Data Acquisition - Analog Front End (AFE)

Image Part Number Description / PDF Quantity Rfq
AFE1103E

AFE1103E

Burr-Brown (Texas Instruments)

DIGITAL SLIC, 1-FUNC, CMOS

1816

AFE1205E

AFE1205E

Burr-Brown (Texas Instruments)

DIGITAL SLIC, 1-FUNC, CMOS

6870

AFE2126E

AFE2126E

Burr-Brown (Texas Instruments)

DIGITAL SLIC, 1-FUNC

2194

AFE1105E/1K

AFE1105E/1K

Burr-Brown (Texas Instruments)

DIGITAL SLIC, 1-FUNC, CMOS

6000

AFE1105E

AFE1105E

Burr-Brown (Texas Instruments)

DIGITAL SLIC, 1-FUNC, CMOS

2523

AFE1144E

AFE1144E

Burr-Brown (Texas Instruments)

DIGITAL SLIC, 1-FUNC

48

AFE1224E

AFE1224E

Burr-Brown (Texas Instruments)

DIGITAL SLIC, 1-FUNC

1672

AFE1124E

AFE1124E

Burr-Brown (Texas Instruments)

DIGITAL SLIC, 1-FUNC

369

Data Acquisition - Analog Front End (AFE)

1. Overview

Analog Front End (AFE) ICs are critical components in data acquisition systems, serving as the interface between analog sensors/transducers and digital processing units. They perform signal conditioning, amplification, filtering, and analog-to-digital conversion (ADC) driving functions. AFEs ensure signal integrity and measurement accuracy in applications ranging from medical devices to industrial automation, playing a pivotal role in modern precision electronics.

2. Major Types and Functional Classification

Type Functional Features Application Examples
Precision AFE Low noise, high linearity, programmable gain amplifiers (PGA) Medical imaging equipment, precision weighing scales
High-Speed AFE Wide bandwidth (>100MHz), fast settling time Ultrasound systems, radar receivers
Integrated AFE Complete signal chain in single chip (PGA + ADC + DSP) Smart sensors, IoT edge devices
Isolated AFE Galvanic isolation with >5kV rating Power grid monitoring, industrial safety systems

3. Structure and Composition

Typical AFE architecture includes:

  • Programmable Gain Amplifier (PGA) for signal scaling
  • Anti-aliasing filter (low-pass/band-pass)
  • ADC driver amplifier with fast transient response
  • Reference voltage generator
  • Digital control interface (I2C/SPI)
  • Optional isolation barriers (magnetic/optical)

Advanced designs integrate calibration circuits and fault detection modules.

4. Key Technical Specifications

Parameter Description Importance
Effective Number of Bits (ENOB) Actual ADC resolution considering noise/distortion Determines measurement accuracy
Signal-to-Noise Ratio (SNR) Ratio of desired signal to background noise (dB) Impacts dynamic range
Input Referred Noise Amplifier noise converted to input equivalent (nV/ Hz) Limits minimum detectable signal
Common-Mode Rejection Ratio (CMRR) Ability to reject common-mode interference (dB) Essential for noisy environments
Power Supply Rejection Ratio (PSRR) Noise suppression from power rails (dB) Ensures stable operation

5. Application Fields

Major application areas include:

  • Medical: ECG/EKG machines, blood glucose monitors
  • Industrial: Programmable logic controllers (PLCs), vibration sensors
  • Communications: Software-defined radios, optical transceivers
  • Automotive: Battery management systems, LiDAR receivers
  • Consumer: Smart wearables, voice assistants

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Analog Devices AD7768 24-bit Sigma-Delta ADC with 2 V offset error
Texas Instruments ADS1298 8-channel ECG frontend with built-in lead-off detection
STMicroelectronics LTC2358 18-bit SAR ADC with 1MSPS throughput
NXP Semiconductors MCP3911 6-channel energy measurement AFE with harmonic analysis

7. Selection Guidelines

Key considerations when selecting AFEs:

  • Match ADC resolution with system accuracy requirements
  • Evaluate bandwidth requirements vs. power consumption trade-offs
  • Consider integration level (discrete vs. system-on-chip)
  • Verify temperature stability (-40 C to +125 C range)
  • Assess digital interface compatibility (SPI/I2C speed)
  • Check for required certifications (medical/industrial safety)

8. Industry Trends

Current development trends include:

  • Increasing integration with AI acceleration for edge processing
  • Sub-1V supply operation for IoT devices
  • Emerging wide bandgap (GaN/SiC) compatible isolation technologies
  • Development of 32-bit+ precision converters
  • Standardization of wireless AFE modules for Industry 4.0
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