Embedded - CPLDs (Complex Programmable Logic Devices)

Image	Part Number	Description / PDF	Quantity	Rfq
	EPM7128SQC160-15 Intel	IC CPLD 128MC 15NS 160QFP	0
	EPM9560ARI208-10 Intel	IC CPLD 560MC 10NS 208RQFP	0
	EPM7032SLC44-10N Intel	IC CPLD 32MC 10NS 44PLCC	0
	EPM3128ATC100-5N Intel	IC CPLD 128MC 5NS 100TQFP	0
	EPM7032BTC44-5N Intel	IC CPLD 32MC 5NS 44TQFP	0
	EPM7096QC100-12 Intel	IC CPLD 96MC 12NS 100QFP	0
	EPM7032SLC44-5 Intel	IC CPLD 32MC 5NS 44PLCC	0
	EPM7128SQC100-7FN Intel	IC CPLD 128MC 7.5NS 100QFP	0
	EPM3032ATC44-10NAB Intel	IC CPLD 32MC 10NS 44TQFP	0
	EPM7128BTC100-4N Intel	IC CPLD 128MC 4NS 100TQFP	0
	EPM7064BTC44-7N Intel	IC CPLD 64MC 7.5NS 44TQFP	0
	EPM7128SQC160-10 Intel	IC CPLD 128MC 10NS 160QFP	0
	EPM7192SQC160-15 Intel	IC CPLD 192MC 15NS 160QFP	0
	EPM7032LC44-10 Intel	IC CPLD 32MC 10NS 44PLCC	0
	EPM3512AFI256-10N Intel	IC CPLD 512MC 10NS 256FBGA	0
	EPM7128AELC84-10 Intel	IC CPLD 128MC 10NS 84PLCC	0
	EPM7096LC84-10 Intel	IC CPLD 96MC 10NS 84PLCC	0
	EPM7096QI100-15 Intel	IC CPLD 96MC 15NS 100QFP	0
	EPM7064QC100-7YY Intel	IC CPLD 64MC 7.5NS 100QFP	0
	EPM7128SQI160-10N Intel	IC CPLD 128MC 10NS 160QFP	0

Embedded - CPLDs (Complex Programmable Logic Devices)

1. Overview

Complex Programmable Logic Devices (CPLDs) are semiconductor devices containing programmable logic blocks interconnected via a global routing matrix. Unlike FPGAs, CPLDs use non-volatile memory for configuration storage, enabling instant-on functionality. They excel in applications requiring low-latency signal processing, glue logic implementation, and low-complexity digital design integration. Their deterministic timing and reprogrammability make them critical in embedded systems for prototyping, interface bridging, and real-time control.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Product-Term-Based CPLDs	Utilize AND-OR array architecture with fixed routing	Simple state machines, protocol conversion
Look-Up Table (LUT)-Based CPLDs	Implement logic functions via configurable LUTs	Digital signal conditioning, sensor fusion
Hybrid CPLDs	Combine product-term and LUT architectures	Industrial motor control, automotive networking

3. Structure and Components

Typical CPLD architecture consists of:

Logic Blocks: Configurable macrocells with programmable AND-OR arrays (8-64 macrocells per device)
Routing Matrix: Central interconnect providing fixed-delay paths between blocks
I/O Blocks: Bidirectional pins with voltage level translation (1.2V-3.3V compatibility)
Non-Volatile Memory: Flash or EEPROM cells storing configuration bits
Clock Management: Integrated PLLs/ DLLs for precise timing control

4. Key Technical Specifications

Parameter	Typical Range	Importance
Logic Density	32-512 macrocells	Determines complexity of implementable designs
Maximum Clock Frequency	100-400 MHz	Defines processing speed capabilities
Power Consumption	10-200 mA @ 3.3V	Impacts thermal design and battery life
Propagation Delay	2.5-10 ns	Critical for timing-sensitive applications
Package Types	TQFP, VQFP, BGA (44-352 pins)	Affects PCB integration complexity
Reprogrammability Cycles	10,000-100,000	Determines maintenance lifecycle

5. Application Domains

Telecommunications: Line interface units, protocol converters (T1/E1, Ethernet)
Industrial Automation: PLC controllers, motor drivers, HMI interfaces
Automotive: CAN/LIN bus bridges, sensor signal conditioning
Medical Devices: Diagnostic equipment I/O controllers
Consumer Electronics: Display controllers, peripheral interfaces

6. Major Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Xilinx	XC9500XL Series	5V tolerant I/O, 10 ns pin-to-pin delay
Intel (Altera)	MAX II CPLD	2.5V operation, 300 MHz clock speed
Lattice Semiconductor	MachXO3	Trans-rate I/O, embedded sysMEM SRAM
Microchip (Microsemi)	SmartFusion2	ARM Cortex-M3 + FPGA integration

7. Selection Guidelines

Key considerations during CPLD selection:

Resource Requirements: Calculate required macrocells/logic gates with 20% margin
Timing Constraints: Match propagation delay with system clock requirements
Power Budget: Compare ICC current specifications under typical workload
Package Compatibility: Select footprint matching PCB constraints
Toolchain Support: Evaluate development software features (e.g., Xilinx ISE vs. Lattice Diamond)
Future-Proofing: Choose devices with obsolescence management programs

8. Industry Trends and Projections

Key development directions include:

Process Technology: Transition to 28nm FD-SOI for improved power efficiency
3D Integration: Stacked die architectures for higher logic density
AI Acceleration: Embedded machine learning inference capabilities
Security Features: Integrated hardware-based encryption engines
Green Manufacturing: Lead-free packaging and RoHS compliance

Market forecasts indicate 5.2% CAGR through 2027, driven by industrial IoT and automotive ADAS applications.

Application Case Study

Industrial PLC Controller: Lattice MachXO2 CPLD implemented 24-channel digital I/O control with 3.2 s response time. Device replaced discrete logic and microcontroller, reducing BOM cost by 38% while meeting IEC 61131-2 industrial immunity standards.