Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
Z0603C241ASMST KEMET	SIGNAL LINE EMI FERRITE CHIP BEA	8000
MU1005-600Y J.W. Miller / Bourns	FERRITE BEAD 60 OHM 0402 1LN	0
BK1608HM102-T TAIYO YUDEN	FERRITE BEAD 1 KOHM 0603 1LN	27052
BLM41PG181SN1L TOKO / Murata	FERRITE BEAD 180 OHM 1806 1LN	18901
HI0603P600R-10 Laird - Performance Materials	FERRITE BEAD 60 OHM 0603 1LN	1907
2512061026Y1 Fair-Rite Products Corp.	MULTI-LAYER CHIP BEAD	0
NFZ32BW320HN10L TOKO / Murata	FERRITE BEAD 32 OHM 2SMD 1LN	1966
BLM21AG601SN1D TOKO / Murata	FERRITE BEAD 600 OHM 0805 1LN	16390
FB20019-4B-RC J.W. Miller / Bourns	FERRITE BEAD 450 OHM AXIAL 1LN	569
BLM18BD252SZ1D TOKO / Murata	FERRITE BEAD 2.5 KOHM 0603 1LN	1357
BLM18PG331SN1D TOKO / Murata	FERRITE BEAD 330 OHM 0603 1LN	21565
ILAS1206ER301V Vishay / Dale	FERRITE BEAD 300 OHM 1206 4LN	0
BBPY00100505601Y00 Chilisin Electronics	EMI BEAD FILETER	8846
742792608 Würth Elektronik Midcom	FERRITE BEAD 47 OHM 0603 1LN	3083
MFBW1V1608-000-R PowerStor (Eaton)	FIXED IND 0 1000MA 0603	0
MPZ1005D330ET000 TDK Corporation	FERRITE BEAD 33 OHM 0402 1LN	8431
BK1608HM241-T TAIYO YUDEN	FERRITE BEAD 240 OHM 0603 1LN	4890
BLM21AG102SN1D TOKO / Murata	FERRITE BEAD 1 KOHM 0805 1LN	56675
SMB2.5R-2 API Delevan	FERRITE BEAD 490 OHM 2SMD 1LN	7874
2518121218Y3 Fair-Rite Products Corp.	MULTI-LAYER CHIP BEAD	0

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems