Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
M2144-3005-SS

M2144-3005-SS

RAF

6MM HEX X 9MM X M3 THD

333

1190-8-S-12

1190-8-S-12

RAF

3/8 RD X 1/2 X .166 ID

300

NAS1829AC4G07

NAS1829AC4G07

RAF

ALUMINUM 1/4 HEX MALE/FEMALE STA

0

NAS1831C4C23

NAS1831C4C23

RAF

STAINLESS STEEL 1/4 HEX FEMALE S

0

4543-632-SS

4543-632-SS

RAF

1/4 HEX X 1-1/16 LENGTH

280

M1502-B-2545-AL

M1502-B-2545-AL

RAF

4.5MM RD X 5MM X M2.5 THD

500

NAS1829C4C07

NAS1829C4C07

RAF

STAINLESS STEEL 1/4 HEX MALE/FEM

113

NAS1829C3B16

NAS1829C3B16

RAF

STAINLESS STEEL 3/16 HEX MALE/FE

125

1124-6-PH

1124-6-PH

RAF

1/4 RD X 1/4 X .140 ID

465

1100-2-B-12

1100-2-B-12

RAF

1/8 RD X 1/8 X .090 ID

455

M1003-3005-S-12

M1003-3005-S-12

RAF

4.5MM RD X 6MM X M3 THD

797

9026-62-B-12

9026-62-B-12

RAF

ROUND SPACER BRASS 2"

40

4535-632-SS

4535-632-SS

RAF

HEX STANDOFF #6-32 SS 9/16"

449

4542-832-S-12

4542-832-S-12

RAF

HEX STANDOFF #8-32 STEEL 1"

423

NAS1831A4B32

NAS1831A4B32

RAF

ALUMINUM 1/4 HEX FEMALE STANDOFF

0

4533-632-SS

4533-632-SS

RAF

HEX STANDOFF #6-32 SS 7/16"

842

3047-B-440-AL-7

3047-B-440-AL-7

RAF

1/4 RD X 1/4 LENGTH

1100

2124-832-AL

2124-832-AL

RAF

1/4 HEX X 1-3/4 LENGTH

197

9006-62-B-12

9006-62-B-12

RAF

ROUND SPACER BRASS 3/4"

44

1173-6-N

1173-6-N

RAF

5_16-ROUND_SPACER

591

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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