Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
M0594-5-AL

M0594-5-AL

RAF

8MM RD X 5MM X 5.3MM ID

628

M1257-3005-AL

M1257-3005-AL

RAF

HEX STANDOFF M3X0.5 ALUM 10MM

2204

M0506-25-SS

M0506-25-SS

RAF

4_5_MM-ROUND_SPACER

81

2120-632-SS

2120-632-SS

RAF

HEX STANDOFF #6-32 SS 1-1/2"

1862

2100-632-AL-7

2100-632-AL-7

RAF

HEX STANDOFF #6-32 ALUMINUM 1/4"

3608

NAS61-4-260

NAS61-4-260

RAF

NYLON UNTHREADED SPACER 1/2 ROUN

0

4003-440-SS

4003-440-SS

RAF

3/16 RD X 3/8 LENGTH

112

M1313-4007-SS

M1313-4007-SS

RAF

6MM HEX X 16MM X M4 THD

200

M2155-3005-SS

M2155-3005-SS

RAF

HEX STANDOFF M3X0.5 SS 20MM

222

1692-440-AL

1692-440-AL

RAF

1/4 RD X 1.00 LENGTH

1726

1158-10-SS

1158-10-SS

RAF

5/16 RD X 7/16 X .192 ID

275

4504T-440-AL

4504T-440-AL

RAF

3/16 HEX X 15/32 LENGTH

465

NAS1831A6E19

NAS1831A6E19

RAF

ALUMINUM 3/8 HEX FEMALE STANDOFF

500

1532-C-4-AL-7

1532-C-4-AL-7

RAF

1/4 RD X 3/16 X .115 ID

1000

M0651-4-AL

M0651-4-AL

RAF

10MM RD X 2MM X 4.3MM ID

300

2254-632-AL

2254-632-AL

RAF

3/8 HEX X 1-1/2 LENGTH

265

NAS1829A6J20

NAS1829A6J20

RAF

ALUMINUM 3/8 HEX MALE/FEMALE STA

0

M0512-3-AL

M0512-3-AL

RAF

4.5MM RD X 13MM X 3.2MM ID

820

2179-632-B-12

2179-632-B-12

RAF

HEX STANDOFF TAPPED THRU

372

NAS1829C6J11

NAS1829C6J11

RAF

STAINLESS STEEL 3/8 HEX MALE/FEM

0

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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