Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
Z0603C431CSMST KEMET	SIGNAL LINE EMI FERRITE CHIP BEA	4000
HF70ACB322513-TD25 TDK Corporation	FERRITE BEAD 52 OHM 1210 1LN	4000
29F0428-0T0-10 Laird - Performance Materials	FERRITE BEAD 342 OHM 8THD 4LN	0
ILHB0603ER600V Vishay / Dale	FERRITE BEAD 60 OHM 0603 1LN	0
NFZ2MSM601SN10L TOKO / Murata	FERRITE BEAD 600 OHM 0806 1LN	0
2506036007Z0 Fair-Rite Products Corp.	FERRITE BEAD 0603 1LN	9529
MMZ1005S601AT000 TDK Corporation	FERRITE BEAD 600 OHM 0402 1LN	6288
NFZ5BBW170LZ10L TOKO / Murata	FERRITE BEAD 17 OHM 2020 1LN	0
FBMH1608HM470-T TAIYO YUDEN	FERRITE BEAD 47 OHM 0603 1LN	97758
MFBW1V1608-310-R PowerStor (Eaton)	FIXED IND 31 1000MA 0603	4552
BLM15AG121SH1D TOKO / Murata	FERRITE BEAD 120 OHM 0402 1LN	23264
Z0603C152DSMST KEMET	SIGNAL LINE EMI FERRITE CHIP BEA	3975
BBSY00100505121Y00 Chilisin Electronics	EMI BEAD FILETER	9524
782633620 Würth Elektronik Midcom	FERRITE BEAD 62 OHM 0603 1LN	511
7427927121 Würth Elektronik Midcom	FERRITE BEAD 220 OHM 0402 1LN	18654
HZ0603A182R-10 Laird - Performance Materials	FERRITE BEAD 1.8 KOHM 0603 1LN	0
BLM18KG101WH1D TOKO / Murata	FB SMD 0603INCH 100OHM POWRTRNAU	2093
FBMJ4516HL230NT TAIYO YUDEN	FERRITE BEAD 23 OHM 1806 1LN	0
BLM03PG330SN1D TOKO / Murata	FERRITE BEAD 33 OHM 0201 1LN	0
BLM18KG221SN1D TOKO / Murata	FERRITE BEAD 220 OHM 0603 1LN	271673

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems