Clock/Timing - Clock Buffers, Drivers

Image Part Number Description / PDF Quantity Rfq
5PB1216NDGK8

5PB1216NDGK8

Renesas Electronics America

VFQFPN 3.00X3.00X0.90 MM, 0.40MM

0

8SLVD2104NBGI/W

8SLVD2104NBGI/W

Renesas Electronics America

VFQFPN 5.00X5.00X0.80 MM, 0.50MM

0

8RCG0412NLGI

8RCG0412NLGI

Renesas Electronics America

NETWORK TIMING

0

5PB1106PGGI8

5PB1106PGGI8

Renesas Electronics America

MIXED SIGNAL 14-TSSOP PGG14

0

5PB1216NDGK

5PB1216NDGK

Renesas Electronics America

VFQFPN 3.00X3.00X0.90 MM, 0.40MM

0

5PB1104CMT18

5PB1104CMT18

Renesas Electronics America

COL 2.00X2.00X0.75 MM, 0.50MM PI

0

8535AGLF

8535AGLF

Renesas Electronics America

TSSOP 6.50X4.40X1.00 MM, 0.65MM

0

74FCT38072SDCGI8

74FCT38072SDCGI8

Renesas Electronics America

SOIC 4.90X3.90X1.50 MM, 1.27MM P

0

5PB1104PGGI8

5PB1104PGGI8

Renesas Electronics America

TSSOP 3.10X4.40X1.00 MM, 0.65MM

0

8S89874BKILF

8S89874BKILF

Renesas Electronics America

VFQFPN 3.00X3.00X1.00 MM, 0.50MM

0

553SCMGI8

553SCMGI8

Renesas Electronics America

COL 2.00X2.00X0.50 MM, 0.50MM PI

0

8RP1204NLGI

8RP1204NLGI

Renesas Electronics America

NETWORK TIMING

0

5P83908PGGK8

5P83908PGGK8

Renesas Electronics America

TSSOP 6.50X4.40X1.00 MM, 0.65MM

0

5PB1108CMGK8

5PB1108CMGK8

Renesas Electronics America

COL 2.50X2.50X0.50 MM, 0.40MM PI

0

5PB1106CMGI8

5PB1106CMGI8

Renesas Electronics America

MIXED SIGNAL 8-COL 2X2X0.5 CMG8

0

8SLVP2104ANBGI

8SLVP2104ANBGI

Renesas Electronics America

VFQFPN 5.00X5.00X0.80 MM, 0.50MM

0

524SCMGI8

524SCMGI8

Renesas Electronics America

COL 2.00X2.00X0.50 MM, 0.50MM PI

0

524SDCGI8

524SDCGI8

Renesas Electronics America

SOIC 4.90X3.90X1.50 MM, 1.27MM P

0

853S310CVILFT

853S310CVILFT

Renesas Electronics America

PLCC 11.50X11.50X3.63 MM, 1.27MM

0

8P79208NLGI

8P79208NLGI

Renesas Electronics America

NETWORK TIMING

0

Clock/Timing - Clock Buffers, Drivers

1. Overview

Clock buffers and drivers are integrated circuits (ICs) designed to distribute clock signals in electronic systems. They amplify, condition, and route timing signals to multiple destinations while minimizing skew, jitter, and signal degradation. These components are critical in synchronizing operations across processors, memory modules, communication interfaces, and other timing-sensitive circuits. Their importance spans industries such as telecommunications, automotive, and high-performance computing.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Clock Buffers Single-input, multiple-output devices with low phase noise and skew CPU clock distribution, FPGA systems
Clock Drivers High-drive capability for fan-out applications Networking switches, server motherboards
Differential Clock Buffers Supports LVDS, HCSL, and CML signal types High-speed ADC/DAC systems, RF transceivers
Programmable Clock Buffers Configurable output frequency/division ratios Industrial automation, test equipment

3. Structure and Composition

Clock buffers/drivers typically consist of:

  • Input receivers (single-ended or differential)
  • Internal amplification stages
  • Output drivers with controlled impedance
  • Power supply decoupling structures
  • Thermal management pads (in QFN/SSOP packages)
They are fabricated using CMOS, Bipolar, or SiGe processes to optimize speed and noise performance.

4. Key Technical Specifications

Parameter Description Importance
Max Operating Frequency Up to 1.2 GHz (CMOS), 3.2 GHz (SiGe) Determines application suitability for high-speed systems
Additive Phase Jitter 0.05 ps RMS to 1 ps RMS Impacts timing precision in data converters
Propagation Delay 50 ps to 5 ns Critical in synchronized multi-channel systems
Output Voltage Levels LVCMOS, LVDS, HSTL, etc. Ensures compatibility with downstream circuits
Supply Voltage 1.8V to 5V Affects power consumption and integration

5. Application Areas

  • Telecommunications: 5G base stations, optical transceivers
  • Computing: Servers, workstations, high-end PCs
  • Industrial: PLCs, motor controllers, test instruments
  • Automotive: ADAS clock synchronization, infotainment systems
Case Study: In 5G massive MIMO systems, low-jitter clock drivers ensure phase coherence across 64+ antenna elements.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Specifications
TI (Texas Instruments) CDCE62005 3.2 GHz LVDS driver, 0.1 ps RMS jitter
Analog Devices ADCLK846 16-output clock buffer, 1.6 GHz bandwidth
STMicroelectronics DF1610S 1.8V/3.3V dual supply buffer, 8 outputs
ON Semiconductor MC100EP195 Differential ECL buffer, 2.5 GHz operation

7. Selection Recommendations

Key considerations:

  • Match output type to receiver requirements (LVDS/CML/LVCMOS)
  • Calculate required fan-out capacity with voltage margin
  • Specify jitter budget (e.g., <0.3 ps RMS for 10 Gbps SerDes)
  • Consider temperature stability (-40 C to +125 C automotive grade)
  • Optimize package size vs. thermal dissipation needs

8. Industry Trends

Future developments include:

  • Sub-100 fs jitter performance using advanced CMOS processes
  • Integration with PLL/VCO for clock generation
  • Multi-die packaging for hybrid signal conditioning
  • Energy-efficient designs for battery-powered IoT devices
  • Automotive-grade ICs with AEC-Q100 qualification

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