ample-chip ample-chip
RFQ
BOM

Data Acquisition - ADCs/DACs - Special Purpose

Image Part Number Description / PDF Quantity Rfq
PCM1718E

PCM1718E

Burr-Brown (Texas Instruments)

PCM1718 100DB SNR STEREO DAC

3199
PCM1754DBQG4

PCM1754DBQG4

Burr-Brown (Texas Instruments)

PCM1754 106-DB SNR STEREO AUDIO

186
PCM2702E

PCM2702E

Burr-Brown (Texas Instruments)

PCM2702 105DB SNR STEREO USB2.0

7450
PCM1608Y

PCM1608Y

Burr-Brown (Texas Instruments)

IC 24BIT 192KHZ 8CH DAC 48-LQFP

11366
PCM5101PW

PCM5101PW

Burr-Brown (Texas Instruments)

DAC, 1 FUNC, SERIAL INPUT LOADIN

158
MSC1210Y3PAGT

MSC1210Y3PAGT

Burr-Brown (Texas Instruments)

MSC1210Y3 MSC121X MIXED SIGNAL M

4395
PCM4201PW

PCM4201PW

Burr-Brown (Texas Instruments)

PCM4201 112DB SNR LOW-POWER MONO

392
PCM56P-J

PCM56P-J

Burr-Brown (Texas Instruments)

DAC, SERIAL INPUT

34
DSD1700E

DSD1700E

Burr-Brown (Texas Instruments)

DAC, SERIAL INPUT LOADING

37
PCM1738E

PCM1738E

Burr-Brown (Texas Instruments)

PCM1738 117DB SNR STEREO DAC

32248

Data Acquisition - ADCs/DACs - Special Purpose

1. Overview

Special Purpose Analog-to-Digital Converters (ADCs) and Digital-to-Analog Converters (DACs) are integrated circuits designed for specific data acquisition tasks requiring tailored performance characteristics. These ICs enable precise signal conversion in specialized applications where standard converters cannot meet unique requirements such as ultra-high speed, extreme accuracy, isolation, or environmental robustness. They are critical in advanced industrial control systems, medical instrumentation, aerospace electronics, and high-frequency communication systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
High-Speed ADCsSampling rates >1 GSPS, low latency, wide bandwidthRadar systems, 5G transceivers
High-Precision ADCs24-bit resolution, 2ppm linearity, low noiseMedical imaging, precision test equipment
Isolated ADCsGalvanic isolation up to 5kVRMS, CMTI >100kV/ sIndustrial motor drives, grid-tied inverters
Multi-Channel DACsSynchronized channels, crosstalk < -100dBAutomotive LiDAR beam steering
Radiation-Hardened ADCsLatch-up immunity, TID tolerance >100kradSatellite payloads, nuclear instrumentation

3. Structure and Components

Typical architecture includes:

  • Input conditioning stage (PGA, anti-aliasing filter)
  • Sampling-and-Hold circuit with <10ps jitter
  • Conversion core (SAR, Delta-Sigma, Pipeline architecture)
  • Digital interface (SPI, JESD204B, LVDS)
  • Calibration engine for offset/linearity correction
  • Thermal management structures (exposed pads, thermal vias)

4. Key Technical Specifications

ParameterDescriptionImportance
Effective Number of Bits (ENOB)Actual resolution considering noise/distortionSystem accuracy benchmark
Signal-to-Noise and Distortion (SINAD)Dynamic range measurementDetermines minimum detectable signal
Integral Nonlinearity (INL)Deviation from ideal transfer functionEssential for precision measurements
Power Supply Rejection Ratio (PSRR)Noise immunity from power railsSystem stability in varying conditions
Operating Temperature Range-55 C to +150 C for automotive/military gradesEnvironmental reliability

5. Application Fields

  • Industrial Automation: Programmable Logic Controllers (PLCs) with 16-channel analog inputs
  • Medical Imaging: MRI scanners requiring 24-bit ADCs with 10nV/ Hz noise density
  • Aerospace: Avionics data acquisition with radiation-hardened DACs
  • Test & Measurement: Oscilloscopes using 8GS/s ADCs for 2GHz bandwidth
  • Energy Systems: Grid monitoring devices with 0.01% accurate voltage measurement

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Specifications
Analog DevicesAD7124-824-bit - ADC, 0.001% linearity, TUE <0.1%
TI SemiconductorADS54J6016-bit, 1GSPS ADC with 74dB SNR
Maxim IntegratedMAX1115616-channel, 18-bit SAR ADC, 0.1LSB INL
STMicroelectronicsLTC2380-2424-bit, 2Msps ADC with 2ppm INL
NXP SemiconductorsMC12DX10808-channel DAC with 12.5ps jitter for LiDAR

7. Selection Guidelines

Key selection criteria:

  1. Match sampling rate and bandwidth to signal requirements
  2. Verify temperature stability and long-term drift specifications
  3. Consider digital interface compatibility (e.g. JESD204C for high-speed links)
  4. Evaluate power consumption vs. performance trade-offs
  5. Example: For vibration analysis in jet engines, select ADC with 200dB dynamic range and -55 C to +125 C rating

Industry Trends

Emerging trends include:

  • 3D-stacked ICs integrating ADCs with AI acceleration cores
  • Time-interleaved ADCs breaking 10 GSPS barriers
  • Self-calibrating DACs with embedded temperature sensors
  • Photonics-enabled converters for THz-range sampling
  • Energy-harvesting optimized ADCs with sub- W operation modes

RFQ BOM Call Skype Email
Top