Clock/Timing - Application Specific

Part Number	Description / PDF	Quantity
932S421CGLF Renesas Electronics America	IC PCIE GEN2 MAIN CLOCK 56-TSSOP	0
9ZXL0651EKILF Renesas Electronics America	DB600ZL OEM DERIVATIVE "LITE"	365
9DBV0441AKILF Renesas Electronics America	IC CLOCK BUFFER	856
9LP505-1HGLFT Renesas Electronics America	IC PC MAIN CLOCK CK505 64-TSSOP	1605
9DBV0241AKLFT Renesas Electronics America	IC CLOCK BUFFER	0
932SQ428AKLFT Renesas Electronics America	IC CLK SYNTHESIZER 48MLF	0
557GI-03LFT Renesas Electronics America	IC CLK SOURCE PCI EXPRSS 16TSSOP	2965
9DB1233AGLF Renesas Electronics America	IC CLK FANOUT/BUFF ZD 64TSSOP	1615
9DML4493ANLGI Renesas Electronics America	VFQFPN 5.00X5.00X0.90 MM, 0.50MM	0
9DB233AGILF Renesas Electronics America	IC CLK FANOUT/BUFF ZD 20TSSOP	170
9FGV0841AKILFT Renesas Electronics America	IC CLOCK GENERATOR 48VFQPN	0
9DMU0131AKILF Renesas Electronics America	IC MUX PCIE 2:1 1.5V 16VFQFPN	0
9DB233AGLF Renesas Electronics America	IC CLK FANOUT/BUFF ZD 20TSSOP	0
9DBU0531AKLF Renesas Electronics America	IC BUFFER 5OUTPUT 1.5V 32MLF	490
5V41066PGGI8 Renesas Electronics America	IC CLK GEN SPRED SPECTRM 20TSSOP	0
9DBU0931AKLF Renesas Electronics America	IC BUFFER 9OUTPUT 1.5V 48MLF	0
841S104EGILFT Renesas Electronics America	IC CLOCK GENERATOR PCI 24-TSSOP	0
9DBV0831AKILF Renesas Electronics America	IC CLOCK BUFFER	377
9DBV0431AKLFT Renesas Electronics America	IC CLOCK BUFFER	0
9DB106BGILF Renesas Electronics America	IC CLK FANOUT/BUFF ZD 28TSSOP	105

Clock/Timing - Application Specific

1. Overview

Application-Specific Clock/Timing ICs are specialized semiconductor devices designed to generate, distribute, and manage precise timing signals for targeted system requirements. Unlike general-purpose timing solutions, these ICs integrate optimized architectures for specific performance metrics such as ultra-low jitter, high-frequency stability, or specialized synchronization protocols. They play a critical role in ensuring system reliability, data integrity, and operational efficiency across modern electronics, from telecommunications infrastructure to automotive control systems.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Real-Time Clocks (RTC)	Low-power timekeeping with calendar functions, often integrated with memory	Computers, smart meters, medical devices
Clock Generators	Multi-output frequency synthesis with programmable phase alignment	Networking equipment, FPGAs, servers
Jitter Attenuators	Phase noise reduction using advanced PLL architectures	5G base stations, high-speed transceivers
Fanout Buffers	Signal replication with skew control and impedance matching	Industrial automation, PCIe systems
Clock Controllers	Dynamic frequency switching and redundancy management	Automotive ADAS, aerospace systems

3. Structure and Composition

Typical devices feature:

Package Types: QFN, BGA, TSSOP (sizes from 2x2mm to 14x14mm)
Core Components: Crystal oscillator interface, fractional-N PLL, programmable dividers, LVDS/CML output drivers
Specialized Circuits: Spread-spectrum control, failover multiplexers, temperature compensation modules
Power Management: Multiple voltage domains, low-dropout regulators for analog/digital isolation

4. Key Technical Specifications

Parameter	Significance	Typical Values
Frequency Range	Determines application suitability	1kHz 1GHz
Phase Jitter (RMS)	Impacts signal integrity in high-speed systems	50fs 5ps
Power Supply Range	Affects system design flexibility	1.8V 5.5V
Operating Temperature	Defines environmental robustness	-40 C to +125 C
Phase Noise @1MHz Offset	Critical for RF/wireless applications	-155dBc/Hz

5. Application Fields

Telecommunications: 5G massive MIMO arrays, optical transceivers
Industrial: Programmable logic controllers (PLCs), precision test equipment
Automotive: Advanced driver assistance systems (ADAS), vehicle networking
Consumer Electronics: High-resolution displays, AR/VR headsets

6. Leading Manufacturers and Products

Vendor	Product Series	Key Features
TI (Texas Instruments)	CDCM62xx	3.2GHz clock generator with 50fs jitter
STMicroelectronics	M41Txx RTC	2ppm accuracy with embedded EEPROM
Microchip Technology	ZL303xx	IEEE 1588 boundary clock synchronization
Analog Devices	HMC7044	14-output jitter attenuator for RF systems

7. Selection Guidelines

Application Requirements: Prioritize jitter specifications for communications vs. power consumption for portable devices
Frequency Precision: Use MEMS-based oscillators for vibration resistance in automotive applications
Environmental Factors: Select industrial-grade (-40 to +85 C) for outdoor equipment
Integration Level: Combine clock generation + buffering in single chip for space-constrained designs
Compliance: Verify automotive (AEC-Q100), aerospace (ECSS) certifications

8. Industry Trends

Emerging directions include:

Integration of AI-driven phase calibration algorithms
Development of chip-scale atomic clock (CSAC) technology for sub-ppb stability
Adoption of 3D packaging to minimize parasitic capacitance
Increasing demand for multi-standard timing solutions (5G+GNSS+Ethernet)
Growth of energy-harvesting RTC ICs for IoT edge devices