Clock/Timing - Application Specific

Image	Part Number	Description / PDF	Quantity	Rfq
	ICS557GI-03 Renesas Electronics America	IC CLK SOURCE PCI EXPRSS 16TSSOP	0
	87604AGILF Renesas Electronics America	IC CLK MULT/ZD BUFFER 28-TSSOP	0
	CSPT855PGG8 Renesas Electronics America	IC CLK BUF DDR 220MHZ 1CIRC	0
	IDTCV132BPVG Renesas Electronics America	IC FLEXPC CLK PROGR P4 56-SSOP	0
	9FG1201HFLF Renesas Electronics America	IC FREQUENCY GENERATOR 56-SSOP	0
	82V3285AEQG8 Renesas Electronics America	IC PLL WAN SE STRATUM 100TQFP	0
	ICS953202BFT Renesas Electronics America	IC SYSTEM CLK CHIP AMD-K8 56SSOP	0
	ICS9LRS3187AKLF Renesas Electronics America	IC TIMING CTRL HUB PROG 32MLF	0
	932S208DFLFT Renesas Electronics America	IC TIMING HUB CTRL PROGR 56-SSOP	0
	CSPT857DBVG Renesas Electronics America	IC CLK BUF DDR 220MHZ 1CIRC	0
	ICS954306BGT Renesas Electronics America	IC TIMING CTRL HUB P4 64-TSSOP	0
	IDTCV145NLG8 Renesas Electronics America	IC CLK BUF CPU 400MHZ 1CIRC	0
	82V3355TFG8 Renesas Electronics America	IC PLL WAN SYNC ETH 64-TQFP	0
	952906BFLF Renesas Electronics America	IC CLOCK CTRL HUB P4 48SSOP	0
	CSPT857CPAG8 Renesas Electronics America	IC CLK BUF DDR 220MHZ 1CIRC	0
	ICS9FG108DFILF Renesas Electronics America	IC FREQ TIMING GENERATOR 48-SSOP	0
	IDTCV115FPVG8 Renesas Electronics America	IC FLEXPC CLK PROGR P4 56-SSOP	0
	5P61006PGGI8 Renesas Electronics America	IC BUFFER ZD DDR2/800 8-TSSOP	0
	ICS9EX21501AKLFT Renesas Electronics America	IC FANOUT/BUFFER DIFF 64QFPN	0
	93716BFLF Renesas Electronics America	IC CLK BUF DDR 233MHZ 1CIRC	0

Clock/Timing - Application Specific

1. Overview

Application-Specific Clock/Timing ICs are specialized semiconductor devices designed to generate, distribute, and manage precise timing signals for targeted system requirements. Unlike general-purpose timing solutions, these ICs integrate optimized architectures for specific performance metrics such as ultra-low jitter, high-frequency stability, or specialized synchronization protocols. They play a critical role in ensuring system reliability, data integrity, and operational efficiency across modern electronics, from telecommunications infrastructure to automotive control systems.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Real-Time Clocks (RTC)	Low-power timekeeping with calendar functions, often integrated with memory	Computers, smart meters, medical devices
Clock Generators	Multi-output frequency synthesis with programmable phase alignment	Networking equipment, FPGAs, servers
Jitter Attenuators	Phase noise reduction using advanced PLL architectures	5G base stations, high-speed transceivers
Fanout Buffers	Signal replication with skew control and impedance matching	Industrial automation, PCIe systems
Clock Controllers	Dynamic frequency switching and redundancy management	Automotive ADAS, aerospace systems

3. Structure and Composition

Typical devices feature:

Package Types: QFN, BGA, TSSOP (sizes from 2x2mm to 14x14mm)
Core Components: Crystal oscillator interface, fractional-N PLL, programmable dividers, LVDS/CML output drivers
Specialized Circuits: Spread-spectrum control, failover multiplexers, temperature compensation modules
Power Management: Multiple voltage domains, low-dropout regulators for analog/digital isolation

4. Key Technical Specifications

Parameter	Significance	Typical Values
Frequency Range	Determines application suitability	1kHz 1GHz
Phase Jitter (RMS)	Impacts signal integrity in high-speed systems	50fs 5ps
Power Supply Range	Affects system design flexibility	1.8V 5.5V
Operating Temperature	Defines environmental robustness	-40 C to +125 C
Phase Noise @1MHz Offset	Critical for RF/wireless applications	-155dBc/Hz

5. Application Fields

Telecommunications: 5G massive MIMO arrays, optical transceivers
Industrial: Programmable logic controllers (PLCs), precision test equipment
Automotive: Advanced driver assistance systems (ADAS), vehicle networking
Consumer Electronics: High-resolution displays, AR/VR headsets

6. Leading Manufacturers and Products

Vendor	Product Series	Key Features
TI (Texas Instruments)	CDCM62xx	3.2GHz clock generator with 50fs jitter
STMicroelectronics	M41Txx RTC	2ppm accuracy with embedded EEPROM
Microchip Technology	ZL303xx	IEEE 1588 boundary clock synchronization
Analog Devices	HMC7044	14-output jitter attenuator for RF systems

7. Selection Guidelines

Application Requirements: Prioritize jitter specifications for communications vs. power consumption for portable devices
Frequency Precision: Use MEMS-based oscillators for vibration resistance in automotive applications
Environmental Factors: Select industrial-grade (-40 to +85 C) for outdoor equipment
Integration Level: Combine clock generation + buffering in single chip for space-constrained designs
Compliance: Verify automotive (AEC-Q100), aerospace (ECSS) certifications

8. Industry Trends

Emerging directions include:

Integration of AI-driven phase calibration algorithms
Development of chip-scale atomic clock (CSAC) technology for sub-ppb stability
Adoption of 3D packaging to minimize parasitic capacitance
Increasing demand for multi-standard timing solutions (5G+GNSS+Ethernet)
Growth of energy-harvesting RTC ICs for IoT edge devices