Embedded - CPLDs (Complex Programmable Logic Devices)

Image Part Number Description / PDF Quantity Rfq
ISPLSI3320-100LQ

ISPLSI3320-100LQ

Lattice Semiconductor

EE PLD, 13NS, 320-CELL PQFP208

0

ISPLSI2128VL-150LB100

ISPLSI2128VL-150LB100

Lattice Semiconductor

EE PLD, 8.5NS, 128-CELL PBGA100

278

ISPLSI-8600V-60LB272I

ISPLSI-8600V-60LB272I

Lattice Semiconductor

IN SYSTEM PROGRAMMABLE SUPERBIG

45

ISPLSI2032VE-110LBN49

ISPLSI2032VE-110LBN49

Lattice Semiconductor

IN SYSTEM PROGRAMMABLE HIGH DEN

769

GAL20VP8B-25LP

GAL20VP8B-25LP

Lattice Semiconductor

EE PLD, 25NS, PAL-TYPE

0

ISPLSI8600V-90LB492

ISPLSI8600V-90LB492

Lattice Semiconductor

EE PLD, 16NS, 600-CELL PBGA492

457

ISPLSI8600V-60LB492

ISPLSI8600V-60LB492

Lattice Semiconductor

EE PLD, 24NS, 600-CELL PBGA492

344

M5-128/120-7YC

M5-128/120-7YC

Lattice Semiconductor

EE PLD, 7.5NS, 128-CELL PQFP160

35

ISPLSI81080V-90LB492

ISPLSI81080V-90LB492

Lattice Semiconductor

EE PLD, 16NS, 1080-CELL PBGA492

297

LC4032ZE-4MN64C

LC4032ZE-4MN64C

Lattice Semiconductor

IC CPLD 32MC 4.4NS 64CSBGA

0

ISPLSI3256E-70LQA

ISPLSI3256E-70LQA

Lattice Semiconductor

EE PLD, 15NS, 256-CELL PQFP304

266

LC4064ZE-5MN64I

LC4064ZE-5MN64I

Lattice Semiconductor

IC CPLD 64MC 5.8NS 64CSBGA

0

ISPLSI-3256E-70LQ

ISPLSI-3256E-70LQ

Lattice Semiconductor

EE PLD, 15NS, 256-CELL PQFP304

51

ISPLSI-2032VL-180LB49

ISPLSI-2032VL-180LB49

Lattice Semiconductor

EE PLD, 5NS, 32-CELL PBGA49

96

ISPLSI81080V-60LB492

ISPLSI81080V-60LB492

Lattice Semiconductor

EE PLD, 24NS, 1080-CELL PBGA492

400

ISPLSI2128-100LQ

ISPLSI2128-100LQ

Lattice Semiconductor

EE PLD, 13NS, 128-CELL PQFP160

74

ISPLSI8600V-125LB492

ISPLSI8600V-125LB492

Lattice Semiconductor

EE PLD, 13.5NS, 600-CELL PBGA492

574

LAMXO2280E-3FTN324E

LAMXO2280E-3FTN324E

Lattice Semiconductor

IC CPLD 1140MC 5.1NS 324BGA

0

ISPLSI3256E-100LB320

ISPLSI3256E-100LB320

Lattice Semiconductor

EE PLD, 10NS, 256-CELL PBGA320

214

ISPLSI-2032VL-110LB49

ISPLSI-2032VL-110LB49

Lattice Semiconductor

EE PLD, 10NS, 32-CELL PBGA49

152

Embedded - CPLDs (Complex Programmable Logic Devices)

1. Overview

Complex Programmable Logic Devices (CPLDs) are semiconductor devices containing programmable logic blocks interconnected via a global routing matrix. Unlike FPGAs, CPLDs use non-volatile memory for configuration storage, enabling instant-on functionality. They excel in applications requiring low-latency signal processing, glue logic implementation, and low-complexity digital design integration. Their deterministic timing and reprogrammability make them critical in embedded systems for prototyping, interface bridging, and real-time control.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Product-Term-Based CPLDsUtilize AND-OR array architecture with fixed routingSimple state machines, protocol conversion
Look-Up Table (LUT)-Based CPLDsImplement logic functions via configurable LUTsDigital signal conditioning, sensor fusion
Hybrid CPLDsCombine product-term and LUT architecturesIndustrial motor control, automotive networking

3. Structure and Components

Typical CPLD architecture consists of:

  • Logic Blocks: Configurable macrocells with programmable AND-OR arrays (8-64 macrocells per device)
  • Routing Matrix: Central interconnect providing fixed-delay paths between blocks
  • I/O Blocks: Bidirectional pins with voltage level translation (1.2V-3.3V compatibility)
  • Non-Volatile Memory: Flash or EEPROM cells storing configuration bits
  • Clock Management: Integrated PLLs/ DLLs for precise timing control

4. Key Technical Specifications

ParameterTypical RangeImportance
Logic Density32-512 macrocellsDetermines complexity of implementable designs
Maximum Clock Frequency100-400 MHzDefines processing speed capabilities
Power Consumption10-200 mA @ 3.3VImpacts thermal design and battery life
Propagation Delay2.5-10 nsCritical for timing-sensitive applications
Package TypesTQFP, VQFP, BGA (44-352 pins)Affects PCB integration complexity
Reprogrammability Cycles10,000-100,000Determines maintenance lifecycle

5. Application Domains

  • Telecommunications: Line interface units, protocol converters (T1/E1, Ethernet)
  • Industrial Automation: PLC controllers, motor drivers, HMI interfaces
  • Automotive: CAN/LIN bus bridges, sensor signal conditioning
  • Medical Devices: Diagnostic equipment I/O controllers
  • Consumer Electronics: Display controllers, peripheral interfaces

6. Major Manufacturers and Products

ManufacturerRepresentative ProductKey Specifications
XilinxXC9500XL Series5V tolerant I/O, 10 ns pin-to-pin delay
Intel (Altera)MAX II CPLD2.5V operation, 300 MHz clock speed
Lattice SemiconductorMachXO3Trans-rate I/O, embedded sysMEM SRAM
Microchip (Microsemi)SmartFusion2ARM Cortex-M3 + FPGA integration

7. Selection Guidelines

Key considerations during CPLD selection:

  • Resource Requirements: Calculate required macrocells/logic gates with 20% margin
  • Timing Constraints: Match propagation delay with system clock requirements
  • Power Budget: Compare ICC current specifications under typical workload
  • Package Compatibility: Select footprint matching PCB constraints
  • Toolchain Support: Evaluate development software features (e.g., Xilinx ISE vs. Lattice Diamond)
  • Future-Proofing: Choose devices with obsolescence management programs

8. Industry Trends and Projections

Key development directions include:

  • Process Technology: Transition to 28nm FD-SOI for improved power efficiency
  • 3D Integration: Stacked die architectures for higher logic density
  • AI Acceleration: Embedded machine learning inference capabilities
  • Security Features: Integrated hardware-based encryption engines
  • Green Manufacturing: Lead-free packaging and RoHS compliance

Market forecasts indicate 5.2% CAGR through 2027, driven by industrial IoT and automotive ADAS applications.

Application Case Study

Industrial PLC Controller: Lattice MachXO2 CPLD implemented 24-channel digital I/O control with 3.2 s response time. Device replaced discrete logic and microcontroller, reducing BOM cost by 38% while meeting IEC 61131-2 industrial immunity standards.

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