Board Spacers, Standoffs

Part Number	Description / PDF	Quantity
24425 Keystone Electronics Corp.	HEX STANDOFF M2.5X0.45 ALUM 15MM	1911100
13RS040087 Richco, Inc. (Essentra Components)	ROUND SPACER, .200 ID, .430 OD,	2000
M2120-3005-SS RAF	HEX STANDOFF M3X0.5 SS 25MM	28613
13RS062573 Richco, Inc. (Essentra Components)	ROUND SPACER, .386 ID, .625 OD,	1500
13RS125387 Richco, Inc. (Essentra Components)	ROUND SPACER, .380 ID, 1.250 OD,	3000
005423200014 Richco, Inc. (Essentra Components)	ROUND SPACER #8 POLYSTYRENE 6MM	872
1278-10-N RAF	3/4 RD X 3/16 X .192 ID	498
4501T-440-N RAF	3/16 HEX X 9/32 LENGTH	496
13ME015 Richco, Inc. (Essentra Components)	ROUND SPACER, 2.6MM ID, 5MM OD,	900
005457259914 Richco, Inc. (Essentra Components)	ROUND SPACER #10 POLYSTYRENE 6MM	2956
4508-440-SS RAF	HEX STANDOFF #4-40 SS 11/16"	1933
1866-632-N RAF	3/8 RD X 7.00 LENGTH	78
4554-832-N RAF	1/4 HEX X 1-3/4 LENGTH	97
R912-4 Richco, Inc. (Essentra Components)	ROUND SPACER NYLON 1/4"	8735
13RSSR0009 Richco, Inc. (Essentra Components)	ROUND SPACER, .064 ID, .125 OD,	1000
M2140-2545-N RAF	6_MM_HEX_MALE_FEMALE_STANDOFFS	539
13RSSR0322 Richco, Inc. (Essentra Components)	ROUND SPACER, .315 ID, .625 OD,	250
1124-4-SS RAF	ROUND SPACER SS 1/4"	798
2098-440-AL RAF	1/4 HEX X 1/8 LENGTH	3324
13RS025056 Richco, Inc. (Essentra Components)	ROUND SPACER, .140 ID, .250 OD,	995

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

Type	Functional Features	Application Examples
Cylindrical Spacers	Simple tubular design with uniform diameter	PCB layer separation in consumer electronics
Hexagonal Standoffs	6-sided structure for wrench tightening	Industrial equipment panel mounting
Self-clinching Standoffs	Permanent installation with threaded compression	Sheet metal enclosures in servers
Adjustable Spacers	Variable length through threaded adjustment	Prototype development and testing
Insulated Spacers	Non-conductive materials for electrical isolation	High-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

Parameter	Importance
Material Hardness (HV)	Determines wear resistance and load capacity
Thread Engagement Length	Affects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)	Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)	Safety factor in high-voltage applications
Installation Torque Rating	Prevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

Electronics Manufacturing: Server racks, LED displays
Automotive: Engine control units (ECUs), ADAS systems
Aerospace: Satellite PCB mounting, avionics enclosures
Medical Devices: MRI scanner internal structures
Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

Manufacturer	Representative Product
PEM	S-8900 Series self-clinching standoffs
RS Components	486-8826 insulated hexagonal spacers
Mouser Electronics	925206-12 adjustable PCB spacers
McMaster-Carr	91285A102 stainless steel standoffs

7. Selection Recommendations

Evaluate mechanical load requirements vs material strength
Match thread type (UNC/UNF/Metric) with assembly hardware
Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
Select insulated variants for >50V circuits
Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

Miniaturization: Sub-1mm spacers for wearable devices
Material Innovation: Conductive polymer composites for EMI shielding
Smart Integration: Standoffs with embedded strain gauges for structural monitoring
Automated Installation: Self-aligning designs for robotic assembly lines
Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production