Data Acquisition - Digital to Analog Converters (DAC)

Image Part Number Description / PDF Quantity Rfq
CS4338-KSZ

CS4338-KSZ

Cirrus Logic

IC DAC 24BIT V-OUT 8SOIC

0

CS4330-BS

CS4330-BS

Cirrus Logic

STEREO DAC FOR DIGITAL AUDIO

20

CS4334-KSZR

CS4334-KSZR

Cirrus Logic

IC DAC 24BIT V-OUT 8SOIC

0

CS4303-KP

CS4303-KP

Cirrus Logic

DAC, 18-BIT, 1 FUNC PDIP28

3857

CS4392-KZR

CS4392-KZR

Cirrus Logic

24-BIT, 192 KHZ STEREO DAC

18000

CS4360-KZ

CS4360-KZ

Cirrus Logic

24-BIT, 192 KHZ 6 CHANNEL DAC

98734

CS43131-CNZ

CS43131-CNZ

Cirrus Logic

IC DAC 32BIT V-OUT 40QFN

0

CS43032

CS43032

Cirrus Logic

CS43032

0

WM8718SEDS/RV

WM8718SEDS/RV

Cirrus Logic

24 BIT DIFFERENTIAL STEREO DAC

2000

CS43L42-KZZR REEL

CS43L42-KZZR REEL

Cirrus Logic

LOW VOLTAGE, STEREO DAC WITH HE

0

Data Acquisition - Digital to Analog Converters (DAC)

1. Overview

Digital-to-Analog Converters (DACs) are semiconductor devices that convert digital signals into analog voltages or currents. They serve as critical interfaces between digital systems and real-world analog environments. DACs are essential in applications requiring precise control of analog outputs, such as audio processing, industrial automation, and communication systems. Their performance directly impacts signal fidelity, system accuracy, and overall efficiency in data acquisition chains.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Current-Steering DACHigh-speed operation using switched current sourcesRF signal generation, high-speed test equipment
Voltage-Output DACDirect voltage generation with built-in amplifiersProcess control, sensor calibration
Multiplixing DACSupports variable reference inputs for signal modulationDigital gain control, programmable power supplies
Pipeline DACSegmented architecture for high sample ratesCommunication transmitters, video processing
Sigma-Delta ( - ) DACHigh-resolution with noise shaping techniquesAudio systems, precision measurement instruments

3. Structure and Components

A typical DAC IC comprises: - Digital Interface (SPI, I2C, or parallel bus) - Decoder Circuitry for binary/thermometer code conversion - Resistor/Capacitor Arrays for weighted signal summation - Switch Matrix controlling current/voltage paths - Output Amplifier conditioning the analog signal - Reference Voltage Source ensuring conversion stability Modern DACs often integrate calibration logic and temperature compensation circuits in QFN, TSSOP, or BGA packages.

4. Key Technical Specifications

ParameterSignificance
Resolution (bits)Determines the smallest analog change (e.g., 12-bit 4096 steps)
Sample Rate (SPS)Maximum conversion speed (up to 10 GSPS in RF DACs)
Integral Nonlinearity (INL)Measures deviation from ideal transfer function
Differential Nonlinearity (DNL)Indicates step size consistency
Settling TimeTime to stabilize output after digital input change
Power ConsumptionCrucial for portable/battery-powered systems

5. Application Areas

Main industries include: - Consumer Electronics: Smartphones (audio DACs), streaming devices - Industrial Automation: PLC systems, CNC machine control - Medical Equipment: MRI imaging systems, patient monitoring - Telecommunications: Optical modems, 5G base stations - Test & Measurement: Signal generators, oscilloscopes - Automotive: EV battery management, ADAS sensor calibration

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsDAC38J8416-bit, 2.5 GSPS RF DAC with JESD204B interface
Analog DevicesAD575516-channel, industrial voltage/current output DAC
Maxim IntegratedMAX513410-bit, 1.8V low-power video DAC
Nordic SemiconductornRF21540RF front-end with integrated DAC for IoT devices

7. Selection Guidelines

Key considerations: - Match resolution and speed requirements (e.g., audio vs. RF applications) - Evaluate output type (current/voltage) and drive capability - Assess linearity specifications (INL/DNL) for precision needs - Consider power budget and thermal management - Verify digital interface compatibility (SPI, I2C, etc.) - Temperature range and package type for environmental conditions - Calibration features for long-term stability

8. Industry Trends

Current development directions include: - Integration with ADCs and signal processors in SoC solutions - Advancements in R-2R ladder architectures for higher precision - Development of radiation-hardened DACs for aerospace applications - Energy-efficient designs for IoT edge devices - Expansion of AI-driven calibration algorithms - Adoption of advanced packaging (e.g., 3D stacking) for higher density Market growth is driven by 5G infrastructure, autonomous vehicles, and industrial IoT deployments requiring high-speed, high-accuracy signal conversion.

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