Thermal - Pads, Sheets

Part Number	Description / PDF	Quantity
AF500-101005 CUI Devices	THERM PAD 10MMX10MM 1 SHT=800PC	11
SF600G-303005 CUI Devices	THERMAL INTERFACE MATERIAL, SF60	0
AF100-204005 CUI Devices	THERM PAD 20MMX40MM 1 SHEET=90PC	4
SF600G-313005 CUI Devices	THERMAL INTERFACE MATERIAL, SF60	0
SF600-707005 CUI Devices	THERMAL INTERFACE MATERIAL, SF60	0
SF600-404005 CUI Devices	THERMAL INTERFACE MATERIAL, SF60	0
SF100-204005 CUI Devices	THERM PAD 20MMX40MM 1 SHEET=81PC	73
AF500-153005 CUI Devices	THERM PAD 15MMX30MM 1 SHEET=92PC	15
AF100-303005 CUI Devices	THERM PAD 30MMX30MM 1 SHEET=98PC	11
AF200-265005 CUI Devices	THERMAL INTERFACE MATERIAL, AF20	0
SF100S-404005 CUI Devices	THERMAL INTERFACE MATERIAL, SF10	0
AF500-303005 CUI Devices	THERM PAD 30MMX30MM 1 SHEET=98PC	15
SF500-313005 CUI Devices	THERMAL INTERFACE MATERIAL, SF50	0
SF100S-414505 CUI Devices	THERMAL INTERFACE MATERIAL, SF10	0
SF600-153005 CUI Devices	THERMAL INTERFACE MATERIAL, SF60	0
AF200-101005 CUI Devices	THERMAL INTERFACE MATERIAL, AF20	0
SF400-313005 CUI Devices	THERM PAD 30MMX31.25MM 1 SHT=72	5
AF100-505005 CUI Devices	THERM PAD 50MMX50MM 1 SHEET=32PC	10
SF500-505005 CUI Devices	THERMAL INTERFACE MATERIAL, SF50	0
SF100S-265005 CUI Devices	THERMAL INTERFACE MATERIAL, SF10	0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Silicone-Based Pads	High flexibility, low compression force, dielectric insulation	Smartphones, laptops, LED lighting
Non-Silicone Pads	Lower cost, reduced silicone oil migration	Power supplies, industrial controls
Phase Change Materials (PCM)	Softening at operational temperatures for better contact	CPUs, GPUs, servers
Metal-Backed Pads	Aluminum/copper reinforcement for structural support	EV battery packs, high-power lasers
Graphite Sheets	Ultra-thin, anisotropic heat spreading	5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

Parameter	Importance
Thermal Conductivity (W/m K)	Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)	Impacts contact resistance and compression force
Operating Temperature Range ( C)	Determines material stability under thermal stress
Hardness (Shore 00)	Affects conformability to surfaces
Adhesion Strength (N/mm )	Critical for mechanical fixation
Electrical Insulation (kV/mm)	Essential for high-voltage applications

5. Application Fields

Major industries include:

Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
Telecom: 5G base stations (Huawei AAU modules), optical transceivers
Industrial: CNC machines, medical imaging equipment
Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

Manufacturer	Representative Product	Key Specification
Laird Performance Materials	THERM-A-GAP GEL 15	15 W/m K, 0.5mm thickness
Bergquist (Henkel)	Gap Pad 1500S	Silicone-free, 8.0 W/m K
3M	5595 PCM	Phase change at 55 C, 12 W/m K
Fujipoly	SARCON Matrix MG	Metal-gel hybrid, 20 W/m K
Momentive	TSE 3045	Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
Green Manufacturing: Water-based silicone formulations reducing VOC emissions
Integrated Solutions: Combination pads with embedded temperature sensors