Clock/Timing - Application Specific

Part Number	Description / PDF	Quantity
9DB803DFILFT Renesas Electronics America	IC BUFFER 8OUTPUT DIFF 48-SSOP	0
9FGV1006BQ534LTGI Renesas Electronics America	LGA 3.00X3.00X1.10 MM, 0.50MM PI	0
9FGU0431AKLF Renesas Electronics America	IC CLK GEN PCIE 4OP 1.5V 32VQFPN	0
9DBV0231AKLF Renesas Electronics America	IC CLOCK BUFFER 24MLF	0
8S58021AKILFT Renesas Electronics America	IC CLK BUF 2:6 3.2GHZ 16VFQFPN	0
98ULPA877AKILF Renesas Electronics America	IC CLOCK DRIVER 1.8V LP 40VFQFPN	43
894D115AGI-04LFT Renesas Electronics America	IC CLK/DATA RECOVERY 20-TSSOP	0
9LPRS477DKLF Renesas Electronics America	MULTIMKT-TIMING	0
557G-03LF Renesas Electronics America	IC CLOCK SOURCE PCI 16-TSSOP	87
9LRS3165BGLF Renesas Electronics America	IC PC MAIN CLOCK 64TSSOP	0
5V41235PGG Renesas Electronics America	IC CLK GEN SPRED SPECTRM 16TSSOP	142
9FGV0441AKILFT Renesas Electronics America	IC CLOCK GENERATOR 32VFQFPN	0
841S101EGILF Renesas Electronics America	IC CLK GENERATOR PLL 16-TSSOP	133
9DB633AGILF Renesas Electronics America	IC CLK FANOUT/BUFF ZD 28TSSOP	76
9FG830AGLFT Renesas Electronics America	IC FREQ GENERATOR 48TSSOP	0
9VRS4338DKLFT Renesas Electronics America	IC CLOCK TIMING 200MHZ 48VFQFPN	1561
932SQL420BKLF Renesas Electronics America	IC CLOCK SYNTHESIZER 64QFN	0
9DB803DGLFT Renesas Electronics America	IC BUFFER 8OUTPUT DIFF 48-TSSOP	1738
954101DGLF Renesas Electronics America	IC TIMING CTRL HUB P4 56-TSSOP	0
9ZXL1530DKILF Renesas Electronics America	DB1500ZL OEM DERIV	0

Clock/Timing - Application Specific

1. Overview

Application-Specific Clock/Timing ICs are specialized semiconductor devices designed to generate, distribute, and manage precise timing signals for targeted system requirements. Unlike general-purpose timing solutions, these ICs integrate optimized architectures for specific performance metrics such as ultra-low jitter, high-frequency stability, or specialized synchronization protocols. They play a critical role in ensuring system reliability, data integrity, and operational efficiency across modern electronics, from telecommunications infrastructure to automotive control systems.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Real-Time Clocks (RTC)	Low-power timekeeping with calendar functions, often integrated with memory	Computers, smart meters, medical devices
Clock Generators	Multi-output frequency synthesis with programmable phase alignment	Networking equipment, FPGAs, servers
Jitter Attenuators	Phase noise reduction using advanced PLL architectures	5G base stations, high-speed transceivers
Fanout Buffers	Signal replication with skew control and impedance matching	Industrial automation, PCIe systems
Clock Controllers	Dynamic frequency switching and redundancy management	Automotive ADAS, aerospace systems

3. Structure and Composition

Typical devices feature:

Package Types: QFN, BGA, TSSOP (sizes from 2x2mm to 14x14mm)
Core Components: Crystal oscillator interface, fractional-N PLL, programmable dividers, LVDS/CML output drivers
Specialized Circuits: Spread-spectrum control, failover multiplexers, temperature compensation modules
Power Management: Multiple voltage domains, low-dropout regulators for analog/digital isolation

4. Key Technical Specifications

Parameter	Significance	Typical Values
Frequency Range	Determines application suitability	1kHz 1GHz
Phase Jitter (RMS)	Impacts signal integrity in high-speed systems	50fs 5ps
Power Supply Range	Affects system design flexibility	1.8V 5.5V
Operating Temperature	Defines environmental robustness	-40 C to +125 C
Phase Noise @1MHz Offset	Critical for RF/wireless applications	-155dBc/Hz

5. Application Fields

Telecommunications: 5G massive MIMO arrays, optical transceivers
Industrial: Programmable logic controllers (PLCs), precision test equipment
Automotive: Advanced driver assistance systems (ADAS), vehicle networking
Consumer Electronics: High-resolution displays, AR/VR headsets

6. Leading Manufacturers and Products

Vendor	Product Series	Key Features
TI (Texas Instruments)	CDCM62xx	3.2GHz clock generator with 50fs jitter
STMicroelectronics	M41Txx RTC	2ppm accuracy with embedded EEPROM
Microchip Technology	ZL303xx	IEEE 1588 boundary clock synchronization
Analog Devices	HMC7044	14-output jitter attenuator for RF systems

7. Selection Guidelines

Application Requirements: Prioritize jitter specifications for communications vs. power consumption for portable devices
Frequency Precision: Use MEMS-based oscillators for vibration resistance in automotive applications
Environmental Factors: Select industrial-grade (-40 to +85 C) for outdoor equipment
Integration Level: Combine clock generation + buffering in single chip for space-constrained designs
Compliance: Verify automotive (AEC-Q100), aerospace (ECSS) certifications

8. Industry Trends

Emerging directions include:

Integration of AI-driven phase calibration algorithms
Development of chip-scale atomic clock (CSAC) technology for sub-ppb stability
Adoption of 3D packaging to minimize parasitic capacitance
Increasing demand for multi-standard timing solutions (5G+GNSS+Ethernet)
Growth of energy-harvesting RTC ICs for IoT edge devices