Clock/Timing - Clock Buffers, Drivers

Image Part Number Description / PDF Quantity Rfq
49FCT806ASOG

49FCT806ASOG

Flip Electronics

CLOCK DRIVER, CMOS, PDSO20

0

74FCT807BTSOGI

74FCT807BTSOGI

Flip Electronics

LOW SKEW CLOCK DRIVER, FCT SERIE

10084

87001BG-01LF

87001BG-01LF

Flip Electronics

CLOCK DRIVERS & DISTRIBUTION LVC

1242

49FCT806PYG

49FCT806PYG

Flip Electronics

LOW SKEW CLOCK DRIVER, FCT SERIE

0

CY2DL1504ZXC

CY2DL1504ZXC

Flip Electronics

LOW SKEW CLOCK DRIVER, 2DL SERIE

1060

8524AYLF

8524AYLF

Flip Electronics

LOW SKEW CLOCK DRIVER, 8524 SERI

0

MPC9443AE

MPC9443AE

Flip Electronics

CLOCK DRIVERS & DISTRIBUTION FSL

0

580G-01ILF

580G-01ILF

Flip Electronics

CLOCK DRIVERS & DISTRIBUTION GLI

119

XC540203CZT75A

XC540203CZT75A

Flip Electronics

PROCESSOR

7091

XC540203CZT75AR2

XC540203CZT75AR2

Flip Electronics

INTEGRATED CIRCUIT

1000

A1020A1PG84B

A1020A1PG84B

Flip Electronics

FPGA, 547 CLBS, 2000 GATES, CPGA

5

AGPS-C003-TR1

AGPS-C003-TR1

Flip Electronics

GNSS FILTER-LNA FRONT-END MODULE

3000

8SLVD1212NLGI

8SLVD1212NLGI

Flip Electronics

CLOCK DRIVERS & DISTRIBUTION 1:1

35581

5P90011PGGI

5P90011PGGI

Flip Electronics

REAL TIME CLOCK REAL TIME CLOCK

0

OHD1184

OHD1184

Flip Electronics

HALLOGIC HALL-EFFECT SENSORS

0

MCC9328MXL

MCC9328MXL

Flip Electronics

INTEGRATED CIRCUIT

33900

969HG-1049

969HG-1049

Flip Electronics

INTEGRATED CIRCUIT

18

Clock/Timing - Clock Buffers, Drivers

1. Overview

Clock buffers and drivers are integrated circuits (ICs) designed to distribute clock signals in electronic systems. They amplify, condition, and route timing signals to multiple destinations while minimizing skew, jitter, and signal degradation. These components are critical in synchronizing operations across processors, memory modules, communication interfaces, and other timing-sensitive circuits. Their importance spans industries such as telecommunications, automotive, and high-performance computing.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Clock Buffers Single-input, multiple-output devices with low phase noise and skew CPU clock distribution, FPGA systems
Clock Drivers High-drive capability for fan-out applications Networking switches, server motherboards
Differential Clock Buffers Supports LVDS, HCSL, and CML signal types High-speed ADC/DAC systems, RF transceivers
Programmable Clock Buffers Configurable output frequency/division ratios Industrial automation, test equipment

3. Structure and Composition

Clock buffers/drivers typically consist of:

  • Input receivers (single-ended or differential)
  • Internal amplification stages
  • Output drivers with controlled impedance
  • Power supply decoupling structures
  • Thermal management pads (in QFN/SSOP packages)
They are fabricated using CMOS, Bipolar, or SiGe processes to optimize speed and noise performance.

4. Key Technical Specifications

Parameter Description Importance
Max Operating Frequency Up to 1.2 GHz (CMOS), 3.2 GHz (SiGe) Determines application suitability for high-speed systems
Additive Phase Jitter 0.05 ps RMS to 1 ps RMS Impacts timing precision in data converters
Propagation Delay 50 ps to 5 ns Critical in synchronized multi-channel systems
Output Voltage Levels LVCMOS, LVDS, HSTL, etc. Ensures compatibility with downstream circuits
Supply Voltage 1.8V to 5V Affects power consumption and integration

5. Application Areas

  • Telecommunications: 5G base stations, optical transceivers
  • Computing: Servers, workstations, high-end PCs
  • Industrial: PLCs, motor controllers, test instruments
  • Automotive: ADAS clock synchronization, infotainment systems
Case Study: In 5G massive MIMO systems, low-jitter clock drivers ensure phase coherence across 64+ antenna elements.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Specifications
TI (Texas Instruments) CDCE62005 3.2 GHz LVDS driver, 0.1 ps RMS jitter
Analog Devices ADCLK846 16-output clock buffer, 1.6 GHz bandwidth
STMicroelectronics DF1610S 1.8V/3.3V dual supply buffer, 8 outputs
ON Semiconductor MC100EP195 Differential ECL buffer, 2.5 GHz operation

7. Selection Recommendations

Key considerations:

  • Match output type to receiver requirements (LVDS/CML/LVCMOS)
  • Calculate required fan-out capacity with voltage margin
  • Specify jitter budget (e.g., <0.3 ps RMS for 10 Gbps SerDes)
  • Consider temperature stability (-40 C to +125 C automotive grade)
  • Optimize package size vs. thermal dissipation needs

8. Industry Trends

Future developments include:

  • Sub-100 fs jitter performance using advanced CMOS processes
  • Integration with PLL/VCO for clock generation
  • Multi-die packaging for hybrid signal conditioning
  • Energy-efficient designs for battery-powered IoT devices
  • Automotive-grade ICs with AEC-Q100 qualification

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