Clock/Timing - Clock Buffers, Drivers

Image	Part Number	Description / PDF	Quantity	Rfq
	MC100EP11DR2GH Sanyo Semiconductor/ON Semiconductor	IC CLK BUFFER 1:2 3GHZ 8SOIC	0
	NB3L83948CFAG Sanyo Semiconductor/ON Semiconductor	IC CLK BUFFER 2:1 3.3V 32LQFP	0
	MC10EP11DTR2 Sanyo Semiconductor/ON Semiconductor	IC CLK BUFFER 1:2 3GHZ 8TSSOP	0
	MC100LVE210FN Sanyo Semiconductor/ON Semiconductor	IC CLK BUF 1:4/1:5 700GHZ 28PLCC	0
	NB7L11MMNR2 Sanyo Semiconductor/ON Semiconductor	IC CLK BUFFER 1:2 8GHZ 16QFN	0
	MC10E211FN Sanyo Semiconductor/ON Semiconductor	IC CLK BUFFER 2:6 700MHZ 28PLCC	0
	MC10LVEP11DTR2 Sanyo Semiconductor/ON Semiconductor	IC CLK BUFFER 1:2 3GHZ 8TSSOP	0
	MC100LVEP11MNR4 Sanyo Semiconductor/ON Semiconductor	IC CLK BUFFER 1:2 3GHZ 8DFN	0
	MC10EL11DTR2 Sanyo Semiconductor/ON Semiconductor	IC CLK BUFFER 1:2 1.5GHZ 8TSSOP	0
	NB7L14MMNR2 Sanyo Semiconductor/ON Semiconductor	IC CLK BUFFER 1:4 8GHZ 16QFN	0
	MC100E210FNR2 Sanyo Semiconductor/ON Semiconductor	IC CLK BUF 1:4/1:5 700MHZ 28PLCC	0
	MC100EL11DTR2 Sanyo Semiconductor/ON Semiconductor	IC CLK BUFFER 1:2 1.5GHZ 8TSSOP	0
	MC100EP809FAR2 Sanyo Semiconductor/ON Semiconductor	IC CLK BUFFER 1:9 750MHZ 32LQFP	0
	NB6L11DR2 Sanyo Semiconductor/ON Semiconductor	IC CLK BUFFER 1:2 6GHZ 8SOIC	0
	MC100H646FN Sanyo Semiconductor/ON Semiconductor	IC CLK BUFFER 2:8 80MHZ 28PLCC	0

Clock/Timing - Clock Buffers, Drivers

1. Overview

Clock buffers and drivers are integrated circuits (ICs) designed to distribute clock signals in electronic systems. They amplify, condition, and route timing signals to multiple destinations while minimizing skew, jitter, and signal degradation. These components are critical in synchronizing operations across processors, memory modules, communication interfaces, and other timing-sensitive circuits. Their importance spans industries such as telecommunications, automotive, and high-performance computing.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Clock Buffers	Single-input, multiple-output devices with low phase noise and skew	CPU clock distribution, FPGA systems
Clock Drivers	High-drive capability for fan-out applications	Networking switches, server motherboards
Differential Clock Buffers	Supports LVDS, HCSL, and CML signal types	High-speed ADC/DAC systems, RF transceivers
Programmable Clock Buffers	Configurable output frequency/division ratios	Industrial automation, test equipment

3. Structure and Composition

Clock buffers/drivers typically consist of:

Input receivers (single-ended or differential)
Internal amplification stages
Output drivers with controlled impedance
Power supply decoupling structures
Thermal management pads (in QFN/SSOP packages)

They are fabricated using CMOS, Bipolar, or SiGe processes to optimize speed and noise performance.

4. Key Technical Specifications

Parameter	Description	Importance
Max Operating Frequency	Up to 1.2 GHz (CMOS), 3.2 GHz (SiGe)	Determines application suitability for high-speed systems
Additive Phase Jitter	0.05 ps RMS to 1 ps RMS	Impacts timing precision in data converters
Propagation Delay	50 ps to 5 ns	Critical in synchronized multi-channel systems
Output Voltage Levels	LVCMOS, LVDS, HSTL, etc.	Ensures compatibility with downstream circuits
Supply Voltage	1.8V to 5V	Affects power consumption and integration

5. Application Areas

Telecommunications: 5G base stations, optical transceivers
Computing: Servers, workstations, high-end PCs
Industrial: PLCs, motor controllers, test instruments
Automotive: ADAS clock synchronization, infotainment systems

Case Study: In 5G massive MIMO systems, low-jitter clock drivers ensure phase coherence across 64+ antenna elements.

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
TI (Texas Instruments)	CDCE62005	3.2 GHz LVDS driver, 0.1 ps RMS jitter
Analog Devices	ADCLK846	16-output clock buffer, 1.6 GHz bandwidth
STMicroelectronics	DF1610S	1.8V/3.3V dual supply buffer, 8 outputs
ON Semiconductor	MC100EP195	Differential ECL buffer, 2.5 GHz operation

7. Selection Recommendations

Key considerations:

Match output type to receiver requirements (LVDS/CML/LVCMOS)
Calculate required fan-out capacity with voltage margin
Specify jitter budget (e.g., <0.3 ps RMS for 10 Gbps SerDes)
Consider temperature stability (-40 C to +125 C automotive grade)
Optimize package size vs. thermal dissipation needs

8. Industry Trends

Future developments include:

Sub-100 fs jitter performance using advanced CMOS processes
Integration with PLL/VCO for clock generation
Multi-die packaging for hybrid signal conditioning
Energy-efficient designs for battery-powered IoT devices
Automotive-grade ICs with AEC-Q100 qualification