Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
HI1806T600R-10 Laird - Performance Materials	FERRITE BEAD 60 OHM 1806 1LN	388
BK1005HS431-TV TAIYO YUDEN	FERRITE BEAD 430 OHM 0402 1LN	4365
BLM18KG471BH1D TOKO / Murata	FERRITE BEAD 470 OHM 0603 1 LN	31709
BLM18KG221WH1D TOKO / Murata	FB SMD 0603INCH 220OHM POWRTRNAU	3210
MFBM1V1608-500-R PowerStor (Eaton)	FIXED IND 50 3000MA 0603	0
BK20104L330-T TAIYO YUDEN	FERRITE BEAD 33 OHM 0804 4LN	0
MMZ0603Y750CTD25 TDK Corporation	CHIP BEADS FOR AUTOMOTIVE, FOR G	30000
74275043 Würth Elektronik Midcom	WE-UKW EMI SUPPRESSION 6-HOLE FE	0
BK0603HR102-T TAIYO YUDEN	FERRITE BEAD 1 KOHM 0201 1LN	12419
MMZ1005D330CT000 TDK Corporation	FERRITE BEAD 33 OHM 0402 1LN	26276
74279271 Würth Elektronik Midcom	FERRITE BEAD 120 OHM 0402 1LN	19373
BBSY00100505300Y00 Chilisin Electronics	EMI BEAD FILETER	20000
ACML-0805-260-T Abracon	FERRITE BEAD 26 OHM 0805 1LN	0
BLM03HD471SN1D TOKO / Murata	FERRITE BEAD 470 OHM 0201 1LN	154999
BLM18PG121SZ1D TOKO / Murata	FERRITE BEAD 120 OHM 0603 1LN	15550
BBPY00201209300Y00 Chilisin Electronics	EMI BEAD FILETER	7819
ILBB1806ER101V Vishay / Dale	FERRITE BEAD 100 OHM 1806 1LN	0
MMZ0603S471CTD25 TDK Corporation	CHIP BEADS FOR AUTOMOTIVE, FOR G	29489
MMZ0603Y241CT000 TDK Corporation	FERRITE BEAD 240 OHM 0201 1LN	3785
ILHB1806ER600V Vishay / Dale	FERRITE BEAD 60 OHM 1806 1LN	0

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems