Embedded - FPGAs (Field Programmable Gate Array)

Image Part Number Description / PDF Quantity Rfq
M1AGL1000V5-CSG281

M1AGL1000V5-CSG281

Roving Networks / Microchip Technology

IC FPGA 215 I/O 281CSP

0

APA1000-FGG1152

APA1000-FGG1152

Roving Networks / Microchip Technology

IC FPGA 712 I/O 1152FBGA

0

M2GL025TS-VFG256I

M2GL025TS-VFG256I

Roving Networks / Microchip Technology

IC FPGA 138 I/O 256FBGA

0

MPF200TS-FCSG536I

MPF200TS-FCSG536I

Roving Networks / Microchip Technology

IC FPGA 300 I/O 536CSPBGA

0

M2GL005-1VF400I

M2GL005-1VF400I

Roving Networks / Microchip Technology

IC FPGA 169 I/O 400VFBGA

0

P1AFS600-2FG256

P1AFS600-2FG256

Roving Networks / Microchip Technology

IC FPGA 119 I/O 256FBGA

0

AGL125V2-CSG196I

AGL125V2-CSG196I

Roving Networks / Microchip Technology

IC FPGA 133 I/O 196CSP

0

M2GL010T-1VF400I

M2GL010T-1VF400I

Roving Networks / Microchip Technology

IC FPGA 195 I/O 400VFBGA

0

M1A3P400-2FGG144I

M1A3P400-2FGG144I

Roving Networks / Microchip Technology

IC FPGA 97 I/O 144FBGA

0

A42MX16-VQG100M

A42MX16-VQG100M

Roving Networks / Microchip Technology

IC FPGA 83 I/O 100VQFP

0

M2GL090TS-1FGG676I

M2GL090TS-1FGG676I

Roving Networks / Microchip Technology

IC FPGA 425 I/O 676FBGA

0

A3P250-2FGG256

A3P250-2FGG256

Roving Networks / Microchip Technology

IC FPGA 157 I/O 256FBGA

0

A3P600L-1FG484I

A3P600L-1FG484I

Roving Networks / Microchip Technology

IC FPGA 235 I/O 484FBGA

0

AGL125V5-CS196I

AGL125V5-CS196I

Roving Networks / Microchip Technology

IC FPGA 133 I/O 196CSP

0

A42MX09-1TQG176I

A42MX09-1TQG176I

Roving Networks / Microchip Technology

IC FPGA 104 I/O 176TQFP

0

MPF100TLS-FCG484I

MPF100TLS-FCG484I

Roving Networks / Microchip Technology

IC FPGA 244 I/O 484FBGA

0

A40MX04-PLG68M

A40MX04-PLG68M

Roving Networks / Microchip Technology

IC FPGA 57 I/O 68PLCC

0

A3PN250-2VQG100

A3PN250-2VQG100

Roving Networks / Microchip Technology

IC FPGA 68 I/O 100VQFP

0

MPF200T-1FCVG484I

MPF200T-1FCVG484I

Roving Networks / Microchip Technology

IC FPGA 284 I/O 484FBGA

0

A3P600-2PQG208

A3P600-2PQG208

Roving Networks / Microchip Technology

IC FPGA 154 I/O 208QFP

0

Embedded - FPGAs (Field Programmable Gate Array)

1. Overview

Field Programmable Gate Arrays (FPGAs) are reconfigurable semiconductor devices containing programmable logic blocks and interconnects. They enable hardware-level customization for specific computational tasks, offering flexibility unmatched by ASICs or microprocessors. In modern technology, FPGAs are critical for applications requiring parallel processing, low-latency execution, and real-time adaptability, such as AI acceleration, 5G communications, and industrial automation.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Low-Cost FPGAsOptimized for budget-sensitive applications with minimal logic densityConsumer electronics, IoT edge devices
High-Performance FPGAsAdvanced DSP blocks, high-speed transceivers (>100 Gbps)Data centers, radar systems
SoC FPGAsIntegrated ARM processors with FPGA fabricIndustrial control, medical imaging
MPSoC FPGAsMulti-core processors with AI acceleration enginesAutonomous vehicles, 5G base stations

3. Architecture and Components

A typical FPGA consists of:

  • Logic Units: Configurable Lookup Tables (LUTs) and flip-flops for implementing Boolean functions
  • Routing Resources: Programmable interconnects for signal pathways
  • I/O Interfaces: Standardized protocols (PCIe, DDR4, Ethernet)
  • Embedded Memory: Block RAM and distributed RAM for data storage
  • Clock Management: Phase-Locked Loops (PLLs) for precise timing control
  • DSP Blocks: Hardened multipliers and accumulators for signal processing

4. Key Technical Specifications

ParameterDescriptionImportance
Logic CellsNumber of configurable logic units (10K 2M+)Determines computational complexity
Max FrequencyOperating speed (100 MHz 1 GHz)Impacts processing throughput
Power ConsumptionThermal Design Power (TDP: 1W 100W)Critical for battery-powered systems
Package TypeBGA, Flip-Chip, System-in-Package (SiP)Affects PCB integration
Memory BandwidthData transfer rate (10 GB/s 1 TB/s)Essential for AI/data-intensive tasks

5. Application Domains

  • Telecommunications: 5G NR base stations, optical network switches
  • Industrial: Motor control, machine vision systems
  • Automotive: ADAS sensor fusion, LiDAR processing
  • Healthcare: MRI image reconstruction, ultrasound beamforming
  • Aerospace: Satellite communication modems, flight control systems

6. Leading Manufacturers and Products

VendorRepresentative ProductKey Features
XilinxZynq UltraScale+ MPSoCQuad-core ARM Cortex-A53 + 1.6M logic cells
IntelStratix 10 GX10M logic elements, 14 Gbps transceivers
LatticeMachXO3DLow-power <100K LUTs with security features
MicrochipPolarFire SoC256-bit RISC-V processor, 4.9M logic cells

7. Selection Guidelines

Key considerations:

  • Evaluate required logic density and I/O bandwidth
  • Balance performance vs. power budget (e.g., automotive vs. data center)
  • Assess toolchain support (Vivado, Quartus, etc.)
  • Consider long-term availability for industrial/medical systems
  • Verify protocol compatibility (e.g., PCIe Gen5, DDR5)

8. Industry Trends

Future directions include:

  • AI-optimized FPGAs with integrated tensor cores
  • 3D-stacked memory integration for >1 TB/s bandwidth
  • Open-source toolchain adoption (e.g., GHDL, Yosys)
  • Heterogeneous computing with hybrid CPU-GPU-FPGA architectures
  • Advanced node processes (5nm/3nm) enabling 10M+ logic cells
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