Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
TGF35-07870787-118

TGF35-07870787-118

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM GREEN

0

TGF60-07870787-118

TGF60-07870787-118

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM GRAY

0

TGF45-07870787-059

TGF45-07870787-059

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM

0

TGF40-07870787-079

TGF40-07870787-079

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM PURPLE

0

TGF20SF-07870787-020

TGF20SF-07870787-020

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM GRAY

0

TGF20-07870787-059

TGF20-07870787-059

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM BLUE

0

TGF15-07870787-118

TGF15-07870787-118

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM PINK

0

TGF20SF-07870787-059

TGF20SF-07870787-059

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM GRAY

0

TGF35-07870787-079

TGF35-07870787-079

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM GREEN

0

TEI10-009-ROLL

TEI10-009-ROLL

Leader Tech Inc.

THERM PAD 50MX300MM GRAY

0

TGF40-07870787-059

TGF40-07870787-059

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM PURPLE

0

TGF10S-07870787-118

TGF10S-07870787-118

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM WHITE

0

TGF60-07870787-079

TGF60-07870787-079

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM GRAY

0

TGF45-07870787-118

TGF45-07870787-118

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM

0

TGF20-07870787-079

TGF20-07870787-079

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM BLUE

0

TGF60-07870787-059

TGF60-07870787-059

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM GRAY

0

TGF30SF-07870787-079

TGF30SF-07870787-079

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM GRAY

0

TGF280L

TGF280L

Leader Tech Inc.

THERM PAD 298.45MMX200.03MM GRAY

0

TEI10-007-ROLL

TEI10-007-ROLL

Leader Tech Inc.

THERM PAD 50MX300MM GRAY

0

TGF150D

TGF150D

Leader Tech Inc.

THERM PAD 298.45MMX200.03MM GRAY

0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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