Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
R6166-02

R6166-02

Harwin

ROUND SPACER M2.5 BRASS 14MM

0

R6165-02

R6165-02

Harwin

ROUND SPACER M2.5 BRASS 12MM

0

R4457-02

R4457-02

Harwin

ROUND STANDOFF M4X0.7 BRASS 1"

0

R4425-02

R4425-02

Harwin

CONNECTOR HARDWARE

0

R6129-02

R6129-02

Harwin

R25-1002002-ND

0

R30-1003902

R30-1003902

Harwin

952-2610-ND

0

R30-6203014

R30-6203014

Harwin

ROUND SPACER M3 ALUMINUM 30MM

0

R30-3012302

R30-3012302

Harwin

HEX STANDOFF M3X0.5 BRASS 23MM

0

R6383-02

R6383-02

Harwin

ROUND SPACER M3 BRASS 1/2"

0

R6162-02

R6162-02

Harwin

ROUND SPACER M2.5 BRASS 6MM

0

R60-3005002

R60-3005002

Harwin

HEX STANDOFF M6 BRASS 50MM

0

R6351-02

R6351-02

Harwin

ROUND STANDOFF M3X0.5 BRASS 1/4"

0

R6307-02

R6307-02

Harwin

ROUND STANDOFF M3X0.5 BRASS 16MM

0

R4483-02

R4483-02

Harwin

ROUND SPACER BRASS 1/2"

0

R40-1001102

R40-1001102

Harwin

HEX STANDOFF M4X0.7 BRASS 11MM

0

R4756-02

R4756-02

Harwin

ROUND STANDOFF 4BA BRASS 7/8"

0

R106742C

R106742C

Harwin

HEX STANDOFF

0

R40-4001202

R40-4001202

Harwin

HEX STANDOFF M4X0.7 BRASS 12MM

0

R30B4002002

R30B4002002

Harwin

HEX STANDOFF

0

R30-3000500

R30-3000500

Harwin

HEX STANDOFF M3X0.5 BRASS 5MM

0

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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