Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
R6693-02

R6693-02

Harwin

HEX STANDOFF 6BA BRASS 1/2"

0

R50-3001602

R50-3001602

Harwin

HEX STANDOFF M5 BRASS 16MM

0

R3510-02

R3510-02

Harwin

HEX STANDOFF M3.5 BRASS 10MM

0

R40-6610800

R40-6610800

Harwin

ROUND SPACER M4 NYLON 8MM

0

R83-1011202

R83-1011202

Harwin

HEX STANDOFF #8-32 BRASS 12MM

0

R6694-02

R6694-02

Harwin

HEX STANDOFF 6BA BRASS 5/8"

0

R40-3012502

R40-3012502

Harwin

HEX STANDOFF M4X0.7 BRASS 25MM

0

R3518-02

R3518-02

Harwin

HEX STANDOFF M3.5 BRASS 18MM

0

R50-3003502

R50-3003502

Harwin

HEX STANDOFF M5 BRASS 35MM

0

R3504-02

R3504-02

Harwin

HEX STANDOFF M3.5 BRASS 4MM

0

R40-6610700

R40-6610700

Harwin

ROUND SPACER M4 NYLON 7MM

0

R20-3000802

R20-3000802

Harwin

HEX STANDOFF M2X0.4 BRASS 8MM

0

R6695-02

R6695-02

Harwin

HEX STANDOFF 6BA BRASS 3/4"

0

R83-1010602

R83-1010602

Harwin

HEX STANDOFF #8-32 BRASS 6MM

0

R40-6611400

R40-6611400

Harwin

ROUND SPACER M4 NYLON 14MM

0

R40-4000502

R40-4000502

Harwin

HEX STANDOFF M4X0.7 BRASS 5MM

0

R83-1011502

R83-1011502

Harwin

HEX STANDOFF #8-32 BRASS 15MM

0

R50-3004002

R50-3004002

Harwin

HEX STANDOFF M5 BRASS 40MM

0

R50-3002002

R50-3002002

Harwin

HEX STANDOFF M5 BRASS 20MM

0

R40-3013002

R40-3013002

Harwin

HEX STANDOFF M4X0.7 BRASS 30MM

0

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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