Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
KMZ1608YHR102BTD25 TDK Corporation	FERRITE BEAD 1 KOHM 0603 1LN	5705
VAF201610FA-131-1 TDK Corporation	NOISE SUPPRESSION FILTER FOR AUD	1895
HF50ACC201209-TD25 TDK Corporation	FERRITE BEAD 11 OHM 0805 1LN	914
MMZ1608F470BTD25 TDK Corporation	FERRITE BEAD 47 OHM 0603 1LN	11445
MPZ1608S601ATA00 TDK Corporation	FERRITE BEAD 600 OHM 0603 1LN	0
MMZ0603F560ET000 TDK Corporation	FERRITE BEAD 56 OHM 0201 1LN	13906
MMZ1608B121CTAH0 TDK Corporation	FERRITE BEAD 120 OHM 0603 1LN	51983
MMZ0603Y121CT000 TDK Corporation	FERRITE BEAD 120 OHM 0201 1LN	24917
MMZ2012Y102BTD25 TDK Corporation	FERRITE BEAD 1 KOHM 0805 1LN	2144
MMZ1608Y152BTD25 TDK Corporation	FERRITE BEAD 1.5 KOHM 0603 1LN	3929
MMZ0603Y471CTD25 TDK Corporation	CHIP BEADS FOR AUTOMOTIVE, FOR G	30000
MMZ0603F220CTD25 TDK Corporation	CHIP BEADS FOR AUTOMOTIVE, FOR G	30000
KPZ1608SHR221ATD25 TDK Corporation	FERRITE BEAD 220 OHM 0603 1LN	9145
MMZ0402S100CT000 TDK Corporation	FERRITE BEAD 10 OHM 01005 1LN	925
MMZ1005A102ETD25 TDK Corporation	FERRITE BEAD 1 KOHM 0402 1LN	34
MPZ1005AFZ300VT000 TDK Corporation	FERRITE BEAD 30 OHM 0402 1LN	19460
MMZ1608A152ETA00 TDK Corporation	FERRITE BEAD 1.5 KOHM 0603 1LN	2513
MPZ2012S221ATD25 TDK Corporation	FERRITE BEAD 220 OHM 0805 1LN	0
MMZ0603S102ET000 TDK Corporation	FERRITE BEAD 1 KOHM 0201 1LN	129748
KPZ1608SHR300ATDH5 TDK Corporation	FERRITE BEAD 30 OHM 0603 1LN	0

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems