Clock/Timing - Clock Generators, PLLs, Frequency Synthesizers

Image	Part Number	Description / PDF	Quantity	Rfq
	MPC93R52FA NXP Semiconductors	IC CLOCK GEN 1:11 PLL LV 32-LQFP	0
	MC100ES6139DT NXP Semiconductors	IC CLOCK GENERATION CHIP 20TSSOP	0
	MPC99J93FA NXP Semiconductors	IC CLOCK DRIVER LV 1:5 32-LQFP	0
	PCK12429D,512 NXP Semiconductors	IC CLOCK GENERATOR PECL 28SOIC	0
	MPC961PFA NXP Semiconductors	IC ZDB PECL LV 1:18 32-LQFP	0
	74HC7046AD,118 NXP Semiconductors	IC PLL W/LOCK DETECTOR 16SOIC	0
	MC145151DW2R2 NXP Semiconductors	IC PAR-IN PLL FREQ SYNTH 28-SOIC	0
	MPC962308D-1 NXP Semiconductors	IC CLOCK BUFFER 1:8 16-SOIC	0
	MPC9330FA NXP Semiconductors	IC CLOCK GEN PLL LV 1:6 32-LQFP	0
	PCK12429BD,151 NXP Semiconductors	IC CLOCK GENERATOR PECL 32LQFP	0
	MC88915FN55R2 NXP Semiconductors	IC DRIVER CLK PLL 55MHZ 28-PLCC	0
	MPC93H52FA NXP Semiconductors	IC CLOCK GEN/DVR HI-DRIVE 32LQFP	0
	MPC962309D-1 NXP Semiconductors	IC CLOCK BUFFER 1:9 16-SOIC	0
	MC145158DW2 NXP Semiconductors	IC SER-IN PLL FREQ SYNTH 16-SOIC	0
	MC145170D2R2 NXP Semiconductors	IC SERIAL PLL FREQ SYNTH 16-SOIC	0
	MPC9229FA NXP Semiconductors	IC PECL CLOCK LV 400MHZ 32-LQFP	0
	PCK953BD,128 NXP Semiconductors	IC DRVR CLK PECL 3.3V 32LQFP	0
	PCK12429A,112 NXP Semiconductors	IC CLOCK GENERATOR PECL 28PLCC	0
	SA8027DH,512 NXP Semiconductors	IC N/IF FREG SYNTHESIZER 20TSSOP	0
	MPC962309DT-1H NXP Semiconductors	IC CLOCK BUFFER 1:9 16-TSSOP	0

Clock/Timing - Clock Generators, PLLs, Frequency Synthesizers

1. Overview

Clock and timing ICs are semiconductor devices that generate, regulate, and distribute timing signals in electronic systems. Key components include Clock Generators (produce stable clock signals), Phase-Locked Loops (PLLs, synchronize signals with phase alignment), and Frequency Synthesizers (generate precise frequencies from reference signals). These devices ensure synchronization across components in modern electronics, enabling reliable operation in communication systems, computing devices, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Clock Generators	Produce fixed or programmable clock signals with low jitter	Microprocessors, FPGAs, networking equipment
PLLs	Align output signal phase with reference input, enable frequency multiplication	Wireless transceivers, data recovery circuits
Frequency Synthesizers	Generate multiple frequencies from single reference with high precision	5G base stations, satellite communication systems

3. Structure and Components

Typical clock ICs feature: 1) Crystal oscillator interface for reference signal input; 2) Internal voltage-controlled oscillator (VCO); 3) Phase detector and loop filter (PLL components); 4) Programmable dividers; 5) Output buffers. Advanced packages include QFN (4x4mm to 8x8mm) and TSSOP with 8-48 pins. Integration levels vary from single-channel devices to multi-output clock generators with integrated EEPROM.

4. Key Technical Specifications

Parameter	Typical Range	Importance
Frequency Range	1 kHz - 3.6 GHz	Determines application compatibility
Phase Noise	-150 to -120 dBc/Hz	Impacts signal integrity
Jitter (RMS)	50 fs - 1 ps	Critical for high-speed systems
Power Consumption	10-300 mA	Affects thermal design
Temperature Stability	20-100 ppm	Ensures reliability in harsh environments

5. Application Fields

Telecommunications: 5G NR base stations, optical transceivers
Computing: Server motherboards, PCIe clocks
Industrial: Precision test equipment, motor control systems
Automotive: ADAS sensors, infotainment systems
Medical: MRI imaging systems, patient monitoring devices

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TI (Texas Instruments)	LMX2594	15-GHz wideband PLL with integrated VCO
Analog Devices	AD9548	4-channel clock generator with 0.1 ppb accuracy
STMicroelectronics	CLK2692	Programmable 2-output synthesizer for automotive
Microchip	ZL30264	High-performance network synchronizer

7. Selection Guidelines

Key selection criteria: 1) Required output frequency and voltage levels; 2) Acceptable phase noise/jitter specifications; 3) Number of required outputs; 4) Operating temperature range; 5) Power budget constraints; 6) Integration level (e.g., single-chip vs. discrete VCO solutions). For wireless applications, prioritize low phase noise. For portable devices, emphasize power efficiency.

8. Industry Trends

Future developments include: 1) Higher integration with on-chip EEPROM and multi-phase outputs; 2) Advancement to sub-10fs jitter performance; 3) Development of radiation-hardened variants for aerospace; 4) Adoption of 3D packaging for reduced EMI; 5) Increased use of AI-enabled dynamic frequency scaling. The market is projected to grow at 7.2% CAGR through 2027 driven by 5G and automotive electrification.