Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
TG-AH486-45-25-4.5-1A

TG-AH486-45-25-4.5-1A

t-Global Technology

THERM PAD 45MMX25MM W/ADH GRAY

0

TG-A6200-107-53-3.0

TG-A6200-107-53-3.0

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THERMAL PAD 107X53MM BLUE

0

TG-APC93-20-20-3.0-0

TG-APC93-20-20-3.0-0

t-Global Technology

THERM PAD 20MMX20MM GRAY

66

TG-AL375-640-320-2.0-1A

TG-AL375-640-320-2.0-1A

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THERM PAD 640MMX320MM W/ADH GRAY

1

TG-A6200-5-5-1.5

TG-A6200-5-5-1.5

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THERM PAD A6200 5X5X1.5MM

470

TG-A6200-100-100-4.0

TG-A6200-100-100-4.0

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SILICONE THERMAL PAD 100X100X4.0

39

TG-A6200-10-10-5.0

TG-A6200-10-10-5.0

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THERM PAD A6200 10X10X5MM

61

TG-A3500-20-20-1.0

TG-A3500-20-20-1.0

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THERM PAD A3500 20X20X1MM

55

TG-AH486-640-320-1.0-0

TG-AH486-640-320-1.0-0

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THERM PAD 640MMX320MM GRAY

5

TG-A2030-320-320-1.0

TG-A2030-320-320-1.0

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THERM PAD 320MMX320MM WHITE

0

TG-A2200-300-150-1.0

TG-A2200-300-150-1.0

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SILICONE THERMAL PAD 300X150X1.0

8

TI900-25-25-0.12-0

TI900-25-25-0.12-0

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THERM PAD 25MMX25MM WHITE

173

TG-APC93-320-320-0.5-0

TG-APC93-320-320-0.5-0

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NON-SILICONE THERMAL PAD 320X320

0

TG-AH486-150-150-10.0-1A

TG-AH486-150-150-10.0-1A

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THERM PAD 150MMX150MM W/ADH GRAY

0

LI98-50M-320-0.25

LI98-50M-320-0.25

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THERM PAD 50MX320MM W/ADH WHITE

0

TG-A3500-25-25-2.0

TG-A3500-25-25-2.0

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THERM PAD A3500 25X25X2MM

9

TG-AH486-45-25-4.0-1A

TG-AH486-45-25-4.0-1A

t-Global Technology

THERM PAD 45MMX25MM W/ADH GRAY

226

TG-AL373-100-100-1.0-0

TG-AL373-100-100-1.0-0

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THERM PAD 100MMX100MM YELLOW

0

TG-A2030-19.5-12.7-0.5

TG-A2030-19.5-12.7-0.5

t-Global Technology

THERM PAD 19.5MMX12.7MM WHITE

3285

TG-A373S-150-150-3.0-0

TG-A373S-150-150-3.0-0

t-Global Technology

THERM PAD 150MMX150MM YELLOW

17

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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