Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
EYG-Y0912QN4P

EYG-Y0912QN4P

Panasonic

THERM PAD 115MMX90MM W/ADH WHITE

0

EYG-R1014ZLDB

EYG-R1014ZLDB

Panasonic

THERM PAD 138X98X0.25MM GRAY

10

EYG-S1116ZLMA

EYG-S1116ZLMA

Panasonic

THERM PAD 158.80MMX118MM GRAY

4

EYG-A091204V

EYG-A091204V

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

10

EYG-A091203PA

EYG-A091203PA

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

0

EYG-A091205M

EYG-A091205M

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

17

EYG-A091205A

EYG-A091205A

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

6

EYG-TF0F0A10A

EYG-TF0F0A10A

Panasonic

GRAPHITE PAD 150X150MM, 1.0MM TH

62

EYG-R0309ZLAK

EYG-R0309ZLAK

Panasonic

THERM PAD 29.5X89.5X0.25MM GRAY

30

EYG-T3535A10A

EYG-T3535A10A

Panasonic

THERM PAD 35MMX35MM W/ADH BLACK

363

EYG-A091204DM

EYG-A091204DM

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

19

EYG-A091201RV

EYG-A091201RV

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

0

EYG-A121804F

EYG-A121804F

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

0

EYG-R0918ZRX2

EYG-R0918ZRX2

Panasonic

THERM PAD 90X180X0.35MM GRAY

6

EYG-R0411ZRWJ

EYG-R0411ZRWJ

Panasonic

THERM PAD 43X105.5X0.35MM GRAY

0

EYG-S182310DP

EYG-S182310DP

Panasonic

THERM PAD 230MMX180MM GRAY

53

EYG-T7070A25A

EYG-T7070A25A

Panasonic

THERM PAD 70MMX70MM W/ADH BLACK

0

EYG-Y0912QN3P

EYG-Y0912QN3P

Panasonic

THERM PAD 115MMX90MM W/ADH WHITE

0

EYG-N0912QD6S

EYG-N0912QD6S

Panasonic

THERM PAD 115MMX90MM W/ADH WHITE

8

EYG-R0509ZRGK

EYG-R0509ZRGK

Panasonic

THERM PAD 46X92X0.35MM GRAY

20

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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