Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
4221R-4 API Delevan	FERRITE BEAD 85 OHM 2SMD 1LN	2153
SMB2.5R-1 API Delevan	FERRITE BEAD 385 OHM 2SMD 1LN	7113
4221R-3 API Delevan	FERRITE BEAD 42 OHM 2SMD 1LN	0
SMB2.5R-2 API Delevan	FERRITE BEAD 490 OHM 2SMD 1LN	7874
4221R-2 API Delevan	FERRITE BEAD 95 OHM 2SMD 1LN	44882
4222R API Delevan	FERRITE BEAD 54 OHM 2SMD 2LN	421
SMB2.5-2 API Delevan	FERRITE BEAD 490 OHM 2SMD 1LN	700
4221-1 API Delevan	FERRITE BEAD 47 OHM 2SMD 1LN	14
SMB2.5-1 API Delevan	FERRITE BEAD 385 OHM 2SMD 1LN	616
4221R-1 API Delevan	FERRITE BEAD 47 OHM 2SMD 1LN	6568
4221-2 API Delevan	FERRITE BEAD 95 OHM 2SMD 1LN	0
EMI1206R-120 API Delevan	FERRITE BEAD 120 OHM 1206 1LN	0
4211R-7 API Delevan	FERRITE BEAD 216 OHM AXIAL 1LN	0
4211R-18 API Delevan	FERRITE BEAD 112 OHM AXIAL 1LN	0
EMI0603R-220 API Delevan	FERRITE BEAD 220 OHM 0603 1LN	0
4212R-8 API Delevan	FERRITE BEAD 550 OHM RADIAL 1LN	0
EMI0805R-11 API Delevan	FERRITE BEAD 11 OHM 0805 1LN	0
EMI1206R-300 API Delevan	FERRITE BEAD 300 OHM 1206 1LN	0
EMI0805R-2000 API Delevan	FERRITE BEAD 2 KOHM 0805 1LN	0
EMI0603R-80 API Delevan	FERRITE BEAD 80 OHM 0603 1LN	0

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems