Clock/Timing - Clock Generators, PLLs, Frequency Synthesizers

Part Number	Description / PDF	Quantity
CY22388KZXC-11 Rochester Electronics	CLOCKS	379
CY22801SXC-014 Rochester Electronics	CLOCKS	3018
IMIFS781BT Rochester Electronics	CLOCK GENERATOR, 82MHZ, CMOS	4007
CY2291SXC-197T Rochester Electronics	CLOCKS	2000
CY28506OCT Rochester Electronics	PROCESSOR SPECIFIC CLOCK GENERAT	1000
CY22381KFXI Rochester Electronics	CLOCKS	1362
CY2077SXC-108 Rochester Electronics	HIGH-ACCURACY EPROM PROGRAMMABLE	4878
CY7B994V-2AXCKJ Rochester Electronics	MULTI-PHASE PLL CLOCK BUFFER	0
CY25560SXCKA Rochester Electronics	CLOCKS	0
CY2213ZXC-1KN Rochester Electronics	CLOCK GENERATOR	384
CY25100ZXC51 Rochester Electronics	CLOCKS	9469
2925ALM/B Rochester Electronics	2925ALM/B	92
CY25701LXI043T Rochester Electronics	CLOCKS	0
CY25200KZXI-007 Rochester Electronics	CLOCKS	0
CY22381SXI-208 Rochester Electronics	TRIPLE PLL CLOCK MULTIPLIER	0
CY22381SXI Rochester Electronics	TRIPLE PLL CLOCK MULTIPLIER	0
CY2304ESXC-1 Rochester Electronics	LOW SKEW CLOCK DRIVER	5862
LMX2315WG/BXA Rochester Electronics	DUAL MARKED (5962-9855001QXA)	30
CY25812SZC Rochester Electronics	CLOCKS	0
CY24216SC-1 Rochester Electronics	CLOCKS	980

Clock/Timing - Clock Generators, PLLs, Frequency Synthesizers

1. Overview

Clock and timing ICs are semiconductor devices that generate, regulate, and distribute timing signals in electronic systems. Key components include Clock Generators (produce stable clock signals), Phase-Locked Loops (PLLs, synchronize signals with phase alignment), and Frequency Synthesizers (generate precise frequencies from reference signals). These devices ensure synchronization across components in modern electronics, enabling reliable operation in communication systems, computing devices, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Clock Generators	Produce fixed or programmable clock signals with low jitter	Microprocessors, FPGAs, networking equipment
PLLs	Align output signal phase with reference input, enable frequency multiplication	Wireless transceivers, data recovery circuits
Frequency Synthesizers	Generate multiple frequencies from single reference with high precision	5G base stations, satellite communication systems

3. Structure and Components

Typical clock ICs feature: 1) Crystal oscillator interface for reference signal input; 2) Internal voltage-controlled oscillator (VCO); 3) Phase detector and loop filter (PLL components); 4) Programmable dividers; 5) Output buffers. Advanced packages include QFN (4x4mm to 8x8mm) and TSSOP with 8-48 pins. Integration levels vary from single-channel devices to multi-output clock generators with integrated EEPROM.

4. Key Technical Specifications

Parameter	Typical Range	Importance
Frequency Range	1 kHz - 3.6 GHz	Determines application compatibility
Phase Noise	-150 to -120 dBc/Hz	Impacts signal integrity
Jitter (RMS)	50 fs - 1 ps	Critical for high-speed systems
Power Consumption	10-300 mA	Affects thermal design
Temperature Stability	20-100 ppm	Ensures reliability in harsh environments

5. Application Fields

Telecommunications: 5G NR base stations, optical transceivers
Computing: Server motherboards, PCIe clocks
Industrial: Precision test equipment, motor control systems
Automotive: ADAS sensors, infotainment systems
Medical: MRI imaging systems, patient monitoring devices

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TI (Texas Instruments)	LMX2594	15-GHz wideband PLL with integrated VCO
Analog Devices	AD9548	4-channel clock generator with 0.1 ppb accuracy
STMicroelectronics	CLK2692	Programmable 2-output synthesizer for automotive
Microchip	ZL30264	High-performance network synchronizer

7. Selection Guidelines

Key selection criteria: 1) Required output frequency and voltage levels; 2) Acceptable phase noise/jitter specifications; 3) Number of required outputs; 4) Operating temperature range; 5) Power budget constraints; 6) Integration level (e.g., single-chip vs. discrete VCO solutions). For wireless applications, prioritize low phase noise. For portable devices, emphasize power efficiency.

8. Industry Trends

Future developments include: 1) Higher integration with on-chip EEPROM and multi-phase outputs; 2) Advancement to sub-10fs jitter performance; 3) Development of radiation-hardened variants for aerospace; 4) Adoption of 3D packaging for reduced EMI; 5) Increased use of AI-enabled dynamic frequency scaling. The market is projected to grow at 7.2% CAGR through 2027 driven by 5G and automotive electrification.