: 100MHz-1.5GHzImpacts processing speed and latency
Power Consumption: 0.5-25WCrucial for battery-powered/thermal-constrained devices
Memory Bandwidth: 12.8-102GB/sLimits data-intensive application performance
Interface Speed: 1-64Gbps transceiversEnables high-speed communication protocols

5. Application Fields

Major industries:

  • Industrial Automation: Machine vision systems, CNC controllers
  • Automotive: ADAS sensor fusion units, V2X communication modules
  • Medical: MRI image processing systems, portable diagnostics
  • Telecom: 5G massive MIMO beamforming units
  • Aerospace: Avionics control systems with redundancy

6. Leading Vendors & Products

VendorProduct SeriesKey Features
Xilinx (AMD)Zynq UltraScale+ MPSoCQuad Cortex-A53 + GPU + H.264/265 codec
IntelStratix 10 SX4x ARM Cortex-A53 + 28Gbps transceivers
MicrochipPolarFire SoCRISC-V based Mi-V ecosystem + deterministic latency
LatticeAvant FPGAEmbedded L2 cache RAM + ML-Accel IP core

7. Selection Recommendations

Key factors to consider:

  • Processing Requirements: Match core performance with algorithm complexity
  • Power Budget: Evaluate thermal dissipation requirements
  • I/O Needs: Verify interface compatibility with peripheral devices
  • Development Tools: Assess ecosystem maturity (Vivado, Quartus, etc.)
  • Longevity: Check product lifecycle status for industrial applications

Industry Trend Analysis

Future development directions include:

  • AI/ML Integration: On-chip neural network accelerators with INT8/BF16 support
  • Heterogeneous Computing: Combining RISC-V/GPU/FPGA in single die
  • Quantum-Resistant Security: Post-quantum cryptography implementation
  • SiP Integration: System-in-Package solutions with 3D-stacked memory
  • Open-Source Ecosystems: Growth of RISC-V based FPGA platforms

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