Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
PC96-288-192-0.25

PC96-288-192-0.25

t-Global Technology

THERM PAD 288MMX192MM

26

TG-A486A-300-300-2.0-1A

TG-A486A-300-300-2.0-1A

t-Global Technology

THERM PAD 300MMX300MM W/ADH

0

TG-A486A-150-150-0.5-0

TG-A486A-150-150-0.5-0

t-Global Technology

THERM PAD 150MMX150MM HENNA

54

TG-AL375-320-320-5.0-0

TG-AL375-320-320-5.0-0

t-Global Technology

THERM PAD 320MMX320MM GRAY

0

TG-A1660-10-10-0.5

TG-A1660-10-10-0.5

t-Global Technology

THERM PAD A1660 10X10X0.5MM

0

TG-AL373-40-33-1.0-0

TG-AL373-40-33-1.0-0

t-Global Technology

THERM PAD 40MMX33MM YELLOW

218

TG-A6050-150-150-1.5

TG-A6050-150-150-1.5

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TG6050 150X150X1.5MM

25

TG-AH482-640-320-10.0-0

TG-AH482-640-320-10.0-0

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THERM PAD 640MMX320MM RED

2

TG-A486C-320-320-10.0-0

TG-A486C-320-320-10.0-0

t-Global Technology

THERM PAD 320MMX320MM GRAY

0

TG-A1450-5-5-2.0

TG-A1450-5-5-2.0

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THERM PAD A1450 5X5X2MM

315

LI98-28-28-0.25

LI98-28-28-0.25

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THERM PAD 28MMX28MM W/ADH WHITE

8259

TG-A2030-150-150-2.0

TG-A2030-150-150-2.0

t-Global Technology

THERM PAD 150MMX150MM WHITE

0

TG-APC94-320-320-4.0-0

TG-APC94-320-320-4.0-0

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NON-SILICONE THERMAL PAD 320X320

0

TI900-10-10-0.12-0

TI900-10-10-0.12-0

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THERM PAD 10MMX10MM WHITE

4675

TG-A20KX-285-190-3.0

TG-A20KX-285-190-3.0

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THERMAL PAD 285X190MM DARK GREY

10

TG-A6200-5-5-1.0

TG-A6200-5-5-1.0

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THERMAL PAD 5X5MM BLUE

4750

TG-A6200F-160-160-5.0

TG-A6200F-160-160-5.0

t-Global Technology

THERMAL PAD 160X160MM BLUE

1

TG-A1450-15-15-2.0

TG-A1450-15-15-2.0

t-Global Technology

THERM PAD A1450 15X15X2MM

297

TG-A2200-150-150-1.0

TG-A2200-150-150-1.0

t-Global Technology

SILICONE THERMAL PAD 150X150X1.0

25

TG-APC93-10-5-1.0-0

TG-APC93-10-5-1.0-0

t-Global Technology

THERM PAD 10MMX5MM GRAY

240

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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