Ferrite Beads and Chips

Image Part Number Description / PDF Quantity Rfq
742792902

742792902

Würth Elektronik Midcom

FERRITE BEAD 565 OHM 2SMD 1LN

903

742863147

742863147

Würth Elektronik Midcom

FERRITE BEAD 470 OHM 0603 1LN

45800

74279277

74279277

Würth Elektronik Midcom

FERRITE BEAD 70 OHM 0402 1LN

8640

782963560

782963560

Würth Elektronik Midcom

FERRITE BEAD 56 OHM 1806 1LN

1299

7427927218

7427927218

Würth Elektronik Midcom

FERRITE BEAD 180 OHM 0402 1LN

6832

7427927311

7427927311

Würth Elektronik Midcom

FERRITE BEAD 120 OHM 0402 1LN

138507

742792795

742792795

Würth Elektronik Midcom

FERRITE BEAD 1 KOHM 0402 1LN

0

74279266A

74279266A

Würth Elektronik Midcom

FERRITE BEAD 1 KOHM 0603 1LN

0

742792655

742792655

Würth Elektronik Midcom

FERRITE BEAD 600 OHM 0603 1LN

0

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Frequency Ferrite BeadsOptimized for GHz-range noise suppression, low core loss5G transceivers, RF modules
Low-Frequency Ferrite BeadsEffective at MHz-range filtering, high impedance stabilityPower supplies, motor drives
High-Current ChipsDesigned for >1A applications, thermal stabilityEV battery management systems
Multilayer Ferrite ChipsStacked structure for broadband filteringSmartphones, IoT devices

3. Structure and Composition

Typical construction includes:

  • Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
  • Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
  • Encapsulation: Epoxy or polymer coating for mechanical protection
  • Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

ParameterDescriptionImportance
Impedance (Z)100MHz @ 100 -10k Determines noise suppression efficiency
Rated Current100mA-10AAffects circuit stability under load
Frequency Range1MHz-10GHzDefines operational bandwidth
DC Resistance (DCR)0.1 -20 Impacts power loss and heating
Operating Temp.-55 C to +150 CEnsures reliability in extreme conditions

5. Application Areas

  • Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
  • Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
  • Industrial: PLCs (programmable logic controllers), motor drives
  • Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

ManufacturerKey ProductsSpecifications
MurataBLSH series0.7A, 600 @ 100MHz, EIA 0603
TDKMMZ series3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft0603LS series1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik744300 series2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

  1. Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
  2. Calculate current requirements: Select rated current 20% higher than maximum operating current
  3. Impedance matching: Ensure Z 10 source/load impedance at target frequency
  4. Package constraints: Prioritize chip format for space-limited PCB designs
  5. Environmental factors: Consider temperature rating for automotive/industrial applications
  6. Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

  • Miniaturization: Development of 0201/01005 chip sizes for wearable devices
  • High-frequency performance: Materials enabling stable operation beyond 10GHz
  • Integrated solutions: Combining ferrite beads with capacitors in single packages
  • Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
  • Automotive focus: AEC-Q qualified parts for EV/HEV power systems
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