Thermal - Pads, Sheets

Part Number	Description / PDF	Quantity
60-11-D397-T441-08 Parker Chomerics	CHO-THERM T441 TO-220 0.008"	490
69-13-42348-T412 Parker Chomerics	THERMATTACH T412 28X28MM 1=8	317
62-04-0912-974 Parker Chomerics	THERM-A-GAP 974 9X12X0.040"	19
69-11-42341-T558 Parker Chomerics	THERM PAD 152.4X152.4MM GRAY	130
62-08-0909-A579 Parker Chomerics	THERM-A-GAP A579 9X9X0.080"	8
60-12-4997-1671 Parker Chomerics	CHO-THERM 1671 TO-66 W/ADH	475
62-15-0808-1671 Parker Chomerics	CHO-THERM 1671 8X8" W.ADH	37
60-11-D401-1674 Parker Chomerics	CHO-THERM 1674 TO-220 0.010"	317
60-12-4661-1671 Parker Chomerics	CHO-THERM 1671 DO-5 W/ADH	472
60-11-4997-1671 Parker Chomerics	CHO-THERM 1671 TO-66	404
61-02-0909-HCS10G Parker Chomerics	THERM-A-GAP HCS10G 9X9X0.020"	27
60-11-5791-1674 Parker Chomerics	CHO-THERM 1674 TO-220 0.010"	0
60-12-4511-T441-08 Parker Chomerics	CHO-THERM T441 TO-3 0.008" ADH	425
69-11-42337-T725 Parker Chomerics	THERM PAD 28X28MM PINK 1=8	0
69-11-42354-1674 Parker Chomerics	CHO-THERM 1674 8X8" 0.010"	3
69-11-42335-T558 Parker Chomerics	THERM PAD 14X14MM GRAY 1=16	837
69-11-42338-T558 Parker Chomerics	THERM PAD 28X28MM GRAY 1=8	382
69-13-42349-T411 Parker Chomerics	THERMATTACH T411 6X6"	96
69-13-42343-T418 Parker Chomerics	THERMATTACH T418 14X14MM 1=16	837
60-11-D394-1671 Parker Chomerics	CHO-THERM 1671 TO-220	395

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Silicone-Based Pads	High flexibility, low compression force, dielectric insulation	Smartphones, laptops, LED lighting
Non-Silicone Pads	Lower cost, reduced silicone oil migration	Power supplies, industrial controls
Phase Change Materials (PCM)	Softening at operational temperatures for better contact	CPUs, GPUs, servers
Metal-Backed Pads	Aluminum/copper reinforcement for structural support	EV battery packs, high-power lasers
Graphite Sheets	Ultra-thin, anisotropic heat spreading	5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

Parameter	Importance
Thermal Conductivity (W/m K)	Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)	Impacts contact resistance and compression force
Operating Temperature Range ( C)	Determines material stability under thermal stress
Hardness (Shore 00)	Affects conformability to surfaces
Adhesion Strength (N/mm )	Critical for mechanical fixation
Electrical Insulation (kV/mm)	Essential for high-voltage applications

5. Application Fields

Major industries include:

Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
Telecom: 5G base stations (Huawei AAU modules), optical transceivers
Industrial: CNC machines, medical imaging equipment
Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

Manufacturer	Representative Product	Key Specification
Laird Performance Materials	THERM-A-GAP GEL 15	15 W/m K, 0.5mm thickness
Bergquist (Henkel)	Gap Pad 1500S	Silicone-free, 8.0 W/m K
3M	5595 PCM	Phase change at 55 C, 12 W/m K
Fujipoly	SARCON Matrix MG	Metal-gel hybrid, 20 W/m K
Momentive	TSE 3045	Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
Green Manufacturing: Water-based silicone formulations reducing VOC emissions
Integrated Solutions: Combination pads with embedded temperature sensors