Clock/Timing - Clock Buffers, Drivers

Image Part Number Description / PDF Quantity Rfq
CY29946AIT

CY29946AIT

Rochester Electronics

LOW SKEW CLOCK DRIVER

2000

CY2V9950AC

CY2V9950AC

Rochester Electronics

PLL BASED CLOCK DRIVER

8000

CY29946AI

CY29946AI

Rochester Electronics

LOW SKEW CLOCK DRIVER

7008

CY2309ESXC-1H

CY2309ESXC-1H

Rochester Electronics

PLL BASED CLOCK DRIVER

4390

CY24904ZXCT

CY24904ZXCT

Rochester Electronics

CLOCKS

10000

CY29658AI

CY29658AI

Rochester Electronics

PLL BASED CLOCK DRIVER

1954

CY2548C004T

CY2548C004T

Rochester Electronics

CLOCKS

236

DS0026CH

DS0026CH

Rochester Electronics

CLOCK DRIVER, BIPOLAR, MBCY8

748

CY2304NZZC-1

CY2304NZZC-1

Rochester Electronics

LOW SKEW CLOCK DRIVER

1611

CY29947AI

CY29947AI

Rochester Electronics

LOW SKEW CLOCK DRIVER

1412

DS0026H/883

DS0026H/883

Rochester Electronics

DUAL MARKED (7800802GA)

166

CY2309ESXC-1

CY2309ESXC-1

Rochester Electronics

PLL BASED CLOCK DRIVER

4426

Clock/Timing - Clock Buffers, Drivers

1. Overview

Clock buffers and drivers are integrated circuits (ICs) designed to distribute clock signals in electronic systems. They amplify, condition, and route timing signals to multiple destinations while minimizing skew, jitter, and signal degradation. These components are critical in synchronizing operations across processors, memory modules, communication interfaces, and other timing-sensitive circuits. Their importance spans industries such as telecommunications, automotive, and high-performance computing.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Clock Buffers Single-input, multiple-output devices with low phase noise and skew CPU clock distribution, FPGA systems
Clock Drivers High-drive capability for fan-out applications Networking switches, server motherboards
Differential Clock Buffers Supports LVDS, HCSL, and CML signal types High-speed ADC/DAC systems, RF transceivers
Programmable Clock Buffers Configurable output frequency/division ratios Industrial automation, test equipment

3. Structure and Composition

Clock buffers/drivers typically consist of:

  • Input receivers (single-ended or differential)
  • Internal amplification stages
  • Output drivers with controlled impedance
  • Power supply decoupling structures
  • Thermal management pads (in QFN/SSOP packages)
They are fabricated using CMOS, Bipolar, or SiGe processes to optimize speed and noise performance.

4. Key Technical Specifications

Parameter Description Importance
Max Operating Frequency Up to 1.2 GHz (CMOS), 3.2 GHz (SiGe) Determines application suitability for high-speed systems
Additive Phase Jitter 0.05 ps RMS to 1 ps RMS Impacts timing precision in data converters
Propagation Delay 50 ps to 5 ns Critical in synchronized multi-channel systems
Output Voltage Levels LVCMOS, LVDS, HSTL, etc. Ensures compatibility with downstream circuits
Supply Voltage 1.8V to 5V Affects power consumption and integration

5. Application Areas

  • Telecommunications: 5G base stations, optical transceivers
  • Computing: Servers, workstations, high-end PCs
  • Industrial: PLCs, motor controllers, test instruments
  • Automotive: ADAS clock synchronization, infotainment systems
Case Study: In 5G massive MIMO systems, low-jitter clock drivers ensure phase coherence across 64+ antenna elements.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Specifications
TI (Texas Instruments) CDCE62005 3.2 GHz LVDS driver, 0.1 ps RMS jitter
Analog Devices ADCLK846 16-output clock buffer, 1.6 GHz bandwidth
STMicroelectronics DF1610S 1.8V/3.3V dual supply buffer, 8 outputs
ON Semiconductor MC100EP195 Differential ECL buffer, 2.5 GHz operation

7. Selection Recommendations

Key considerations:

  • Match output type to receiver requirements (LVDS/CML/LVCMOS)
  • Calculate required fan-out capacity with voltage margin
  • Specify jitter budget (e.g., <0.3 ps RMS for 10 Gbps SerDes)
  • Consider temperature stability (-40 C to +125 C automotive grade)
  • Optimize package size vs. thermal dissipation needs

8. Industry Trends

Future developments include:

  • Sub-100 fs jitter performance using advanced CMOS processes
  • Integration with PLL/VCO for clock generation
  • Multi-die packaging for hybrid signal conditioning
  • Energy-efficient designs for battery-powered IoT devices
  • Automotive-grade ICs with AEC-Q100 qualification

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