Clock/Timing - Clock Generators, PLLs, Frequency Synthesizers

Part Number	Description / PDF	Quantity
CY22393KZXC-518 Rochester Electronics	CLOCKS	5501
PY2292ASL-003 Rochester Electronics	CLOCKS	0
MD82C284-6/B Rochester Electronics	CLOCK GENERATOR	11
CY22393ZXC-531T Rochester Electronics	PROGRAMMABLE CLOCK GENERATOR	12500
CY2292SL-1T4T Rochester Electronics	PROGRAMMABLE PLL CLOCK GENERATOR	22500
CY26187SC-3T Rochester Electronics	BROADCOM REFERENCE DESIGN CLOCK	2500
CY22381SC-128 Rochester Electronics	PROGRAMMABLE PLL CLOCK MULTIPLIE	209
CY22395FXIKN Rochester Electronics	CLOCKS	449
CY22150ZI-304 Rochester Electronics	ONE-PLL GENERAL PURPOSE FLASH-PR	1132
CY25402SXC-005 Rochester Electronics	CLOCKS	5876
CY24905ZXCT Rochester Electronics	CLOCKS	5000
CY22381SXI-207 Rochester Electronics	TRIPLE PLL CLOCK MULTIPLIER	0
CY25100ZXC38 Rochester Electronics	CLOCKS	5575
IMIFS781BTT Rochester Electronics	CLOCK GENERATOR, 82MHZ, CMOS	15000
CY25100ZIF Rochester Electronics	CLOCK GENERATOR, 200MHZ, CMOS	1005
CY25812SXCKP Rochester Electronics	SPREAD SPECTRUM CLOCK GENERATOR	138
CY25026ZC-1 Rochester Electronics	SPREAD SPECTRUM CLOCK GENERATOR	2397
CY22381SXC-171 Rochester Electronics	TRIPLE PLL CLOCK MULTIPLIER	0
CY22391KLTXC-01T Rochester Electronics	CLOCKS	0
CY2XP21ZXC Rochester Electronics	CLOCK GENERATOR, 140MHZ, CMOS	7594

Clock/Timing - Clock Generators, PLLs, Frequency Synthesizers

1. Overview

Clock and timing ICs are semiconductor devices that generate, regulate, and distribute timing signals in electronic systems. Key components include Clock Generators (produce stable clock signals), Phase-Locked Loops (PLLs, synchronize signals with phase alignment), and Frequency Synthesizers (generate precise frequencies from reference signals). These devices ensure synchronization across components in modern electronics, enabling reliable operation in communication systems, computing devices, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Clock Generators	Produce fixed or programmable clock signals with low jitter	Microprocessors, FPGAs, networking equipment
PLLs	Align output signal phase with reference input, enable frequency multiplication	Wireless transceivers, data recovery circuits
Frequency Synthesizers	Generate multiple frequencies from single reference with high precision	5G base stations, satellite communication systems

3. Structure and Components

Typical clock ICs feature: 1) Crystal oscillator interface for reference signal input; 2) Internal voltage-controlled oscillator (VCO); 3) Phase detector and loop filter (PLL components); 4) Programmable dividers; 5) Output buffers. Advanced packages include QFN (4x4mm to 8x8mm) and TSSOP with 8-48 pins. Integration levels vary from single-channel devices to multi-output clock generators with integrated EEPROM.

4. Key Technical Specifications

Parameter	Typical Range	Importance
Frequency Range	1 kHz - 3.6 GHz	Determines application compatibility
Phase Noise	-150 to -120 dBc/Hz	Impacts signal integrity
Jitter (RMS)	50 fs - 1 ps	Critical for high-speed systems
Power Consumption	10-300 mA	Affects thermal design
Temperature Stability	20-100 ppm	Ensures reliability in harsh environments

5. Application Fields

Telecommunications: 5G NR base stations, optical transceivers
Computing: Server motherboards, PCIe clocks
Industrial: Precision test equipment, motor control systems
Automotive: ADAS sensors, infotainment systems
Medical: MRI imaging systems, patient monitoring devices

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TI (Texas Instruments)	LMX2594	15-GHz wideband PLL with integrated VCO
Analog Devices	AD9548	4-channel clock generator with 0.1 ppb accuracy
STMicroelectronics	CLK2692	Programmable 2-output synthesizer for automotive
Microchip	ZL30264	High-performance network synchronizer

7. Selection Guidelines

Key selection criteria: 1) Required output frequency and voltage levels; 2) Acceptable phase noise/jitter specifications; 3) Number of required outputs; 4) Operating temperature range; 5) Power budget constraints; 6) Integration level (e.g., single-chip vs. discrete VCO solutions). For wireless applications, prioritize low phase noise. For portable devices, emphasize power efficiency.

8. Industry Trends

Future developments include: 1) Higher integration with on-chip EEPROM and multi-phase outputs; 2) Advancement to sub-10fs jitter performance; 3) Development of radiation-hardened variants for aerospace; 4) Adoption of 3D packaging for reduced EMI; 5) Increased use of AI-enabled dynamic frequency scaling. The market is projected to grow at 7.2% CAGR through 2027 driven by 5G and automotive electrification.