Clock/Timing - Application Specific

Image Part Number Description / PDF Quantity Rfq
CY2304NZZXI-1

CY2304NZZXI-1

Cypress Semiconductor

IC CLK ZDB 4OUT 140MHZ 8TSSOP

1104

CY2304NZZXC-1T

CY2304NZZXC-1T

Cypress Semiconductor

IC CLK ZDB 4OUT 140MHZ 8TSSOP

3128

CY2304NZZXC-1

CY2304NZZXC-1

Cypress Semiconductor

IC CLK ZDB 4OUT 140MHZ 8TSSOP

441

CY2304NZZXI-1T

CY2304NZZXI-1T

Cypress Semiconductor

IC CLK ZDB 4OUT 140MHZ 8TSSOP

3772

CY28410ZXC

CY28410ZXC

Cypress Semiconductor

IC CLK GEN CPU 266MHZ 2CIRC

0

CY28441ZXC

CY28441ZXC

Cypress Semiconductor

IC CLK GEN CPU 133MHZ 2CIRC

0

CY28416OXC

CY28416OXC

Cypress Semiconductor

IC CLK GEN CPU 266MHZ 2CIRC 48SS

0

CY28517ZXCT

CY28517ZXCT

Cypress Semiconductor

IC PCI EXPRESS CLK GEN 28-TSSOP

0

CY28346ZXC

CY28346ZXC

Cypress Semiconductor

IC CLK FREQ SYNC CPU 200MHZ

0

CY2310ANZPVXI-1T

CY2310ANZPVXI-1T

Cypress Semiconductor

IC CLK BUFF 10OUT SDRAM 28SSOP

0

CY28411ZXCT

CY28411ZXCT

Cypress Semiconductor

IC CLK GEN CPU 266MHZ 2CIRC

0

CY28RS480ZXC

CY28RS480ZXC

Cypress Semiconductor

IC CLK GEN CPU 200MHZ 2CIRC

0

CY22800FXC-030A

CY22800FXC-030A

Cypress Semiconductor

IC PROG CLOCK GEN 8-SOIC

0

CY28416OXCT

CY28416OXCT

Cypress Semiconductor

IC CLK GEN CPU 266MHZ 2CIRC 48SS

0

CY28409ZXCT

CY28409ZXCT

Cypress Semiconductor

IC CLK FREQ SYNC CPU 400MHZ

0

CY28410OXCT

CY28410OXCT

Cypress Semiconductor

IC CLK GEN CPU 266MHZ 2CIRC

0

CY2310ANZPVXI-1

CY2310ANZPVXI-1

Cypress Semiconductor

IC CLK BUFF 10OUT SDRAM 28SSOP

0

CY28346OXC

CY28346OXC

Cypress Semiconductor

IC CLK FREQ SYNC CPU 200MHZ

0

CY24292LFXIT

CY24292LFXIT

Cypress Semiconductor

IC CLOCK BUFFER 32QFN

0

W40S11-02H

W40S11-02H

Cypress Semiconductor

IC CLK BUFF 10OUT SDRAM 28SSOP

0

Clock/Timing - Application Specific

1. Overview

Application-Specific Clock/Timing ICs are specialized semiconductor devices designed to generate, distribute, and manage precise timing signals for targeted system requirements. Unlike general-purpose timing solutions, these ICs integrate optimized architectures for specific performance metrics such as ultra-low jitter, high-frequency stability, or specialized synchronization protocols. They play a critical role in ensuring system reliability, data integrity, and operational efficiency across modern electronics, from telecommunications infrastructure to automotive control systems.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Real-Time Clocks (RTC)Low-power timekeeping with calendar functions, often integrated with memoryComputers, smart meters, medical devices
Clock GeneratorsMulti-output frequency synthesis with programmable phase alignmentNetworking equipment, FPGAs, servers
Jitter AttenuatorsPhase noise reduction using advanced PLL architectures5G base stations, high-speed transceivers
Fanout BuffersSignal replication with skew control and impedance matchingIndustrial automation, PCIe systems
Clock ControllersDynamic frequency switching and redundancy managementAutomotive ADAS, aerospace systems

3. Structure and Composition

Typical devices feature:

  • Package Types: QFN, BGA, TSSOP (sizes from 2x2mm to 14x14mm)
  • Core Components: Crystal oscillator interface, fractional-N PLL, programmable dividers, LVDS/CML output drivers
  • Specialized Circuits: Spread-spectrum control, failover multiplexers, temperature compensation modules
  • Power Management: Multiple voltage domains, low-dropout regulators for analog/digital isolation

4. Key Technical Specifications

ParameterSignificanceTypical Values
Frequency RangeDetermines application suitability1kHz 1GHz
Phase Jitter (RMS)Impacts signal integrity in high-speed systems50fs 5ps
Power Supply RangeAffects system design flexibility1.8V 5.5V
Operating TemperatureDefines environmental robustness-40 C to +125 C
Phase Noise @1MHz OffsetCritical for RF/wireless applications-155dBc/Hz

5. Application Fields

  • Telecommunications: 5G massive MIMO arrays, optical transceivers
  • Industrial: Programmable logic controllers (PLCs), precision test equipment
  • Automotive: Advanced driver assistance systems (ADAS), vehicle networking
  • Consumer Electronics: High-resolution displays, AR/VR headsets

6. Leading Manufacturers and Products

VendorProduct SeriesKey Features
TI (Texas Instruments)CDCM62xx3.2GHz clock generator with 50fs jitter
STMicroelectronicsM41Txx RTC 2ppm accuracy with embedded EEPROM
Microchip TechnologyZL303xxIEEE 1588 boundary clock synchronization
Analog DevicesHMC704414-output jitter attenuator for RF systems

7. Selection Guidelines

  • Application Requirements: Prioritize jitter specifications for communications vs. power consumption for portable devices
  • Frequency Precision: Use MEMS-based oscillators for vibration resistance in automotive applications
  • Environmental Factors: Select industrial-grade (-40 to +85 C) for outdoor equipment
  • Integration Level: Combine clock generation + buffering in single chip for space-constrained designs
  • Compliance: Verify automotive (AEC-Q100), aerospace (ECSS) certifications

8. Industry Trends

Emerging directions include:

  • Integration of AI-driven phase calibration algorithms
  • Development of chip-scale atomic clock (CSAC) technology for sub-ppb stability
  • Adoption of 3D packaging to minimize parasitic capacitance
  • Increasing demand for multi-standard timing solutions (5G+GNSS+Ethernet)
  • Growth of energy-harvesting RTC ICs for IoT edge devices
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