Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
MPZ1608Y221BTD25 TDK Corporation	FERRITE BEAD 220 OHM 0603 1LN	11600
MMZ2012Y301BT000 TDK Corporation	FERRITE BEAD 300 OHM 0805 1LN	10375
MAF1005GAD571DT000 TDK Corporation	NOISE SUPPRESSION FILTER FOR AUD	8745
MMZ2012Y300BTD25 TDK Corporation	FERRITE BEAD 30 OHM 0805 1LN	3900
MMZ2012S301AT000 TDK Corporation	FERRITE BEAD 300 OHM 0805 1LN	0
VFS5045SA151 TDK Corporation	NOISE SUPPRESSION FILTER FOR HOM	2965
MPZ1608Y600BTA00 TDK Corporation	FERRITE BEAD 60 OHM 0603 1LN	16409
MMZ1005S241CTD25 TDK Corporation	FERRITE BEAD 240 OHM 0402 1LN	9571
HF70ACC453215-T TDK Corporation	FERRITE BEAD 120 OHM 1812 1LN	1488
MMZ1005AFZ151VT000 TDK Corporation	FERRITE BEAD 150 OHM 0402 1LN	4538
MMZ1608F750BTA00 TDK Corporation	FERRITE BEAD 75 OHM 0603 1LN	3246
MMZ1005Y121CTD25 TDK Corporation	FERRITE BEAD 120 OHM 0402 1LN	20481
HF30ACB322513-T TDK Corporation	FERRITE BEAD 31 OHM 1210 1LN	5184
MMZ2012R150ATD25 TDK Corporation	FERRITE BEAD 15 OHM 0805 1LN	3255
HF70ACB322513-T TDK Corporation	FERRITE BEAD 52 OHM 1210 1LN	8000
MMZ2012S601AT000 TDK Corporation	FERRITE BEAD 600 OHM 0805 1LN	56
MPZ1005F470ETD25 TDK Corporation	FERRITE BEAD 47 OHM 0402 1LN	0
MPZ1608S101ATAH0 TDK Corporation	FERRITE BEAD 100 OHM 0603 1LN	0
MMZ1608S121ATA00 TDK Corporation	FERRITE BEAD 120 OHM 0603 1LN	80947
HF30ACC322513-T TDK Corporation	FERRITE BEAD 31 OHM 1210 1LN	790

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems