Clock/Timing - Application Specific

Part Number	Description / PDF	Quantity
9FG104EGLF Renesas Electronics America	IC FREQ TIMING GENERATOR 28TSSOP	24
9EPRS525AGLFT Renesas Electronics America	IC EMBEDDED PC MAIN CLK 56TSSOP	0
9ZXL0831EKKLF Renesas Electronics America	DB800ZL 105C	0
9DBL0841BKILF Renesas Electronics America	IC CLK FANOUT/BUFF ZD 48VFQFPN	692
9FGU0231AKLFT Renesas Electronics America	VFQFPN 4.00X4.00X0.90 MM, 0.50MM	0
9FGU0441AKLF Renesas Electronics America	IC CLK GEN PCIE 4OP 1.5V 32VQFPN	0
9ZXL1231AKLFT Renesas Electronics America	IC Z-BUFFER LOW POWER 64QFN	11057
9DMU0141AKILF Renesas Electronics America	IC MUX PCIE 2:1 1.5V 16VFQFPN	0
5V41236PGG Renesas Electronics America	IC CLK GEN SPRED SPECTRM 20TSSOP	269
9DBU0941AKLF Renesas Electronics America	IC BUFFER 9OUTPUT 1.5V 48MLF	0
95V847AGLF Renesas Electronics America	IC CLK BUF DDR 233MHZ 1CIRC	0
9DBU0831AKLF Renesas Electronics America	IC BUFFER 8OUTPUT 1.5V 48MLF	0
9DBU0431AKLFT Renesas Electronics America	VFQFPN 5.00X5.00X0.90 MM, 0.50MM	0
9FGL0641AKILF Renesas Electronics America	IC CLOCK GENERATOR 3.3V	133
9ZX21201AKLF Renesas Electronics America	IC Z-BUFFER 12OUT DIFF 64MLF	0
9FGV0831CKLF Renesas Electronics America	IC CLOCK GENERATOR 48MLF	0
9DB401CGLFT Renesas Electronics America	IC BUFFER 4OUTPUT DIFF 28-TSSOP	228
5V41064NLG8 Renesas Electronics America	IC CLOCK BUFFER ZD 2.5V 16QFN	0
9LPRS501SGLFT Renesas Electronics America	IC CK505 VREG RES 64-TSSOP	598
9FG108EFLF Renesas Electronics America	IC FREQ TIMING GENERATOR 48SSOP	0

Clock/Timing - Application Specific

1. Overview

Application-Specific Clock/Timing ICs are specialized semiconductor devices designed to generate, distribute, and manage precise timing signals for targeted system requirements. Unlike general-purpose timing solutions, these ICs integrate optimized architectures for specific performance metrics such as ultra-low jitter, high-frequency stability, or specialized synchronization protocols. They play a critical role in ensuring system reliability, data integrity, and operational efficiency across modern electronics, from telecommunications infrastructure to automotive control systems.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Real-Time Clocks (RTC)	Low-power timekeeping with calendar functions, often integrated with memory	Computers, smart meters, medical devices
Clock Generators	Multi-output frequency synthesis with programmable phase alignment	Networking equipment, FPGAs, servers
Jitter Attenuators	Phase noise reduction using advanced PLL architectures	5G base stations, high-speed transceivers
Fanout Buffers	Signal replication with skew control and impedance matching	Industrial automation, PCIe systems
Clock Controllers	Dynamic frequency switching and redundancy management	Automotive ADAS, aerospace systems

3. Structure and Composition

Typical devices feature:

Package Types: QFN, BGA, TSSOP (sizes from 2x2mm to 14x14mm)
Core Components: Crystal oscillator interface, fractional-N PLL, programmable dividers, LVDS/CML output drivers
Specialized Circuits: Spread-spectrum control, failover multiplexers, temperature compensation modules
Power Management: Multiple voltage domains, low-dropout regulators for analog/digital isolation

4. Key Technical Specifications

Parameter	Significance	Typical Values
Frequency Range	Determines application suitability	1kHz 1GHz
Phase Jitter (RMS)	Impacts signal integrity in high-speed systems	50fs 5ps
Power Supply Range	Affects system design flexibility	1.8V 5.5V
Operating Temperature	Defines environmental robustness	-40 C to +125 C
Phase Noise @1MHz Offset	Critical for RF/wireless applications	-155dBc/Hz

5. Application Fields

Telecommunications: 5G massive MIMO arrays, optical transceivers
Industrial: Programmable logic controllers (PLCs), precision test equipment
Automotive: Advanced driver assistance systems (ADAS), vehicle networking
Consumer Electronics: High-resolution displays, AR/VR headsets

6. Leading Manufacturers and Products

Vendor	Product Series	Key Features
TI (Texas Instruments)	CDCM62xx	3.2GHz clock generator with 50fs jitter
STMicroelectronics	M41Txx RTC	2ppm accuracy with embedded EEPROM
Microchip Technology	ZL303xx	IEEE 1588 boundary clock synchronization
Analog Devices	HMC7044	14-output jitter attenuator for RF systems

7. Selection Guidelines

Application Requirements: Prioritize jitter specifications for communications vs. power consumption for portable devices
Frequency Precision: Use MEMS-based oscillators for vibration resistance in automotive applications
Environmental Factors: Select industrial-grade (-40 to +85 C) for outdoor equipment
Integration Level: Combine clock generation + buffering in single chip for space-constrained designs
Compliance: Verify automotive (AEC-Q100), aerospace (ECSS) certifications

8. Industry Trends

Emerging directions include:

Integration of AI-driven phase calibration algorithms
Development of chip-scale atomic clock (CSAC) technology for sub-ppb stability
Adoption of 3D packaging to minimize parasitic capacitance
Increasing demand for multi-standard timing solutions (5G+GNSS+Ethernet)
Growth of energy-harvesting RTC ICs for IoT edge devices